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About Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Integrated Microsystems)
Today's microchips have nearly reached their performance limits. Various heat removal, power delivery, chip reliability, and input/output (I/O) signaling problems stand in the way of next-generation 3D gigascale, system-on-a-chip technology, and this cutting-edge guide describes the latest breakthroughs in microfluidics, high-density compliant electrical interconnects, and nanophotonics that are converging to solve them. Engineers get full details on state-of-the-art I/O interconnects and packaging, along with the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication. It brings readers up to speed with the latest heat removal technologies including chip-scale microchannel cooling, integrated micropumps and fluidic channels, and carbon nanotube interconnects.
Detailed Information
| Author: | Muhannad S. Bakir, James D. Meindl |
|---|---|
| Publication Year: | 2008 |
| ISBN: | 9781596932470 |
| Pages: | 551 |
| Language: | English |
| File Size: | 11.546 |
| Format: | |
| Price: | FREE |
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