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Lattice Engineering : Technology and Applications PDF

404 Pages·2012·19.685 MB·404 p.\404
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“This is a very good book for graduate and postgraduate students and any scientist who wishes to gain a view of what is possible with semiconductor edited by Shumin Wang heterostructures. It provides a useful reference for anyone who needs to be at the forefront of the work in the topics covered. The contributors are well known in their fields. Readers with a broad interest in epitaxial layers and W devices should find much to be engaged by and informed about.” a n Prof. Mohamed Henini g University of Nottingham, UK “This book includes a timely collection of subjects providing a comprehensive review of some of the most attractive techniques that have been developed to enable the integration of semiconductor crystals with different lattices. The hands-on technological review is supported by a good level of theoretical basis that governs lattice engineering techniques, L such as dislocation formation and strain relaxation. The text will be useful for postgraduate students and also for experienced researchers as a high- A quality source of references.” T Prof. Mircea Guina Tampere University of Technology, Finland T I Semiconductor heterostructures have revolutionized modern information and C communication technology and find wide uses in solar energy, environment, E medicine, and surveillance. One of the biggest challenges is that the lattice constant of heterostructures must be close to that of substrates to ensure high TECHNOLOGY AND APPLICATIONS E crystal quality, which greatly limits the flexibility of combining different materials LATTICE for band engineering. Extensive research has been carried out to seek for solutions N of growing heterostructures on cheap and environment-friendly substrates and monolithically integrating different devices on the same wafers. G I This book provides comprehensive reviews of various technologies used over ENGINEERING N the past several decades to harness lattice mismatch in heterostructures and their applications in electronic and optoelectronic devices. It covers a variety E of innovative methods to eliminate threading dislocations in many important semiconductor materials such as SiGe and III–Vs and nanowires, epitaxial methods E such as molecular beam epitaxy and metal organic vapor phase epitaxy, and devices R such as transistors and lasers. I N Shumin Wang is professor at the Photonics Laboratory, Department of Microtechnology and Nanoscience, Chalmers G University of Technology, Sweden. He received his BSc and MSc from the Department of Physics, Fudan University, China, in 1985 and 1988, respectively, and his PhD from the Department of Physics, Gothenburg University, Sweden, in 1994. Prof. Wang has been working at Chalmers University of Technology since 1994. V235 ISBN-13 978-981-4316-29-3 October22,2012 13:22 PSPBook-9inx6in 00-Shumin-Wang–prelims Publishedby PanStanfordPublishingPte.Ltd. PenthouseLevel,SuntecTower3 8TemasekBoulevard Singapore038988 Email:[email protected] Web:www.panstanford.com BritishLibraryCataloguing-in-PublicationData AcataloguerecordforthisbookisavailablefromtheBritishLibrary. LatticeEngineering:TechnologyandApplications