Lithography [semiconductor mfg]

676 Pages·2010·82.408 MB·English

by  M. Wang

Lithography
Edited by
Michael Wang
Intech
IV

Published by Intech

Intech
Olajnica 19/2, 32000 Vukovar, Croatia

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First published February 2010
Printed in India

Technical Editor: Teodora Smiljanic
Cover designed by Dino Smrekar

Lithography, Edited by Michael Wang
p. cm.
ISBN 978-953-307-064-3
Preface

Lithography, the fundamental fabrication process of semiconductor devices, is playing
a critical role in micro- and nano-fabrications and the revolution in high density integrated
circuits. Traditional optical lithography (photolithography) including contact and project
photolithography has contributed significantly to the semiconductor device advancements.
As the resolution requirement increases for fabrication of finer and smaller components and
devices, the technological dependence on photolithography becomes a serious problem
since the photolithography resolution is restricted by the diffraction limitation of optics.
Reducing the light wavelength from blue to near ultraviolet (UV) and to deep UV is
expected to improve the photolithography resolution, but it is far not enough to catch up
with the pace in resolution demand in integrated circuit fabrication.
To overcome the limitation of photolithography, several advanced lithography
techniques have emerged including maskless laser direct write lithography to eliminate the
needs of photo masks, gray-scale lithography to increase the aspect ratio of the lithographic
features, immersion lithography to increase the numerical aperture of the focusing optics
and thus the resolution, and lithographic techniques based on further reducing wavelengths
for better resolution such as extreme ultraviolet (EUV) lithography and X-ray lithography.
The uses of particle waves like electrons and ion beams have resulted in high resolution
electron beam (E-beam) lithography and ion beam lithography. Besides these wave and
beam based lithographic techniques, there are also direct contact lithography such as soft
lithography using soft molding and nanoimprint lithography with extremely high
resolution. The plasmonic lithography is now in the horizon.
This book is the result of inspirations and contributions from many researchers
worldwide. Although the inclusion of the book chapters may not be a complete
representation of all lithographic arts, it does represent a good collection of contributions in
this field. We hope readers will enjoy reading the book as much as we have enjoyed
bringing the book together. We would like to thank all contributors and authors of book
chapters who entrusted us with their best work. We also acknowledge the great effort of
people who had invested their time in reviewing manuscripts and revision updates.
Each lithographic technique has its advantages and limitations. The conventional
photolithography is not discussed here due to its technological maturity. This book begins
with maskless, gray-scale, and immersion lithography since they are most close to the
conventional photolithography in terms of resolution. Laser nonlinear lithography with
capability of non-flat surface fabrication and character projection lithography are also
included in this chapter. Further chapters present discussion on objective lens, resist
materials and processing, and optical proximity correction.
VI
Part II collects a number of development efforts related to EUV and X-ray lithography.
Because of the use of extreme UV light beam of short wavelength, the lithographic
resolution is greatly enhanced. The selected chapters discuss EUV light sources, mirrors,
and plasma modeling, followed by a chapter discussing X-ray lithography.
Part III of the book is devoted to E-beam lithography which is widely used for high
resolution patterning. Because of very short electron particle wavelength, the E-beam
lithography is one of the most attractive lithographic techniques at this time. Its resolution
limitation comes from unwanted E-beam resist exposure by electron scattering. Great
discussions have been presented in this part of the book including design, exposure control,
and nano-scale fabrication. Simulations on E-beam lithography and ion beam lithography
are also presented.
Apart from above wave and beam lithography, contact lithography is promising for
large area fast patterning of fine features. One of the representing lithographic techniques is
the soft lithography. It uses a soft mold to reproduce needed features through the
techniques of replica molding, micromolding in capillaries, microcontact printing,
microtransfer molding, and microfluidic fabrication. This part IV collects chapters related to
micro optical device fabrication, SiC microstructure fabrication, and soft lithography for
single-object level study of cells and molecules.
Because of appearing nano scale resolution, nanoimprint lithography as a kind of
contact lithography has attracted a great deal of attention in recent years. This part V is
devoted to the nanoimprint lithography. The selected chapters discuss nanoimprint
lithography techniques including hot embossing, UV-nanoimprint lithography, and micro
contact printing. The effect of ultrasonic vibration and molecular dynamics are also
discussed. There are further discussions on three-dimensional patterning and various
applications.
Other emerging lithographic technologies are collected in Chapter VI including
plasmonic lithography, nanosphere lithography, self assembly of nanoparticles, and high
resolution polymer patterning.

