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Landolt-Börnstein. Numerical Data and Functional Relationships in Science and Technology. New Series. Group IV: Physical Chemistry, Volume 11. Ternary Alloy Systems Phase Diagrams, Crystallographic and Thermodynamic Data critically evaluated by MSIT®. Sub PDF

509 Pages·2007·19.52 MB·English
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Preview Landolt-Börnstein. Numerical Data and Functional Relationships in Science and Technology. New Series. Group IV: Physical Chemistry, Volume 11. Ternary Alloy Systems Phase Diagrams, Crystallographic and Thermodynamic Data critically evaluated by MSIT®. Sub

Landolt-Börnstein Numerical Data and Functional Relationships in Science and Technology New Series / Editor in Chief: W. Martienssen Group IV: Physical Chemistry Volume 11 Ternary Alloy Systems Phase Diagrams, Crystallographic and Thermodynamic Data ® critically evaluated by MSIT Subvolume C Non-Ferrous Metal Systems Part 3 Selected Soldering and Brazing Systems Editors G. Effenberg and S. Ilyenko Authors ® Materials Science International Team, MSIT ISSN 1615-2018 (Physical Chemistry) ISBN 978-3-540-25777-6 Springer Berlin Heidelberg New York Library of Congress Cataloging in Publication Data Zahlenwerte und Funktionen aus Naturwissenschaften und Technik, Neue Serie Editor in Chief: W. Martienssen Vol. IV/11C3: Editors: G. Effenberg, S. Ilyenko At head of title: Landolt-Börnstein. Added t.p.: Numerical data and functional relationships in science and technology. Tables chiefly in English. Intended to supersede the Physikalisch-chemische Tabellen by H. Landolt and R. Börnstein of which the 6th ed. began publication in 1950 under title: Zahlenwerte und Funktionen aus Physik, Chemie, Astronomie, Geophysik und Technik. Vols. published after v. 1 of group I have imprint: Berlin, New York, Springer-Verlag Includes bibliographies. 1. Physics--Tables. 2. Chemistry--Tables. 3. Engineering--Tables. I. Börnstein, R. (Richard), 1852-1913. II. Landolt, H. (Hans), 1831-1910. III. Physikalisch-chemische Tabellen. IV. Title: Numerical data and functional relationships in science and technology. QC61.23 502'.12 62-53136 This work is subject to copyright. All rights are reserved, whether the whole or part of the material is concerned, specifically the rights of translation, reprinting, reuse of illustrations, recitation, broadcasting, reproduction on microfilm or in other ways, and storage in data banks. Duplication of this publication or parts thereof is permitted only under the provisions of the German Copyright Law of September 9, 1965, in its current version, and permission for use must always be obtained from Springer-Verlag. Violations are liable for prosecution act under German Copyright Law. Springer is a part of Springer Science+Business Media springeronline.com © Springer-Verlag Berlin Heidelberg 2007 Printed in Germany The use of general descriptive names, registered names, trademarks, etc. in this publication does not imply, even in the absence of a specific statement, that such names are exempt from the relevant protective laws and regulations and therefore free for general use. Product Liability: The data and other information in this handbook have been carefully extracted and evaluated by experts from the original literature. Furthermore, they have been checked for correctness by authors and the editorial staff before printing. Nevertheless, the publisher can give no guarantee for the correctness of the data and information provided. In any individual case of application, the respective user must check the correctness by consulting other relevant sources of information. Cover layout: Erich Kirchner, Heidelberg Typesetting: Materials Science International Services GmbH, Stuttgart Printing and Binding: AZ Druck, Kempten/Allgäu SPIN: 10916025 63/3020 - 5 4 3 2 1 0 – Printed on acid-free paper Editors: Günter Effenberg Svitlana Ilyenko MSI, Materials Science International Services GmbH Postfach 800749, D-70507, Stuttgart, Germany http://www.matport.com Authors: Materials Science International Team, MSIT® The present series of books results from collaborative evaluation programs performed by MSI and authored by MSIT®. In this program data and knowledge are contributed by many individuals and accumulated over almost twenty years, now. The content of this volume is a subset of the ongoing MSIT® Evaluation Programs. Authors of this volume are: Nataliya