Table Of Content

1991 Index ° Volume XXXIV Journal of the IES SUBJECT INDEX COMPUTER APPLICATIONS (CA) The Evaluation of Alternatives to Ozone-Depleting Chlo- rofluorocarbons, R.L. Sellers, No. 4, p. 33. Environmental Modeling/Analysis Vendor Process Contamination Checklist: A Diagnostic Comments on Kurtosis of Military Vehicle Vibration and Troubleshooting Tool, R. Nagarajan, No. 3, p. 45. Data, W.H. Connon III, No. 6, p. 38. Computer-Aided Reliability Finite Element Methods, D. Criteria and Standards Followell, S.L. Liguore, R. Perez, W.D. Yates III, and Comparing Three Environmental Particle Size Dis- W.J. Bocchi, No. 5, p. 46. tributions: Power Law (FED-STD-209D), Lognormal, Random Vibration Analysis of a Printed Wiring Board Approximate Lognormal (MIL-STD-1246B), D. W. with Electronic Components, J. C. Roberts and D.M. Cooper, No. 1, p. 21. Stillo, No. 1, p. 25. Global Impact of the CFC Phaseout, S.0. Andersen, No. 3, Supply Plenum and Airflow Uniformity in Cleanrooms, p: 17. R.S.M. Sadjadi and B.Y.H. Liu, No. 2, p. 56. The Delta Star Thermal Vacuum Test: A Unique Approach Point-of-Use Monitoring for Ultrapure Water Ap- to Space Thermal Simulation, D.Q. Durant and C.J. plications in the Semiconductor Industry, C.F. Frith, Fuld, No. 6, p. 17. No. 3, p. 30. Identification, Measurement, and Monitoring CONTAMINATION CONTROL (CC) Comparing Three Environmental Particle Size Dis- Cleanroom Design/Materials tributions: Power Law (FED-STD-209D), Lognormal, Approximate Lognormal (MIL-STD-1246B), D.W. Assessing Wiping Materials for Their Potential to Cooper, No. 1, p. 21. Contribute Particles to Clean Environments: Con- Minimizing Defects for a Silicon Nitride Deposition structing the Stress-Strain Curves, C.F. Mattina and Process, J. Wilson and G. DePinto, No. 4, p. 26. S.J. Paley, No. 5, p. 21. Point-of-Use Monitoring for Ultrapure Water Ap- CFC Alternative Cleaning Systems—Alternative Pro- plications in the Semiconductor Industry, C.F. Frith, cessing Techniques and Their Effectiveness in Precision No. 3, p. 30. Cleaning, Ken Marts and John Howard, No. 5, p. 34. Supply Plenum and Airflow Uniformity in Cleanrooms, Supply Plenum and Airflow Uniformity in Cleanrooms, R.S.M. Sadjadi and B.Y.H. Liu, No. 2, p. 56. R.S.M. Sadjadi and B.Y.H. Liu, No. 2, p. 56. Test Facility Requirements for the Thermal Vacuum Thermal Balance Test of the Cosmic Background Ex- Cleanliness Operation/Procedures plorer Observatory, L.J. Milam, No. 2, p. 27. CFC Alternative Cleaning Systems—Alternative Pro- The Deposition of Contaminants from Deionized Water cessing Techniques and Their Effectiveness in Precision onto Hydrophobic Silicon Wafers, D.J. Riley and R.G. Cleaning, Ken Marts and John Howard, No. 5, p. 34. Carbonell, No. 6, p. 28. Vendor Process Contamination Checklist: A Diagnostic Contamination Control Program for the Cosmic Back- and Troubleshooting Tool, R. Nagarajan, No. 3, p. 45. ground Explorer—An Overview, R.D. Barney, No. 2, p. 34. Sources and Effects Global Impact of the CFC Phaseout, $.0. Andersen, No. 3, p. 17. Assessing Wiping Materials for Their Potential to Point-of-Use Monitoring for Ultrapure Water Ap- Contribute Particles to Clean Environments: Con- plications in the Semiconductor Industry, C.F. Frith, structing the Stress-Strain Curves, C.F. Mattina and No. 3, p. 30. S.J. Paley, No. 5, p. 21. 