Editor
Michael Wang
University of Miami
U.S.A.
Contents

Preface V

I Advanced Photolithography

1. Direct Laser Lithography and Its Applications 001
Hyug-Gyo Rhee

2. High Aspect Ratio Sloping and Curved Structures Fabricated 017
by Proximity and UV-LED Backside Exposure
Yoshinonori Matsumoto

3. Influence of Immersion Lithography on Wafer Edge Defectivity 033
K. Jami, I. Pollentier, S. Vedula and G. Blumenstock

4. Femtosecond Laser Nonlinear Lithography 041
Hiroaki Nishiyama and Yoshinori Hirata

5. Improving the Efficiency of Pattern Extraction 057

for Character Projection Lithography using OPC Optimization
Hirokazu Nosato, Hidenori Sakanashi, Masahiro Murakawa and Tetsuya Higuchi

6. Manufacturing and Investigating Objective Lens 071
for Ultrahigh Resolution Lithography Facilities
N.I. Chkhalo, A.E. Pestov, N.N. Salashchenko and M.N. Toropov

7. Advances in Resist Materials and Processing Technology: 115
Photonic Devices Fabricated by Direct Lithography
of Resist/Colloidal Nanocrystals Blend
Antonio Qualtieri, Tiziana Stomeo, Luigi Martiradonna,
Roberto Cingolani and Massimo De Vittorio

8. A Method for Optical Proximity Correction of Thermal Processes: 131
Orthogonal Functional Method
Sang-Kon Kim
VIII
II EUV and X-Ray Lithography

9. CO Laser Produced Tin Plasma Light Source 161
2
as the Solution for EUV Lithography
Akira Endo

10. Grazing Incidence Mirrors for EUV Lithography 177
Mariana Braic, Mihai Balaceanu and Viorel Braic

11. Steady-state and Time-dependent LPP Modeling 201
White, Dunne, and O’Sullivan

12. Nano-crystalline Diamond Films for X-ray Lithography Mask 227
Linjun Wang, Jian Huang, Ke Tang and Yiben Xia

III E-Beam and Ion Beam Lithography

13. High-energy Electron Beam Lithography 241
for Nanoscale Fabrication
Cen Shawn Wu, Yoshiyuki Makiuchi and ChiiDong Chen

14. Optimal Design and Fabrication of Fine Diffractive 267
Optical Elements Using Proximity Correction
with Electron-beam Lithography
Masato Okano

15. Independent-exposure Method in Electron-beam Lithography 279
Do-Kyun Woo and Sun-Kyu Lee

16. The Interdependence of Exposure and Development Conditions 293
when Optimizing Low-Energy EBL for Nano-Scale Resolution
Mohammad A. Mohammad, Taras Fito, Jiang Chen, Steven Buswell,
Mirwais Aktary, Steven K. Dew and Maria Stepanova

17. Computer Simulation of Processes at Electron and Ion Beam 319
Lithography, Part 1: Exposure Modeling
at Electron and Ion Beam Lithography
Katia Vutova and Georgi Mladenov

18. Computer Simulation of Processes at Electron and Ion Beam 351
Lithography, Part 2: Simulation of Resist Developed Images
at Electron and Ion Beam Lithography
Katia Vutova, Elena Koleva and Georgy Mladenov
IX
IV Soft Lithography

19. Soft Lithographic Fabrication of Micro Optic and Guided Wave Devices 379
Angel Flores and Michael R. Wang

20. Application of Soft Lithography for Nano Functional Devices 403
Shin-Won Kang

21. Fabrication of SiC-based Ceramic Microstructures from Preceramic 427
Polymers with Sacrificial Templates and Softlithography Techniques
Tae-Ho Yoon, Lan-Young Hong and Dong-Pyo Kim

22. Soft Lithography, a Tool to Address Single-Objects Investigations 447
Aline Cerf and Christophe Vieu

V Nanoimprint Lithography

23. Nanoimprint Lithography 457
Hongbo Lan and Yucheng Ding

24. Nanoimprint Lithography 495
Thomas Glinsner and Gerald Kreindl

25. Effect of Applying Ultrasonic Vibration 517
in Hot Embossing and Nanoimprint
Harutaka Mekaru

26. Molecular Dynamics Study on Mold and Pattern Breakages 543
in Nanoimprint Lithography
Masaaki Yasuda, Kazuhiro Tada and Yoshihiko Hirai

27. Three Dimensional Nanoimprint Lithography 557
using Inorganic Electron Beam Resist
Jun Taniguchi and Noriyuki Unno

28. Three-Dimensional Patterning 571
using Ultraviolet Nanoimprint Lithography
Maan M. Alkaisi and Khairudin Mohamed

VI Plasmonic Lithography and Nano Patterning

29. Metal Particle-Surface System for Plasmonic Lithography 597
V. M. Murukeshan, K. V. Sreekanth and Jeun Kee Chua
X
30. Nanosphere Lithography for Nitride Semiconductors 615
Wai Yuen Fu and Hoi Wai Choi

31. Micro- and Nanopatterning of Surfaces Employing Self Assembly 629
of Nanoparticles and Its Application in Biotechnology
and Biomedical Engineering
Claus Burkhardt, Kai Fuchsberger, Wilfried Nisch and Martin Stelzle

32. Strategies for High Resolution Patterning of Conducting Polymers 645
Lin Jiang and Lifeng Chi
Advanced Photolithography