Bochvar, Moscow, Russia Evgenia Lysova, Moscow, Russia Anatoliy Bondar, Kyiv, Ukraine Pierre Perrot, Lille, France Tatyana Dobatkina, Moscow, Russia Alan Prince†, Harpenden, U.K. Olga Fabrichnaya, Stuttgart, Germany Qingsheng Ran, Stuttgart, Germany Gautam Ghosh, Evanston, USA Peter Rogl, Wien, Austria Joachim Gröbner, Clausthal-Zellerfeld, Germany Lazar Rokhlin, Moscow, Russia Katharina Haußmann, Stuttgart, Germany Myriam Sacerdote-Peronnet, Lyon, France Volodymyr Ivanchenko, Kyiv, Ukraine Stephan Schittny, Hanau, Germany Yan Jialin, Guangxi, China Rainer Schmid-Fetzer, Clausthal-Zellerfeld, Germany Jozefien De Keyzer, Leuven, Belgium Elena L. Semenova, Kyiv, Ukraine Ulrich E. Klotz, Dübendorf, Switzerland Oleh Shcherban, L'viv, Ukraine Kostyantyn Korniyenko, Kyiv, Ukraine Nuri Solak, Stuttgart, Germany Tatiana Kosorukova, Kyiv, Ukraine Vasyl Tomashik, Kyiv, Ukraine Ortrud Kubashewski, Aachen, Germany Ludmila Tretyachenko, Kyiv, Ukraine K.C. Hari Kumar, Chennai, India Mikhail Turchanin, Kramatorsk, Ukraine Viktor Kuznetsov, Moscow, Russia Tamara Velikanova, Kyiv, Ukraine Nathalie Lebrun, Lille, France Sigrid Wagner, Stuttgart, Germany Yurii Liberov, Moscow, Russia Andy Watson, Leeds, U.K. Chunlei Liu, Dübendorf, Switzerland Viktor Witusiewicz, Aachen, Germany Jörg F. Löffler, Dübendorf, Switzerland Matvei Zinkevich, Stuttgart, Germany Hans Leo Lukas, Stuttgart, Germany Institutions The content of this volume is produced by Materials Science International Services GmbH and the international team of materials scientists, MSIT®. Contributions to this volume have been made from the following institutions: Access, Aachen, Germany Laboratoire des Multimatériaux et Interfaces, Université Claude Bernard Lyon I The Baikov Institute of Metallurgy, Max-Planck Institut für Metallforschung, Institut Academy of Sciences, für Werkstoffwissenschaft, Pulvermetallurgisches Moscow, Russia Laboratorium, Stuttgart, Germany Donbass State Mechanical Engineering Academy, Moscow State University, Department of General Kramatorsk, Ukraine Chemistry, Moscow, Russia EMPA, Materials Science and Technology National University of L'viv, Cathedra of Laboratory of Joining and Interface Technology, Inorganic Chemistry, L'viv, Ukraine Dübendorf, Switzerland I.M. Frantsevich Institute for Problems of Northwestern University, Department of Materials Science, National Academy of Sciences, Materials Science and Engineering, Evanston, Kyiv, Ukraine USA Heraeus GmbH, Hanau, Germany RWTH Aachen, Germany Indian Institute of Technology Madras, Technische Universität Clausthal, Department of Metallurgical Engineering, Metallurgisches Zentrum, Clausthal-Zellerfeld, Chennai, India Germany Institute of Materials Science, Guangxi University, Université de Lille I, Laboratoire de Métallurgie Nanning, China Physique, Villeneuve d’ASCQ, Cedex, France Institute for Semiconductor Physics, National Universität Wien, Institut für Physikalische Academy of Sciences, Kyiv, Ukraine Chemie, Wien, Austria Katholieke Universiteit Leuven, Department University of Leeds, Department of Materials, Metaalkunde en Toegepaste Materiaalkunde, School of Process, Environmental and Materials Heverlee, Belgium Engineering, Leeds, UK G.V. Kurdyumov Institute for Metal Physics, National Academy of Sciences, Kyiv, Ukraine Preface The growing need to develop Pb free solder alloys less damaging for the environment is causing increased research into candidate materials systems, such as those evaluated in this volume. However the lead-tin solder alloys are still commonly used and dominate the industrial market by far. A candidate lead free solder alloy must fulfill many requirements: wettability of the substrate, ability to form a strong chemical bond with the substrate, suitable melting and solidification behavior, good mechanical properties, corrosion resistance, electrical conductivity and it must not be harmful to health and environment. We included in this volume ternary systems from which one may arrive at alloys that satisfy the above requirements and are therefore promising candidates for the development of such soldering and brazing materials. But also other important solder or braze systems which are presently in use are included in this volume. The sub-series Ternary Alloy Systems of the Landolt-Börnstein New Series provides reliable and comprehensive descriptions of the materials constitution, based on critical intellectual evaluations of all data available at the time, and it