Copyright(cid:2)c 2013PanStanfordPublishingPte.Ltd. Allrightsreserved.Thisbook,orpartsthereof,maynotbereproducedinany form or by any means, electronic or mechanical, including photocopying, recordingoranyinformationstorageandretrievalsystemnowknownorto beinvented,withoutwrittenpermissionfromthepublisher. For photocopying of material in this volume, please pay a copying fee through the Copyright Clearance Center, Inc., 222 Rosewood Drive, Danvers, MA 01923, USA. In this case permission to photocopy is not requiredfromthepublisher. ISBN978-981-4316-29-3(Hardcover) ISBN978-981-4364-25-6(eBook) PrintedintheUSA October22,2012 13:22 PSPBook-9inx6in 00-Shumin-Wang–prelims Contents Preface xi 1 InterfacialMisfitDislocationArrays 1 DianaL.HuffakerandKalyanNunna 1.1 Introduction 2 1.2 LatticeMismatchandDislocations 5 1.2.1 TetragonalDistortion 5 1.2.2 90◦Dislocations 7 1.3 InterfacialMisfitDislocationArrays 9 1.3.1 GaSb/GaAsCompressiveIMFArray 11 1.3.1.1 GrowthofGaSb/GaAsIMF 11 1.3.1.2 Structuralcharacterizationof GaSb/GaAsIMFbyTEM 12 1.3.1.3 2DnetworkofIMFarrays 16 1.3.1.4 Plan-viewTEM-Moire´ fringeanalysis 17 1.3.2 GaAs/GaSbTensileIMFArray 20 1.3.3 GaSbIMFQuantumDots 21 1.3.4 AlSb/SiMismatchEpitaxy 24 1.3.4.1 GrowthofAlSb/SiIMF 26 1.3.4.2 StructuralanalysisofAlSb/SiIMF 27 1.4 StrainDistribution-AtomisticModeling 32 1.5 DefectAnalysisofBulkIMF:GaSb/GaAs 37 1.5.1 EtchPitDensity 38 1.5.2 Plan-ViewTEM 40 1.5.3 X-rayDiffraction 42 1.6 IMF-BasedDevices 44 1.6.1 Near-IREdge-Emitters 44 1.6.2 SurfaceEmittersatNear-IRWavelengths 45 1.6.3 Detectors 47 1.6.4 SolarCells 47 October22,2012 13:22 PSPBook-9inx6in 00-Shumin-Wang–prelims vi Contents 1.7 ElectricalPerformanceofIMF 48 1.7.1 PotentialBarrierattheGaSb/GaSbIMF 49 1.7.2 InterfacialStates 50 1.7.3 CompensationoftheIMF 51 1.8 SummaryofIMF-ArrayTechnique 53 2 CompliantSubstrates 63 ShuminWang 2.1 Introduction 63 2.2 TheoreticalUnderstandingofCompliantSubstrates 65 2.3 PreparationofCompliantSubstrates 70 2.3.1 Free-StandingThinFilms 70 2.3.2 AmorphousOxideBuffer 72 2.3.3 ViscousInterlayer 82 2.3.4 StructureModificationofSubstrateTemplates 86 2.3.5 TwistBonding 87 2.4 FutureOutlook 91 3 PatternedSubstrateEpitaxy 99 HuanZhaoandShuminWang 3.1 Introduction 99 3.2 StrainRelaxationinIdeal2DLatticeMismatched Films 102 3.3 DislocationReductionbyReducedAreaEpitaxy 109 3.4 TechnicalImplementationofPatternedSubstrate Epitaxy 111 3.4.1 EpitaxialLateralOvergrowthand Micro-ChannelEpitaxy 111 3.4.2 ReducedAreaGrowthonEtchedMesas 117 3.4.3 EpitaxialNeckingandAspectRatioTrapping 122 3.5 FutureOutlook 124 4 Low-TemperatureDirectWaferBonding 135 AnkeSanz-Velasco,CristinaRusu,IsabelleFerain, CindyColinge,andMarkGoorsky 4.1 Introduction 136 4.2 CharacterisationMethodsforWaferBonding 138 4.2.1 Non-DestructiveMethods 138 October22,2012 13:22 PSPBook-9inx6in 00-Shumin-Wang–prelims Contents vii 4.2.1.1 FouriertransformIRspectroscopy 139 4.2.1.2 Scanningacousticmicroscopy 139 4.2.1.3 X-raydiffraction 140 4.2.1.4 Ramanspectroscopy 140 4.2.1.5 Surfaceanalysis 140 4.2.2 DestructiveMethods 141 4.2.2.1 Transmissionelectronmicroscopy 141 4.2.2.2 Bondstrengthmeasurement 141 4.2.2.3 Electricalcharacterisation 142 4.3 AnodicBonding 143 4.4 SiliconDirectBonding 145 4.5 Plasma-AssistedWaferBonding 147 4.5.1 Low-PressurePlasmaProcesses 149 4.5.2 AmbientPressurePlasmaProcesses 152 4.5.3 