42 JOURNAL OF THE IES 1991 Index ° Volume XXXIV Journal of the IES SUBJECT INDEX COMPUTER APPLICATIONS (CA) The Evaluation of Alternatives to Ozone-Depleting Chlo- rofluorocarbons, R.L. Sellers, No. 4, p. 33. Environmental Modeling/Analysis Vendor Process Contamination Checklist: A Diagnostic Comments on Kurtosis of Military Vehicle Vibration and Troubleshooting Tool, R. Nagarajan, No. 3, p. 45. Data, W.H. Connon III, No. 6, p. 38. Computer-Aided Reliability Finite Element Methods, D. Criteria and Standards Followell, S.L. Liguore, R. Perez, W.D. Yates III, and Comparing Three Environmental Particle Size Dis- W.J. Bocchi, No. 5, p. 46. tributions: Power Law (FED-STD-209D), Lognormal, Random Vibration Analysis of a Printed Wiring Board Approximate Lognormal (MIL-STD-1246B), D. W. with Electronic Components, J. C. Roberts and D.M. Cooper, No. 1, p. 21. Stillo, No. 1, p. 25. Global Impact of the CFC Phaseout, S.0. Andersen, No. 3, Supply Plenum and Airflow Uniformity in Cleanrooms, p: 17. R.S.M. Sadjadi and B.Y.H. Liu, No. 2, p. 56. The Delta Star Thermal Vacuum Test: A Unique Approach Point-of-Use Monitoring for Ultrapure Water Ap- to Space Thermal Simulation, D.Q. Durant and C.J. plications in the Semiconductor Industry, C.F. Frith, Fuld, No. 6, p. 17. No. 3, p. 30. Identification, Measurement, and Monitoring CONTAMINATION CONTROL (CC) Comparing Three Environmental Particle Size Dis- Cleanroom Design/Materials tributions: Power Law (FED-STD-209D), Lognormal, Approximate Lognormal (MIL-STD-1246B), D.W. Assessing Wiping Materials for Their Potential to Cooper, No. 1, p. 21. Contribute Particles to Clean Environments: Con- Minimizing Defects for a Silicon Nitride Deposition structing the Stress-Strain Curves, C.F. Mattina and Process, J. Wilson and G. DePinto, No. 4, p. 26. S.J. Paley, No. 5, p. 21. Point-of-Use Monitoring for Ultrapure Water Ap- CFC Alternative Cleaning Systems—Alternative Pro- plications in the Semiconductor Industry, C.F. Frith, cessing Techniques and Their Effectiveness in Precision No. 3, p. 30. Cleaning, Ken Marts and John Howard, No. 5, p. 34. Supply Plenum and Airflow Uniformity in Cleanrooms, Supply Plenum and Airflow Uniformity in Cleanrooms, R.S.M. Sadjadi and B.Y.H. Liu, No. 2, p. 56. R.S.M. Sadjadi and B.Y.H. Liu, No. 2, p. 56. Test Facility Requirements for the Thermal Vacuum Thermal Balance Test of the Cosmic Background Ex- Cleanliness Operation/Procedures plorer Observatory, L.J. Milam, No. 2, p. 27. CFC Alternative Cleaning Systems—Alternative Pro- The Deposition of Contaminants from Deionized Water cessing Techniques and Their Effectiveness in Precision onto Hydrophobic Silicon Wafers, D.J. Riley and R.G. Cleaning, Ken Marts and John Howard, No. 5, p. 34. Carbonell, No. 6, p. 28. Vendor Process Contamination Checklist: A Diagnostic Contamination Control Program for the Cosmic Back- and Troubleshooting Tool, R. Nagarajan, No. 3, p. 45. ground Explorer—An Overview, R.D. Barney, No. 2, p. 34. Sources and Effects Global Impact of the CFC Phaseout, $.0. Andersen, No. 3, p. 17. Assessing Wiping Materials for Their Potential to Point-of-Use Monitoring for Ultrapure Water Ap- Contribute Particles to Clean Environments: Con- plications in the Semiconductor Industry, C.F. Frith, structing the Stress-Strain Curves, C.F. Mattina and No. 3, p. 30. S.J. Paley, No. 5, p. 21. 