critically weights the different findings, also with respect to their compatibility with today’s edge binary phase diagrams. Selected are ternary systems of importance to industrial alloy development and systems which gained scientific interest in the recent years otherwise. In a ternary materials system, however, one may find alloys for various applications, depending on the chosen composition. Reliable phase diagrams provide scientists and engineers with basic information of eminent importance for fundamental research and for the development and optimization of materials. So collections of such diagrams are extremely useful, if the data on which they are based have been subjected to critical evaluation, like in these volumes. Critical evaluation means: where contradictory information is published data and conclusions are being analyzed, broken down to the firm facts and re- interpreted in the light of all present knowledge. Depending on the information available this can be a very difficult task to achieve. Critical evaluations establish descriptions of reliably known phase configurations and related data. The evaluations are performed by MSIT®, Materials Science International Team, a group which has been working together for 20 years now. Within this team skilled expertise is available for a broad range of methods, materials and applications. This joint competence is employed in the critical evaluation of the often conflicting literature data. Particularly helpful in this are targeted thermodynamic calculations for individual equilibria, driving forces or complete phase diagram sections. Insight in materials constitution and phase reactions is gained from many distinctly different types of experiments, calculation and observations. Intellectual evaluations which interpret all data simultaneously reveal the chemistry of a materials system best. The conclusions on the phase equilibria may be drawn from direct observations e.g. by microscope, from monitoring caloric or thermal effects or measuring properties such as electric resistivity, electro-magnetic or mechanical properties. Other examples of useful methods in materials chemistry are mass-spectrometry, thermo-gravimetry, measurement of electro-motive forces, X-ray and microprobe analyses. In each published case the applicability of the chosen method has to be validated, the way of actually performing the experiment or computer modeling has to be validated and the interpretation of the results with regard to the material’s chemistry has to be verified. An additional degree of complexity is introduced by the material itself, as the state of the material under test depends heavily on its history, in particular on the way of homogenization, thermal and mechanical treatments. All this is taken into account in an MSIT® expert evaluation. To include binary data in the ternary evaluation is mandatory. Each of the three-dimensional ternary phase diagrams has edge binary systems as boundary planes; their data have to match the ternary data smoothly. At the same time each of the edge binary systems A-B is a boundary plane for many ternary A- B-X systems. Therefore combining systematically binary and ternary evaluations can lead to a level of increased confidence and reliability in both ternary and binary phase diagrams. This has started systematically for the first time here, by the MSIT® Evaluation Programs applied to the Landolt- Börnstein New Series. The multitude of correlated or inter-dependant data requires special care. Within MSIT® an evaluation routine has been established that proceeds knowledge driven and applies both human based expertise and electronically formatted data and software tools. MSIT® internal discussions take place in almost all evaluation works and on many different specific questions, adding the competence of a team to the work of individual authors. In some cases the authors of earlier published work contributed to the knowledge base by making their original data records available for re-interpretation. All evaluation reports published here have undergone a thorough review process in which the reviewers had access to all the original data. In publishing we have adopted a standard format that provides the reader with the data for each ternary system in a concise and consistent manner, as applied in the MSIT® Workplace: Phase Diagrams Online. The standard format and special features of the Landolt-Börnstein compendium are explained in