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Millimeter-Wave Integrated Circuits PDF

286 Pages·1996·10.924 MB·English
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Millimeter-Wave Integrated Circuits This page intentionally left blank Eoin Carey Sverre Lidholm Millimeter-Wave Integrated Circuits Springer eBookISBN: 0-387-23666-X Print ISBN: 0-387-23665-1 ©2005 Springer Science + Business Media, Inc. Print ©2005 Springer Science + Business Media, Inc. Boston All rights reserved No part of this eBook maybe reproducedor transmitted inanyform or byanymeans,electronic, mechanical, recording, or otherwise, without written consent from the Publisher Created in the United States of America Visit Springer's eBookstore at: http://ebooks.kluweronline.com and the Springer Global Website Online at: http://www.springeronline.com Dedication To our wives, Aileen and Phil. This page intentionally left blank Contents Dedication v Preface xiii Acknowledgments xv 1. An Introduction to mm-Wave Integrated Circuits 1 1.1 Introduction 1 1.2 Motivation for mm-Waves 1 1.3 Motivation for Monolithic GaAs Integrated Circuits 2 1.4 Motivation for Improved Fundamental Circuit Understanding 3 1.5 Key Components 3 1.6 Structure of this Work 4 2. High Frequency Materials and Technology 7 2.1 Introduction 7 2.2 Electrical Characteristics of Ideal High-Frequency Semiconductor Material 8 viii Millimeter-Wave Integrated Circuits 2.3 Electrical Characteristics of Real High Frequency Materials 9 2.3.1 Gallium Arsenide (GaAs) 10 2.3.2 GaAs / Si Comparison 10 2.3.3 InP 15 2.3.4 Other III-V Compound Semiconductors 16 2.3.5 InGaAs 17 2.4 III-V Compound Semiconductor Fabrication Techniques 18 2.5 GaAs Fabrication Technology 19 2.5.1 Crystal Growth 19 2.5.2Epitaxy 20 2.5.3 Ion Implantation 22 2.5.4 GaAs Dopants 24 2.5.5 Schottky and Ohmic Contacts 24 2.6 Considerations for the Realisation of Effective Monolithic mm- Wave Circuit Layouts 26 2.6.1 Schematic Optimisation Consistent with Good mm-Wave Layout Practice 26 2.6.2 Consideration of Foundry Element Limitations 27 2.6.3 Probing Considerations 27 2.6.4 Dicing/Sawing Considerations 29 2.6.5 Packaging Impact on Performance 30 2.7 Future Trends 30 3.HighFrequency Devices 33 3.1 Introduction 33 3.2 High Frequency Devices 34 3.2.1 Background 34 3.2.2 Schottky Diode 35 3.2.3 MESFET 46 3.2.4 Modern FET Variants 53 3.2.5FET Equivalent Circuit 62 3.2.6 Fundamental FET Circuit Relationships 64 3.2.7 GaAs Hetero-Junction Bipolar Transistor 67 3.2.8 Silicon based High Frequency Devices and Circuits 70 3.3 The Future… 71

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