42 JOURNAL OF THE IES Contamination Control Program for the Cosmic Back- Reliability and Environmental Standards and Management ground Explorer—An Overview, R.D. Barney, No. 2, p. Issues (Panel Discussion, 36th Annual Technical 34. Meeting, Institute of Environmental Sciences, May, Minimizing Defects for a Silicon Nitride Deposition 1990, New Orleans, Louisiana), H. Caruso, H. Egbert, Process, J. Wilson and G. DePinto, No. 4, p. 26. K. Greene, R. Hancock, S. Tanner, and J. Wafford, No. The Deposition of Contaminants from Deionized Water 1, p. 37. onto Hydrophobic Silicon Wafers, D.J. Riley and R.G. The Delta Star Thermal Vacuum Test: A Unique Approach Carbonell, No. 6, p. 28. to Space Thermal Simulation, D.Q. Durant and C.J. Vendor Process Contamination Checklist: A Diagnostic Fuld, No. 6, p. 17. and Troubleshooting Tool, R. Nagarajan, No. 3, p. 45. Shock and Vibration Background Rationale for Tailoring Airborne External DESIGN, TEST AND EVALUATION (DTE) Stores Vibration Tests in MIL-STD-810, Method 514 or Myths and Sacred Cows in the Environmental Acoustics Sciences Revisited, H. Caruso, No. 5, p. 41. Combined Environments Facility for Externally Carried Combined Environments Facility for Externally Carried Aircraft Stores, J. Rice, No. 5, p. 29 Aircraft Stores, J. Rice, No. 5, p. 29 Comments on Kurtosis of Military Vehicle Vibration Climatics and Thermal Data, W.H. Connon III, No. 6, p. 38. Combined Environments Facility for Externally :Carried Computer-Aided Reliability Finite Element Methods, D. Aircraft Stores, J. Rice, No. 5, p. 29. Followell, S.L. Liguore, R. Perez, W.D. Yates III, No. 5, Cost-Effectiveness of Environmental Stress Screening, p. 46. A.L. Nagle, No. 6, p. 35. Cost-Effectiveness of Environmental Stress Screening, Development of a Reliability Test Profile for an ECM A.L. Nagle, No. 6, p. 35. Pod Based on Measured Flight Conditions, R.E. Design Consideration of Expander Heads for Vibration Schmidt, No. 4, p. 17. Systems, Part I: Natural Frequency Equations for Square, Constant Thickness Expander Heads, L.J. Lipp, Criteria and Standards No. 2, p. 45. Background Rationale for Tailoring Airborne External Design Consideration of Expander Heads for Vibration Stores Vibration Tests in MIL-STD-810, Method 514 Systems, Part II: Damping Equations for Square, or Myths and Sacred Cows in the Environmental Constant Thickness Expander Heads, L.J. Lipp, No. 3, p. Sciences Revisited, H. J. Caruso, No. 5, p. 41. 23. Design Consideration of Expander Heads for Vibration Combined Environments Facility for Externally Carried Systems, Part III: The Inverted Truncated Pyramid Aircraft Stores, J. Rice, No. 5, p. 29. Expanding Head, L.J. Lipp, No. 4, p. 39. Reliability and Environmental Standards and Management Development of a Reliability Test Profile for an ECM Issues (Panel Discussion, 36th Annual Technical Pod Based on Measured Flight Conditions, R.E. Meeting, Institute of Environmental Sciences, May, Schmidt, No. 4, p. 17. 1990, New Orleans, Louisiana), H. Caruso, H. Egbert, Random Vibration Analysis of a Printed Wiring Board K. Greene, R. Hancock, S. Tanner, and J. Wafford, No. with Electronic Components, J. C. Roberts and D.M. 1, p. 37. Stillo, No. 1, p. 25. Design/Test Tailoring Background Rationale for Tailoring Airborne External Solar and Space Simulation Stores Vibration Tests in MIL-STD-810, Method 514 Contamination Control Program for the Cosmic or Myths and Sacred Cows in the Environmental Background Explorer—An Overview, R.D. Barney, No. Sciences Revisited, H. J. Caruso, No. 5, p. 41. 