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Instructor's Solution Manual for Microelectronic Circuits, International 6th Edition PDF

601 Pages·2011·33.73 MB·English
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Preview Instructor's Solution Manual for Microelectronic Circuits, International 6th Edition

Oxford University Press, Inc., publishes works that further Oxford University's objective of excellence in research, scholarship, and education. Oxford New York Auckland Cape Town Dares Salaam Hong Kong Karachi Kuala Lumpur Madrid Melbourne Mexico City Nairobi New Delhi Shanghai Taipei Toronto With offices in Argentina Austria Brazil Chile Czech Republic France Greece Guatemala Hungary Italy Japan Poland Portugal Singapore South Korea Switzerland Thailand Turkey Ukraine Vietnam Copyright © 20 II by Oxford University Press, Inc. Published by Oxford University Press, Inc. 198 Madison Avenue, New York, New York 10016 http://www.oup.com Oxford is a registered trademark of Oxford University Press All rights reserved. No part of this publication m11y be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior permission of Oxford University Press. ISBN: 978-0-19-976570-6 Printing number: 9 8 7 6 S 4 3 2 I Printed in the United States of America on acid-free paper Contents Exercise Solutions (Chapters 1 - 16) Problem Solutions (Chapters 1- 16) Preface This manual contains complete solutions for all exercises and end-of-chapter problems included in the book Microelectronic Circuits, International Sixth Edition, by Adel S. Sedra and Kenneth C. Smith. We are grateful to Mandana Amiri, Shahriar Mirabbasi, Roberto Rosales, Alok Berry, Norman Cox, John Wilson, Clark Kinnaird, Roger King, Marc Cahay, Kathleen Muhonen, Angela Rasmussen, Mike Green, John Davis, Dan Moore, and Bob Krueger, who assisted in the preparation of this manual. We also acknowledge the contribution of Ralph Duncan and Brian Silveira to previous editions of this manual. Communications concerning detected errors should be sent to the attention of the Engineering Editor, mail to Oxford University Press, 198 Madison Avenue, New York, New York, USA 10016 or e-mail to

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