OxygenPlasma-AssistedBondingMechanism 153 4.6 Low-TemperatureFabricationof Germanium-on-InsulatorUsingRemotePlasma ActivationandHydrogenExfoliation 159 4.6.1 GermaniumSurfaceActivationfor Low-TemperatureBonding 160 4.6.2 Low-TemperatureExfoliationofGermanium Layers 166 4.6.3 DefectNucleationandOswaldRipening Mechanism 169 4.6.4 Low-TemperatureFormationof Ge-on-Insulator 174 4.7 Surface-ActivatedBonding 175 4.8 Summary 176 5 HeterostructuresandStrainRelaxationin SemiconductorNanowires 189 FrankGlas 5.1 NanowiresandHeterostructures 190 5.1.1 NanowireGrowthModes 190 5.1.2 HeterostructuresinNanowires 191 5.2 FabricatingHeterostructuresinNanowires 193 5.2.1 AxialHeterostructures 193 5.2.2 RadialHeterostructures 195 October22,2012 13:22 PSPBook-9inx6in 00-Shumin-Wang–prelims viii Contents 5.3 StrainRelaxationinHeterostructures 196 5.3.1 ModesofStrainRelaxation 196 5.3.2 PlayingonDimensionality:QuantumDots, QuantumWiresandNanowires 198 5.4 AxialHeterostructuresinNanowires 199 5.4.1 ElasticRelaxation 199 5.4.2 CalculationoftheElasticRelaxationinAxial Heterostructures 200 5.4.2.1 Methods 200 5.4.2.2 Results 202 5.4.3 CriticalDimensions 204 5.4.3.1 The2Dcase 204 5.4.3.2 Radius-dependentcriticalthickness foranaxialheterostructure 206 5.4.3.3 Criticalradiusforanaxial heterostructure 209 5.5 NanowiresonaMisfittingSubstrate 210 5.6 RadialHeterostructures 212 5.6.1 CoherentElasticRelaxationinRadial Heterostructures 212 5.6.2 CriticalDimensionsforNanowireswithRadial Heterostructures 213 5.7 UsingStraintoEngineerthePhysicalPropertiesof HeterostructresinNanowires 215 5.8 SummaryandConclusions 216 6 MetamorphicHEMTTechnologyExemplifiedby InAlAs/InGaAs/GaAsHEMTs 229 WilliamE.HokeandColinS.Whelan 6.1 Introduction 230 6.2 MHEMTOpportunities 233 6.3 MHEMTMaterialResults 234 6.4 MHEMTDeviceResultsandReliability 242 6.5 Summary 252 7 MetamorphicHeterojunctionBipolarTransistors 259 HongWang 7.1 Introduction 260 7.2 MHBTLayerStructures 261 October22,2012 13:22 PSPBook-9inx6in 00-Shumin-Wang–prelims Contents ix 7.3 FabricationofMHBTsandDeviceCharacteristics 264 7.4 IssuesofMHBTs 268 7.4.1 ThermalCharacteristicsofMHBTs 268 7.4.2 StabilityandReliabilityofMHBTs 276 7.5 MHBTPerformance 278 8 MetamorphicQuantumWellLasers 283 YuxinSong,ShuminWang,XiangjunShang, andZhichuanNiu 8.1 Introduction 283 8.2 DesignofMetamorphicBufferLayers 284 8.2.1 Bulk-Like,Step-Graded,andAlloy-Graded MetamorphicBufferLayers 284 8.2.2 “Dislocation-Free”RegionandResidualStrain 286 8.2.3 Step-LikeStrainRelaxation 288 8.3 DopinginAlloy-GradedBufferLayers 290 8.3.1 DopingEffectsonSurfaceMorphologyand StructuralProperty 290 8.3.2 EffectsofAlloyGradingProfiles 292 8.3.3 EffectsofGradingSlopesandFinalIn Compositions 296 8.3.4 DesignofAlloy-GradedBuffersfor OptoelectronicDevices 300 8.4 MetamorphicQuantumWellLasers 300 8.4.1 MetamorphicTelecomLasers 301 8.4.2 Mid-InfraredMetamorphicQuantumWell Lasers 306 9 High-PerformanceMetamorphicIn(Ga)As/GaAs QuantumDotLasersonGaAsandSi 319 ZetianMi,JunYang,andPallabBhattacharya 9.1 Introduction 320 9.2 EpitaxialGrowthofHigh-QualityMetamorphic In(Ga)AsBufferLayersonGaAsandSiSubstrates 321 9.2.1 InGaAsMetamorphicBufferLayersonGaAs 322 9.2.2 Self-OrganizedQuantumDotDislocation Filters 324 9.2.2.1 Theoreticalmodel 325 9.2.2.2 Experimentalcharacterization 327

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