the Introduction to the volume. In spite of the skill and labor that have been put into this volume, it will not be faultless. All criticisms and suggestions that can help us to improve our work are very welcome. Please contact us via [email protected]. We hope that this volume will prove to be an as useful tool for the materials scientist and engineer as the other volumes of Landolt-Börnstein New Series and the previous works of MSIT® have been. We hope that the Landolt-Börnstein Sub-series Ternary Alloy Systems will be well received by our colleagues in research and industry. On behalf of the participating authors we want to thank all those who contributed their comments and insight during the evaluation process. In particular we thank the reviewers – Andy Watson, Pierre Perrot, Rainer Schmid-Fetzer, Olga Fabrichnaya, Hari Kumar, Gabriele Cacciamani, Matvei Zinkevich, Artem Kozlov, Ludmila Tretyachenko, Joachim Gröbner, Hans Leo Lukas, Yong Du, Marina Bulanova. Special thanks go to Oleksandr Dovbenko who very competently helped the editors to supervise the review and helped the authors in discussing questionable matters. We all gratefully acknowledge the dedicated desk editing by Oleksandra Berezhnytska, Oleksandr Rogovtsov, and Vyacheslav Saltykov. Günter Effenberg and Svitlana Ilyenko Stuttgart, March 2006 Contents IV/11 Ternary Alloy Systems Phase Diagrams, Crystallographic and Thermodynamic Data Subvolume C: Non-Ferrous Metal Systems Part 3: Selected Soldering and Brazing Systems Introduction Data Covered..................................................................................................................................XI General............................................................................................................................................XI Structure of a System Report..........................................................................................................XI Introduction..........................................................................................................................XI Binary Systems....................................................................................................................XI Solid Phases.......................................................................................................................XII Quasibinary Systems.........................................................................................................XIII Invariant Equilibria...........................................................................................................XIII Liquidus, Solidus, Solvus Surfaces...................................................................................XIII Isothermal Sections...........................................................................................................XIII Temperature – Composition Sections...............................................................................XIII Thermodynamics..............................................................................................................XIII Notes on Materials Properties and Applications...............................................................XIII Miscellaneous...................................................................................................................XIII References.........................................................................................................................XVI General References....................................................................................................................XVII Ternary Systems Ag – Bi – Cu (Silver – Bismuth – Copper).......................................................................................1 Ag – Bi – Sn (Silver – Bismuth – Tin)..............................................................................................4 Ag – Cu – In (Silver – Copper – Indium).......................................................................................18 Ag – Cu – Mn (Silver – Copper – Manganese)..............................................................................26 Ag – Cu – Ni (Silver – Copper – Nickel).......................................................................................30 Ag – Cu – P (Silver – Copper – Phosphorus).................................................................................38 Ag – Cu – Sn (Silver – Copper – Tin)............................................................................................47 Ag – Cu – Ti (Silver – Copper – Titanium)....................................................................................63 Ag – Cu – Zn (Silver – Copper – Zinc)..........................................................................................75 Ag – In – Sb (Silver – Indium – Antimony)...................................................................................86 Ag – In – Sn (Silver – Indium – Tin)..............................................................................................96 Ag – Pb – Sn (Silver – Lead – Tin)...............................................................................................113 Ag – Sn – Zn (Silver – Tin – Zinc)...............................................................................................121 Au – Bi – Sn (Gold – Bismuth – Tin)...........................................................................................131 Au – Cu – Sn (Gold – Copper – Tin)............................................................................................138 Au – In – Sn (Gold – Indium – Tin).............................................................................................149 B – Cr – Ni (Boron – Chromium – Nickel)..................................................................................153 Bi – In – Sb (Bismuth – Indium – Antimony)...............................................................................168 Bi – In – Sn (Bismuth – Indium – Tin).........................................................................................191 Bi – Sn – Zn (Bismuth – Tin – Zinc)............................................................................................202 Co – Cu – Mn (Cobalt – Copper – Manganese)............................................................................212 Cr – Ni – P (Chromium – Nickel – Phosphorus)..........................................................................222 Cr – Ni – Si (Chromium – Nickel – Silicon).................................................................................229 Cu – In – Sn (Copper – Indium – Tin)..........................................................................................249 Cu – Mn – Ni (Copper – Manganese – Nickel)............................................................................274 Cu – Mn – Sn (Copper – Manganese – Tin).................................................................................286 Cu – Ni – Sn (Copper – Nickel– Tin)...........................................................................................303 Cu – Ni – Zn (Copper – Nickel – Zinc)........................................................................................338 Cu – P – Sn (Copper – Phosphorus – Tin)....................................................................................355 Cu – Pb – Sn (Copper – Lead – Tin).............................................................................................368 Cu – Pd – Sn (Copper – Palladium – Tin)....................................................................................390 Cu – Si – Zn (Copper – Silicon – Zinc)........................................................................................393 Cu – Sn – Ti (Copper – Tin – Titanium).......................................................................................409 Cu – Sn – Zn (Copper – Tin – Zinc).............................................................................................422 Cu – Ti – Zr (Copper – Titanium – Zirconium)............................................................................436 In – Ti – Zn (Indium – Tin – Zinc)...............................................................................................465 Mn– Ti – Zr (Manganese – Titanium – Zirconium)......................................................................475 Ni – Pd – Si (Nickel – Palladium – Silicon).................................................................................486 Free WEB Access to update information and more. Content updates of the Landolt-Börnstein sub-series IV/11 plus supplementary information are available from MSI, including: • Links to Literature (up-to-date bibliographic data base) • Diagrams as Published (not MSIT®-evaluated diagrams) • Research Results (published and proprietary data) • Ternary Evaluations: These are LB IV/11 contents and their updates (if any) as interactive live diagrams & documents. This service is free of charge for Landolt-Börnstein subscribers and applies for material systems included in the sub-series IV/11. As eligible Springer customer, please contact MSI for access at [email protected]. Contents and supplementary information to the Landolt-Boernstein sub-series IV/11 are made by MSI, Materials Science International Services, GmbH, Stuttgart and its global team MSIT®, as part of their ongoing Phase Diagram Evaluation Programs. For details on “MSIT® Workplace, Phase Diagrams Online” see: http://www.matport.com. IV/11 Ternary Alloy Systems Phase Diagrams, Crystallographic and Thermodynamic Data Subvolume C: Non-Ferrous Metal Systems Part 3: Selected Soldering and Brazing Systems Ag - … Au - … B - … Bi - … Co - … Ag - Bi - Cu Au - Bi - Sn B - Cr - Ni Bi - In - Sb Co - Cu - Mn Ag - Bi - Sn Au - Cu - Sn Bi - In - Sn Ag - Cu - In Au - In - Sn Bi - Sn - Zn Ag - Cu - Mn Ag - Cu - Ni Ag - Cu - P Ag - Cu - Sn Ag - Cu - Ti Ag - Cu - Zn Ag - In - Sb Ag - In - Sn Ag - Pb - Sn Ag - Sn - Zn Cr - … Cu - … In - … Mn - … Ni - … Cr - Ni - P Cu - In - Sn In - Ti - Zn Mn - Ti - Zr Ni - Pd - Si Cr - Ni - Si Cu - Mn - Ni Cu - Mn - Sn Cu - Ni - Sn Cu - Ni - Zn Cu - P - Sn Cu - Pb - Sn Cu - Pd - Sn Cu - Si - Zn Cu - Sn - Ti Cu - Sn - Zn Cu - Ti - Zr Ag–Bi–Cu 1 Silver – Bismuth – Copper Joachim Gröbner Introduction The first data on the Ag-Bi-Cu system were reported by [1951Ava], who considered microstructure of alloys near the binary Ag-Cu eutectic depending on the cooling rate. [1976Zan] reported results of rapid quench-cooling experiments in the Ag rich part of the system. A eutectic reaction was found to exist at 240(cid:5) 5°C, but the phases in equilibrium were not specified. This work was reviewed by [1980Hen] and [1988Hen]. [1988Liu, 1989Liu] investigated the entire ternary system in 12 vertical sections by thermoanalysis (DTA) in an atmosphere of dry nitrogen. They found that the ternary Ag-Bi-Cu system is a simple eutectic one with the invariant reaction at 258°C. [1998Shu] has calculated the liquidus surface using a model of ideal solution of self-associates and compared the result with that measured by [1989Liu]. [2004Doi] has presented the primary crystallization surfaces and liquidus isotherms calculated using Calphad method and the thermodynamic parameters for the three binary systems. A good agreement was found between the results of calculation and the experimental data by [1989Liu]. Binary Systems The binary systems Ag-Cu and Bi-Cu are accepted from the MSIT Evaluation Program [2002Rom] and [2002Cac], respectively. The Ag-Bi phase diagram is accepted from [Mas2]. Solid Phases No ternary phases were found in this system. The crystallographic data of the phases in the Ag-Cu-Bi system and their ranges of stability are listed in Table 1. Invariant Equilibria One invariant eutectic reaction: L (cid:156) (Ag) + (Cu) + (Bi) at 258°C exists in the ternary system [1989Liu]. The composition of the liquid phase is given in Table 2. Liquidus Surface The liquidus surface after [1989Liu] is given in Fig. 1. Notes on Materials Properties and Applications The Ag-Bi-Cu system is a part of the Ag-Bi-Cu-Sn system which has been enumerated as a strong potential candidate alloy for a lead-free solder [2004Doi]. References [1951Ava] Avakyan, S.V., Lashko, N.F., “Crystallization of Binary Eutectics in Ternary Systems” (inRussian), Zh. Fiz. Khim., 25, 1085-1091 (1951) (Experimental, 2) [1976Zan] Zanicchi, G., Ferro, R., Marazza, R., Contardi, V., “Some Metastable Ag-Rich Alloys in the Silver-Bismuth-Copper System”, J. Less-Common Met., 50, 151-154 (1976) (Experimental,6) [1980Hen] Henig, E.T., “The Ag-Bi-Cu (Silver-Bismuth-Copper) System”, Bull. Alloy Phase Diagrams,1(2), 62 (1980) (Abstract, 1) [1988Hen] Henig, E.T., “Silver - Bismuth - Copper”, MSIT Ternary Evaluation Program, in MSIT Workplace, Effenberg G. (Ed.), MSI, Materials International Services GmbH, Stuttgart, Document ID: 10.12132.1.20, (1988) (Crys. Structure, Phase Diagram, Assessment, 1) Landolt-Börnstein MSIT® New Series IV/11C3

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The present volume in the New Series of Landolt-B?rnstein provides critically evaluated data on phase diagrams, crystallographic and thermodynamic data of ternary alloy systems. The often conflicting literature data have been critically evaluated by Materials Science International Team, MSIT®, a te
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