2, p. 34. Combined Environments Facility for Externally Carried Test Facility Requirements for the Thermal Vacuum Aircraft Stores, J. Rice, No. 5, p. 29. Thermal Balance Test of the Cosmic Background Comments on Kurtosis of Military Vehicle Vibration Explorer Observatory, L.J. Milam, No. 2, p. 27. Data, W.H. Connon III, No. 6, p. 38. The Delta Star Thermal Vacuum Test: A Unique Approach Development of a Reliability Test Profile for an ECM to Space Thermal Simulation, D.Q. Durant and C.J. Pod Based on Measured Flight Conditions, R.E. Fuld, No. 6, p. 17. Schmidt, No. 4, p. 17. Global Competitive Streamlining ESS for the 1990s (Executive Panel Discussion, 6th IES National ENERGY AND THE ENVIRONMENT (EE) Conference and Workshop on Environmental Stress Screening of Electronic Hardware, November, 1990, Air Quality Baltimore, Maryland), H. Caruso, G. Anderson, B. Global Impact of the CFC Phaseout, S.0. Andersen, No. 3, Trakas, R. Hutchinson, F. DiGiovanni, and G. Wooley, p. 17. No. 3, p. 34. NOVEMBER/DECEMBER 1991 ag The Evaluation of Alternatives to Ozone-Depleting Random Vibration Analysis of a Printed Wiring Board Chlorofluorocarbons, R.L. Sellers, No. 4, p. 33. with Electronic Components, J. C. Roberts and D.M. Stillo, No. 1, p. 25. Environmental Planning/Management Global Impact of the CFC Phaseout, S.O. Andersen, No. 3, Reliability Growth/Performance p. 17. Development of a Reliability Test Profile for an ECM The Evaluation of Alternatives to Ozone-Depleting Chlo- Pod Based on Measured Flight Conditions, R.E. rofluorocarbons, R.L. Sellers, No. 4, p. 33. Schmidt, No. 4, p. 17. PRODUCT RELIABILITY (PR) Acquisition Policies AUTHOR INDEX Global Competitive Streamlining ESS for the 1990s (Executive Panel Discussion, 6th IES National Con- A ference and Workshop on Environmental Stress Screening of Electronic Hardware, November, 1990, Andersen, S.O., Global Impact of the CFC Phaseout, Baltimore, Maryland), H. Caruso, G. Anderson, B. No. 3, p. 17. This paper reviews the present status of the Trakas, R. Hutchinson, F. DiGiovanni, and G. Wooley, CFC issue and focuses on its global impact on the elec- No. 3, p. 35. tronics industry. (CC Cleanroom Operation/ Reliability and Environmental Standards and Management Procedures, Criteria and Standards; EE Air Quality, Issues (Panel Discussion, 36th Annual Technical Environmental Planning/Management) Meeting, Institute of Environmental Sciences, May, Anderson, G., Global Competitive Streamlining ESS 1990, New Orleans, Louisiana), H. Caruso, H. Egbert, for the 1990s, (Executive Panel Discussion on ESS), 6th K. Greene, R. Hancock, S. Tanner, and J. Wafford, No. IES National Conference and Workshop on 1, p. 37. Environmental Stress Screening of Electronic Hard- Saying Is One Thing, Doing Is Another! (Rethinking ware, Baltimore, Maryland, November, 1990, No. 3, p. Realism), D.O. Patterson, No. 1, p. 17. 35. (Abstract—see Caruso, H.J.) The Challenge to Change (Keynote Address, The 6th ESSEH Conference, November, 13, 1990, Baltimore, B Maryland), Dr. R.B. Costello, No. 1, p. 32. Barney, R.D., Contamination Control Program for the Criteria and Standards Cosmic Background Explorer, No. 2, p. 34. This paper Global Competitive Streamlining ESS for the 1990s describes the cosmic background explorer contamina- (Executive Panel Discussion, 6th IES National Con- tion control program and the difficulties experienced in ference and Workshop on Environmental Stress maintaining the cleanliness quality of personnel and Screening of Electronic Hardware, November, 1990, flight hardware throughout instrument assembly, Baltimore, Maryland), H. Caruso, G. Anderson, B. spacecraft integration, flight environmental qualifica- Trakas, R. Hutchinson, F. DiGiovanni, and G. Wooley, tion, and launch-site operations. (CC Cleanroom No. 3, p. 35. Operation/Procedures, Sources and Effects; DTE Solar Reliability and Environmental Standards and Management and Space Simulation) Issues (Panel Discussion, 36th Annual Technical Bocchi, W.J., Computer-Aided Reliability Finite Meeting, Institute of Environmental Sciences, May, Element Methods