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MECHANICAL ALLOYING FOR FABRICATION OF ADVANCED ENGINEERING MATERIALS by M. Sherif El-Eskandarany Al Azhar University Cairo, Egypt NOYES PUBLICATIONS WILLIAM ANDREW PUBLISHING Norwich, New York, U.S.A. JMR 3-Jul-01 Copyright © 2001 by Noyes Publications No part of this book may be reproduced or utilized in any form or by any means, elec- tronic or mechanical, including photocopying, recording or by any information storage and retrieval system, without permission in writing from the Publisher. Library of Congress Catalog Card Number: ISBN: 0-8155-1462-X Printed in the United States Published in the United States of America by Noyes Publications / William Andrew Publishing 13 Eaton Avenue Norwich, NY 13815 1-800-932-7045 www.williamandrew.com www.knovel.com 10 9 8 7 6 5 4 3 2 1 Library of Congress Cataloging-in-Publication Data El-Eskandarany, M. Sherif. Mechanical alloying for fabrication of advanced engineering materials / Dr. M. Sherif El-Eskandarany. p. cm. Includes index. ISBN 0-8155-1462-X (alk. paper) 1. Mechanical alloying. I. Title TN698 .E44 2001 669'.95--dc21 2001032983 MATERIALS SCIENCE AND PROCESS TECHNOLOGY SERIES Series Editors Gary E. McGuire, Microelectronics Center of North Carolina Stephen M. Rossnagel, IBM Thomas J. Watson Research Center Rointan F. Bunshah, University of California, Los Angeles (1927–1999), founding editor Electronic Materials and Process Technology CHARACTERIZATION OF SEMICONDUCTOR MATERIALS, Volume 1: edited by Gary E. McGuire CHEMICAL VAPOR DEPOSITION FOR MICROELECTRONICS: by Arthur Sherman CHEMICAL VAPOR DEPOSITION OF TUNGSTEN AND TUNGSTEN SILICIDES: by John E. J. Schmitz CHEMISTRY OF SUPERCONDUCTOR MATERIALS: edited by Terrell A. Vanderah CONTACTS TO SEMICONDUCTORS: edited by Leonard J. Brillson DIAMOND CHEMICAL VAPOR DEPOSITION: by Huimin Liu and David S. Dandy DIAMOND FILMS AND COATINGS: edited by Robert F. Davis DIFFUSION PHENOMENA IN THIN FILMS AND MICROELECTRONIC MATERIALS: edited by Devendra Gupta and Paul S. Ho ELECTROCHEMISTRY OF SEMICONDUCTORS AND ELECTRONICS: edited by John McHardy and Frank Ludwig ELECTRODEPOSITION: by Jack W. Dini HANDBOOK OF CARBON, GRAPHITE, DIAMONDS AND FULLERENES: by Hugh O. Pierson HANDBOOK OF CHEMICAL VAPOR DEPOSITION, Second Edition: by Hugh O. Pierson HANDBOOK OF COMPOUND SEMICONDUCTORS: edited by Paul H. Holloway and Gary E. McGuire HANDBOOK OF CONTAMINATION CONTROL IN MICROELECTRONICS: edited by Donald L. Tolliver HANDBOOK OF DEPOSITION TECHNOLOGIES FOR FILMS AND COATINGS, Second Edition: edited by Rointan F. Bunshah HANDBOOK OF HARD COATINGS: edited by Rointan F. Bunshah HANDBOOK OF ION BEAM PROCESSING TECHNOLOGY: edited by Jerome J. Cuomo, Stephen M. Rossnagel, and Harold R. Kaufman HANDBOOK OF MAGNETO-OPTICAL DATA RECORDING: edited by Terry McDaniel and Randall H. Victora HANDBOOK OF MULTILEVEL METALLIZATION FOR INTEGRATED CIRCUITS: edited by Syd R. Wilson, Clarence J. Tracy, and John L. Freeman, Jr. HANDBOOK OF PLASMA PROCESSING TECHNOLOGY: edited by Stephen M. Rossnagel, Jerome J. Cuomo, and William D. Westwood HANDBOOK OF POLYMER COATINGS FOR ELECTRONICS, Second Edition: by James Licari and Laura A. Hughes HANDBOOK OF REFRACTORY CARBIDES AND NITRIDES: by Hugh O. Pierson HANDBOOK OF SEMICONDUCTOR SILICON TECHNOLOGY: edited by William C. O’Mara, Robert B. Herring, and Lee P. Hunt HANDBOOK OF SEMICONDUCTOR WAFER CLEANING TECHNOLOGY: edited by Werner Kern HANDBOOK OF SPUTTER DEPOSITION TECHNOLOGY: by Kiyotaka Wasa and Shigeru Hayakawa v vi Series HANDBOOK OF THIN FILM DEPOSITION PROCESSES AND TECHNIQUES: edited by Klaus K. Schuegraf HANDBOOK OF VACUUM ARC SCIENCE AND TECHNOLOGY: edited by Raymond L. Boxman, Philip J. Martin, and David M. Sanders HANDBOOK OF VLSI MICROLITHOGRAPHY: edited by William B. Glendinning and John N. Helbert HIGH DENSITY PLASMA SOURCES: edited by Oleg A. Popov HYBRID MICROCIRCUIT TECHNOLOGY HANDBOOK, Second Edition: by James J. Licari and Leonard R. Enlow IONIZED-CLUSTER BEAM DEPOSITION AND EPITAXY: by Toshinori Takagi MOLECULAR BEAM EPITAXY: edited by Robin F. C. Farrow SEMICONDUCTOR MATERIALS AND PROCESS TECHNOLOGY HANDBOOK: edited by Gary E. McGuire ULTRA-FINE PARTICLES: edited by Chikara Hayashi, R. Ueda and A. Tasaki WIDE BANDGAP SEMICONDUCTORS: edited by Stephen J. Pearton Other Related Titles ADVANCED CERAMIC PROCESSING AND TECHNOLOGY, Volume 1: edited by Jon G. P. Binner CEMENTED TUNGSTEN CARBIDES: by Gopal S. Upadhyaya CERAMIC CUTTING TOOLS: edited by E. Dow Whitney CERAMIC FILMS AND COATINGS: edited by John B. Wachtman and Richard A. Haber CORROSION OF GLASS, CERAMICS AND CERAMIC SUPERCONDUCTORS: edited by David E. Clark and Bruce K. Zoitos FIBER REINFORCED CERAMIC COMPOSITES: edited by K. S. Mazdiyasni FRICTION AND WEAR TRANSITIONS OF MATERIALS: by Peter