No. 5, p. 46, (Abstract—see 1990, New Orleans, Louisiana), H. Caruso, H. Egbert, Followell, D.) K. Greene, R. Hancock, S. Tanner, and J. Wafford, No. i p..37. C Stress Screening Carbonell, R.G., The Deposition of Contaminants from Computer-Aided Reliability Finite Element Methods, D. Deionized Water onto Hydrophobic Silicon Wafers, No. Followell, S.L. Liguore, R. Perez, W.D. Yates III, No. 5, 6, p. 28. (Abstract—see Riley, D.J.) p. 46. Caruso, H.J., Background Rationale for Tailoring Air- Cost-Effectiveness of Environmental Stress Screening, borne External Stores Vibration Tests in MIL-STD- A.L. Nagle, No. 6, p. 35. 810, Method 514 or Myths and Sacred Cows in the Global Competitive Streamlining ESS for the 1990s Environmental Sciences Revisited, No. 5, p. 41. This pa- (Executive Panel Discussion, 6th IES National Con- per identifies background rationale currently missing ference and Workshop on Environmental Stress from Method 514 (Vibration) of MIL-STD-810C/D/E Screening of Electronic Hardware, November, 1990, for vibration testing of external stores and associated Baltimore, Maryland), H. Caruso, G. Anderson, B. equipment carried on jet aircraft (Categories 7A and Trakas, R. Hutchinson, F. DiGiovanni, and G. Wooley, 7B). (DTE Criteria and Standards, Shock and Vibration, No. 3, p. 35. Test Tailoring) JOURNAL OF THE IES Caruso, H.J., Global Competitive Streamlining ESS for DiGiovanni, F., Global Competitive Streamlining ESS the 1990s, (Executive Panel Discussion on ESS), 6th IES for the 1990s (Executive Panel Discussion on ESS), 6th National Conference and Workshop on Environmental IES National Conference and Workshop on Envi- Stress Screening of Electronic Hardware, Baltimore, ronmental Stress Screening of Electronic Hardware, Maryland, November, 1990, No. 3, p. 35. Questions con- Baltimore, Maryland, November, 1990. (Abstract—see sidered by the panelists included: What ESS do they Caruso, H.J.) apply to their products? How well does ESS work for Durant, D.Q., The Delta Star Thermal Vacuum Test: A them? Does the current contractual language provide Unique Approach to Space Thermal Simulation, No. 6, the needed flexibility to make ESS a viable practice? p. 17. Several techniques were developed to perform a How can ESS and TQM work together to lower business thermal vacuum test of the Delta Star Spacecraft. Test costs and keep their organizations competitive? (DTE requirements, methodology, anomalies, test data corre- Test Tailoring; PR Acquisition Policies, Stress lation, and flight data correlation are presented. (CA Screening) Environmental Modelling/Analysis; DTE Solar and Caruso, H.J., Reliability and Environmental Standards Space Simulation, Test Tailoring) and Management Issues (Panel Discussion), 36th Annual Technical Meeting, Institute of Environmental E Sciences, New Orleans, Louisiana, 1990, No. 1, p. 37. The initiatives and opportunities that are opening up in the Egbert, H., Reliability and Environmental Standards and environmental engineering field were reviewed.The Management Issues (Panel Discussion), 36th Annual focus was MIL-STD-810 and MIL-STD-781. (DTE Technical Meeting, Institute of Environmental Criteria and Standards, Test Tailoring; PR Acquisition Sciences, New Orleans, Louisiana, 1990, No. 1, p. 37. Policies, Criteria and Standards) (Abstract—see Caruso, H. J.) Connon, W.H., If] Comments on Kurtosis of Military Vehicle Vibration Data, No. 6, p. 38. This paper de- F scribes road vibration tests conducted on a series of shelters on dolly sets and prototype trucks at the U.S. Followell, D., Computer-Aided