J. Blau HANDBOOK OF ANALYTICAL TECHNIQUES IN CONCRETE SCIENCE AND TECHNOLOGY; Principles, Techniques, and Applications: edited by V. S. Ramachandran and James J. Beaudoin HANDBOOK OF CERAMIC GRINDING AND POLISHING: edited by Ioan D. Marinescu, Hans K. Tonshoff, and Ichiro Inasaki HANDBOOK OF HYDROTHERMAL TECHNOLOGY: edited by K. Byrappa and Masahiro Yoshimura HANDBOOK OF INDUSTRIAL REFRACTORIES TECHNOLOGY: by Stephen C. Carniglia and Gordon L. Barna HANDBOOK OF PHYSICAL VAPOR DEPOSITION (PVD) PROCESSING: by Donald M. Mattox MECHANICAL ALLOYING FOR FABRICATION OF ADVANCED ENGINEERING MATERIALS: by M. Sherif El-Eskandarany SHOCK WAVES FOR INDUSTRIAL APPLICATIONS: edited by Lawrence E. Murr SOL-GEL TECHNOLOGY FOR THIN FILMS, FIBERS, PREFORMS, ELECTRONICS AND SPECIALTY SHAPES: edited by Lisa C. Klein SOL-GEL SILICA: by Larry L. Hench SPECIAL MELTING AND PROCESSING TECHNOLOGIES: edited by G. K. Bhat SUPERCRITICAL FLUID CLEANING: edited by John McHardy and Samuel P. Sawan JMR- 3-Jul-01 NOTICE To the best of our knowledge the information in this publication is accurate; however the Publisher does not assume any responsibility or liability for the accuracy or completeness of, or consequences arising from, such information. This book is intended for informational purposes only. Mention of trade names or commercial products does not constitute endorsement or recommendation for use by the Publisher. Final determination of the suitability of any information or product for use contemplated by any user, and the manner of that use, is the sole responsibility of the user. We recommend that anyone intending to rely on any recommendation of materials or procedures mentioned in this publication should satisfy himself as to such suitability, and that he can meet all applicable safety and health standards. To Professor Kenji Suzuki You have taught me how to enjoy the experiments and how to be a creative researcher. I owe a debt of gratitude that I cannot entirely repay. Acknowledgment The continual support and encouragement of my family is deeply and sincerely appreciated. Contents 1 Introduction..............................................................................1 1.1 BACKGROUND.................................................................................1 1.2 HISTORY OF STORY OF MECHANICAL ALLOYING....................2 1.3 MILLING ............................................................................................5 1.3.1 Factors Affecting the Mechanical Alloying ...........................6 1.3.1.1 Types of Mills...........................................................7 1.3.1.2 Effect of Ball-to-Powder Weight Ratio................ 14 1.3.1.3 Effect of Milling Atmosphere............................... 16 1.4 MECHANISM OF MECHANICAL ALLOYING............................ 16 1.4.1 Ball-Powder-Ball Collision................................................. 16 1.5 NECESSITY OF MECHANICAL ALLOYING................................ 19 REFERENCES.......................................................................................... 19 2 Fabrication of ODS Alloys....................................................22 2.1 INTRODUCTION AND BACKGROUND....................................... 22 2.2 APPLICATIONS AND EXAMPLES................................................ 24 2.2.1 ODS Ni-Base Superalloys and Fe-Base High-Temperature Alloys..................................................... 24 2.2.1.1 INCONEL MA 754................................................ 25 2.2.1.2 INCONEL MA 6000.............................................. 25 2.2.1.3 INCOLOY MA 956................................................ 27 REFERENCES.......................................................................................... 33 xi xii Mechanical Alloying 3 Fabrication of Nanophase Materials.................................... 34 3.1 INTRODUCTION.............................................................................34 3.2 INFLUENCE OF NANOCRYSTALLINITY ON MECHANICAL PROPERTIES: STRENGTHENING BY GRAIN SIZE REDUCTION ................................................................................... 35 3.3 FORMATION OF NANOCRYSTALLINE MATERIALS BY BALL MILLING TECHNIQUE....................................................... 36 3.3.1 Mechanism(s)........................................................ 37 3.3.2 Selected Examples.................................................38 3.4 CONSOLIDATION OF THE NANOCRYSTALLINE MILLED POWDERS ......................................................................................41 REFERENCES..........................................................................................43 4 Fabrication of Nanocomposite Materials............................. 45 4.1 INTRODUCTION AND BACKGROUND.......................................45 4.2 FABRICATION OF SiCp/Al COMPOSITES BY MECHANICAL SOLID STATE MIXING...................................................................47 4.3 PROPERTIES OF MECHANICALLY SOLID-STATE FABRICATED SiCp/Al COMPOSITES ....................................................................48 4.3.1 X-Ray Analysis.....................................................................48 4.3.2 Morphology and Metallography........................................... 49 4.3.3 TEM Observations................................................................ 52 4.3.4 Consolidation.......................................................................53 4.3.5 Properties.............................................................................56 4.4 MECHANISM OF FABRICATION..................................................58 4.4.1 Formation of Agglomerates Coarse Composite SiCp/Al Powder Particles..................................................... 58 4.4.2 Disintegration of the Agglomerates Composite SiCp/Al Powder Particles..................................................... 59 4.4.3 Formation of Nanocomposite SiCp/Al Powder Particles................................................................................59 4.4.4 Consolidation of Nanocomposite SiCp/Al Powder Particles................................................................................59 REFERENCES..........................................................................................60 5 Mechanically Induced Solid State Carbonization................62 5.1 INTRODUCTION.............................................................................62 5.2 DIFFICULTIES OF PREPARATIONS.............................................. 64 Contents xiii 5.3 FABRICATION OF NANOCRYSTALLINE TiC BY MECHANICAL ALLOYING METHOD ......................................... 65 5.4 PROPERTIES OF MECHANICALLY SOLID-STATE REACTED TiC POWDERS............................................................. 68 5.4.1 Structural Changes with the Milling Time ........................... 68 5.4.2 Morphology.......................................................................... 76 5.4.3 Consolidation....................................................................... 78 5.4.4 Mechanism of Fabrication................................................... 83 5.5 OTHER CARBIDES PRODUCED BY MECHANICAL ALLOYING...................................................................................... 86 5.5.1 Fabrication of β-SiC Powders.............................................. 86 5.5.2 Fabrication of Nanocrystalline WC Powders...................... 88 5.5.3 Fabrication of Nanocrystalline ZrC Powders...................... 89 REFERENCES.......................................................................................... 93 6 Mechanically Induced Gas-Solid Reaction ..........................94 6.1 INTRODUCTION............................................................................. 95 6.2 FABRICATION OF NANOCRYSTALLINE TiN BY REACTIVE BALL MILLING........................................................... 95 6.3 PROPERTIES OF REACTED BALL MILLED TiN POWDERS.... 96 6.3.1 Structural Changes with the Milling Time ........................... 96 6.3.2 Morphology.......................................................................... 98 6.4 MECHANISM OF FABRICATION................................................108 6.4.1 RBM Technique for Preparing TiN Powders.....................108 6.5 OTHER NITRIDES PRODUCED BY RBM..................................109 6.6 FABRICATION OF NANOCRYSTALLINE SOLID SOLUTION NiTiH BY REACTIVE BALL MILLING................... 113 REFERENCES........................................................................................ 117 7 Mechanically Induced Solid-State Reduction....................118 7.1 INTRODUCTION........................................................................... 119 7.2 REDUCTION OF CuO WITH Ti BY ROOM 2 TEMPERATURE ROD MILLING................................................. 119 7.3 PROPERTIES OF ROD MILLED POWDERS..............................120 7.3.1 Structural Changes with the Milling Time .........................120 7.3.2 Metallography.....................................................................125 7.3.3 DTA Measurements............................................................126 7.4 MECHANISM OF MSSR ..............................................................126

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Mechanical alloying for fabrication of advanced engineering materials / HANDBOOK OF CHEMICAL VAPOR DEPOSITION, Second Edition: by Hugh O. Pierson HANDBOOK OF PHYSICAL VAPOR DEPOSITION (PVD) PROCESSING: by Donald M. 1.3.1.2 Effect of Ball-to-Powder Weight Ratio .
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