Reliability Finite Army Combat Systems Test Activity (USACSTA) at Element Methods, No. 5, p. 46. Finite element analyses Aberdeen Proving Ground. (CA Environmental Mod- (FEA), a process for assessing stresses and strains in elling, Analysis; DTE Shock and Vibration, Test electronic equipment in order to compute the expected Tailoring) structural life, is discussed. Efforts to simplify the Cooper, D.W., Comparing Three Environmental analyses and provide consistent, accurate results as Particle Size Distributions: Power Law (FED-STD- well as the use of linear FEAs versus nonlinear FEAs 209D), Lognormal, Approximate Lognormal (MIL- are also discussed. (CA Environmental Modelling/ STD-1246B), No. 1, p. 21. The behavior of particles is Analysis; DTE Shock and Vibration; PR Stress strongly related to particle size. To summarize data or Screening) to set specifications, it is useful to use a particle size Frith, C.F., Point-of-Use Monitoring for Ultrapure distribution function. The choice of which distribution Water Applications in the Semiconductor Industry, No. function to use depends not only on the data from which 3, p. 30. This paper documents the most recent data for it is derived but also on its ease of use and intelligibil- ultrapure water measurement at the point-of-use, in- ity. Such questions have risen in connection with the cluding the rinsing process. (CC Cleanroom particle size distributions in FED-STD-209D and MIL- Operation/Procedures, Criteria and Standards, STD-1246B. This paper describes three particle size Identification, Measurement and Monitoring) distributions and some relationships among them. (CC Fuld, C.J., The Delta Star Thermal Vacuum Test: A Criteria and Standards, Identification, Measurement, Unique Approach to Space Thermal Simulation (Ab- and Monitoring) stract—see Durant, D.Q.), No. 6, p. 17. Costello, Dr. R.B., The Challenge to Change (Keynote Address), The 6th IES National Conference and Work- G shop on Environmental Stress Screening of Electronic Hardware, Baltimore, Maryland, November, 1990), No. Greene, K., Reliability and Environmental Standards and 1, p. 32. The impact of science and technology on the Management Issues (Panel Discussion), 36th Annual American economy, especially innovative methods of Technical Meeting, Institute of Environmental enhancing America’s industrial base to improve eco- Sciences, New Orleans, Louisiana, 1990, No. 1, p. 37. nomic performance, is addressed. (PR Acquisition (Abstract—see Caruso, H. J.) Policies) H D Hancock, R., Reliability and Environmental Standards DePinto, G., Minimizing Defects for a Silicon Nitride and Management Issues (Panel Discusssion), 36th Deposition Process, No. 4, p. 26. (Abstract—see Wilson, Annual Technical Meeting, Institute of Environmental J.) Sciences, New Orleans, Louisiana, 1990, No. 1, p. 37. (Abstract—see Caruso, H. J.) NOVEMBER/DECEMBER 1991 45 Howard, J., CFC Alternative Cleaning Systems— results are described. (CC _ Identification, Alternative Processing Techniques and Their Effec- Measurement, and Monitoring; DTE Solar and Space tiveness in Precision Cleaning, No. 5, p. 34. (Abstract— Simulation) see Marts, K.) Hutchinson, R., Global Competitive Streamlining ESS N for the 1990s, (Executive Panel Discussion on ESS), 6th IES National Conference and Workshop on Envi- Nagarajan, R., Process Contamination Checklist: A ronmental Stress Screening of Electronic Hardware, Diagnostic and Troubleshooting Tool, No. 3, p. 45. A Baltimore, Maryland, November, 1990, No. 3, p. 35. vendor process contamination checklist to assist the (Abstract—see Caruso, H.J.) responsible engineer in identifying potential sources of contamination within the vendor process is discussed. L (CC Cleanroom Operation/Procedures, Identification, Measurement, and Monitoring, Sources and Effects) Liguore, S.L., Computer-Aided Reliability Finite Nagle, A.L., Cost-Effectiveness of Environmental Element Methods, No. 5, p. 46. (Abstract—see Fol- Stress Screening (ESS): A Case History, No. 6, p. 35. lowell, D.) This paper describes a low-budget ESS program per- Lipp, L.J., Part I. Design Considerations of Expander formed on 20 newly manufactured circuit cards. (DTE Heads for Vibration Systems, No. 2, p. 45. Natural Climatics and Thermal, Shock and Vibration; PR Stress Frequency Equations for Square, Constant Thickness Screening) Expander Heads are included. (DTE Shock and Vi- bration) Lipp, L.J., Part II. Design Considerations of Expander P Heads for Vibration Testing. No. 3, p. 23. Damping Paley, S.J., Assessing Wiping Materials for Their Equations for Square, Constant Thickness Expander Potential to Contribute Particles to Clean Envi- Heads are included. (DTE Shock and Vibration) ronments: Constructing the Stress-Strain Curves, No. 6, Lipp, L.J. Part III. Design Considerations of Expander p. 21. (Abstract—see Mattina, C.F.) Heads for Vibration Testing, No. 4, p. 39. The Inverted Patterson, D.O., Saying Is One Thing, Doing is Truncated Pyramid Expanding Head is discussed. (DTE Another!, No. 1, p. 17. The origins of the DoD templates Shock and Vibration) and their relationship to the industrial processes asso- Liu, B.Y.H., Supply Plenum and Airflow Uniformity in ciated with material acquisition are reviewed. (PR Cleanrooms, No. 2, p. 56. (Abstract—see Sadjadi, Acquisition Policies) R.S.M.) Perez, R., Computer-Aided Reliability Finite Element Methods , No. 5, p. 46. (Abstract—see Followell, D.) M Marts, K., CFC Alternative Cleaning Systems— R Alternative Processing Techniques and Their Effectiveness in Precision Cleaning, No. 5, p. 34. A mul- Rice, J., Combined Environments Facility for Externally tidisciplined product team assessed the feasibility of Carried Aircraft Stores, No. 5, p. 29. A recently com- various cleaning*materials and processing equipment pleted facility at Raytheon Company that simulates the for precision cleaning. (CC Cleanroom environments measured on the AN/ALQ-184 EW Design/Materials, Cleanroom Operation/Procedures) Jammer Pod during a series of flight tests is described. Mattina, C.F., Assessing Wiping Materials for Their (DTE Acoustics, Criteria and Standards, Climatics and Potential to Contribute Particles to Clean Envi- Thermal, Shock and Vibration, Test Tailoring) ronments: Constructing the Stress-Strain Curves, No. 5, Riley, D.J., The Deposition of Contaminants from p. 21. This paper describes an experimental procedure Deionized Water onto Hydrophobic Silicon Wafers, No. for stressing wipers such that the magnitude of the 6, p. 28. This paper describes an investigation of liquid- stresses are known, reproducible, and applied over a based deposition of particles onto hydrophobic silicon reasonable range, and such that that the number of par- surfaces by exposing hydrophobic silicon wafers to ticles generated thereby is easily determined. (CC sample contaminants in a stirred deionized water bath. Cleanroom Design/Materials, Sources and Effects) (CC Identification, Measurement, and Monitoring, Milam, L.J., Test Requirements for the Thermal Sources and Effects) Vacuum Thermal Balance Test of the Cosmic Roberts, J.C., Random Vibration Analysis of a Printed Background Explorer Observatory, No. 2, p. 27. The Wiring Board with Electronic Components, No. 1, p. 25. cosmic background observatory (COBE) underwent a A printed wiring board with electronic components was thermal vacuum/thermal balance test in the space en- modeiled using the finite element technique and com- vironment simulator at the Space Simulation Test pared with the same printed wiring board experimen- Laboratory, Goddard Space Flight Center. The test re- tally tested in a chassis during a two-hour random vi- quirements, test setup, special fixturing requirements, bration test. (CA Environmental Modelling/Analysis; related contamination concerns, and the test and test DTE Shock and Vibration; PR Stress Screening) JOURNAL OF THE IES S Technical Meeting, Institute of Environmental Sciences, New Orleans, Louisiana, 1990, No. 1, p. 37. Sadjadi, R.S.M., Supply Plenum and Airflow (Abstract—see Caruso, H. J.) Uniformity in Cleanrooms, No. 2, p. 56. The effect of Trakas, R., Global Competitive Streamlining ESS for plenum geometry on airflow uniformity in the clean- the 1990s, (Executive Panel Discussion on ESS), 6th IES room is discussed. A realistic numerical approach to National Conference and Workshop on Environmental the problem of flow distribution in cleanrooms is de- Stress Screening of Electronic Hardware, Baltimore, scribed. (CA Environmental Modelling/Analysis; CC Maryland, November, 1990, No. 3, p. 35. (Abstract—see Cleanroom Design/Materials, Identification, Meas- Caruso, H.J.) urement, and Monitoring) Schmidt, R.E., Development of a Reliability Test Profile for an ECM Pod Based on Measured Flight Ww Conditions, No. 4, p. 17. The profile combined air and Wafford, J., Reliability and Environmental Standards liquid temperature cycling and various vibroacoustic levels to duplicate the measured inflight thermal vibra- and Management Issues (Panel Discussion), 36th Annual Technical Meeting, Institute of Environmental tory response of the ALQ-184 ECM pod. (DTE Sciences, New Orleans, Louisiana, 1990, No. 1, p. 37. Climatics and Thermal, Shock and Vibration, Test (Abstract—see Caruso, H.J.) Tailoring; PR Reliability Growth) Wilson, J., Minimizing Defects for a Silicon Nitride Sellers, R.L., The Evaluation of Alternatives to Ozone- Deposition Process, No. 4, p. 26. A low-pressure chemi- Depleting Chlorofluorocarbons, No. 4, p. 33. As part of cal vapor deposition nitride process characterized for an international effort to reduce the depletion of strato- film uniformity and particle density is described. (CC spheric ozone, a test program was developed and im- Identification, Measurement, and Monitoring, Sources plemented to evaluate materials or processes as alter- and Effects) natives to chlorofluorocarbons. The development and Wooley, G., Global Competitive Streamlining ESS for the results of these industry-government efforts are de- the 1990s, (Executive Panel Discussion on ESS), 6th IES scribed. (CC Cleanroom Operation/Procedures; EE Air National Conference and Workshop on Environmental Quality, Environmental Planning/Management) Stress Screening of Electronic Hardware, Baltimore, Stillo, D.M., Random Vibration Analysis of a Printed Maryland, November, 1990, No. 3, p. 35. (Abstract—see Wiring Board with Electronic Components, No. | p. 25. Caruso, H.J.) (Abstract—see Roberts, J.C.) Y T Yates, W.D., III, Computer-Aided Reliability Finite Tanner, S., Reliability and Environmental Standards and Element Methods, No. 5, p. 46. (Abstract—see Follo- Management Issues (Panel Discussion), 36th Annual well, D.) ie NOVEMBER/DECEMEER 1991