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Industrial Tomography: Systems and Applications PDF

743 Pages·2015·60.097 MB·English
by  Mi Wang
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Related titles Laserspectroscopyandsensing (ISBN978-0-85709-273-1) Terahertztechnologyforimagingandsensing (ISBN978-0-85709-235-9) In-situcharacterisationoffilmdeposition (ISBN978-1-84569-934-5) Woodhead Publishing Series in Electronic and Optical Materials: Number 71 Industrial Tomography Systems and Applications Edited by Mi Wang AMSTERDAM(cid:129)BOSTON(cid:129)CAMBRIDGE(cid:129)HEIDELBERG LONDON(cid:129)NEWYORK(cid:129)OXFORD(cid:129)PARIS(cid:129)SANDIEGO SANFRANCISCO(cid:129)SINGAPORE(cid:129)SYDNEY(cid:129)TOKYO WoodheadPublishingisanimprintofElsevier WoodheadPublishingisanimprintofElsevier 80HighStreet,Sawston,Cambridge,CB223HJ,UK 225WymanStreet,Waltham,MA02451,USA LangfordLane,Kidlington,OX51GB,UK Copyright©2015ElsevierLtd.Allrightsreserved. Nopartofthispublicationmaybereproduced,storedinaretrievalsystemortransmitted inanyformorbyanymeanselectronic,mechanical,photocopying,recordingorotherwise withoutthepriorwrittenpermissionofthepublisher. PermissionsmaybesoughtdirectlyfromElsevier’sScience&TechnologyRights DepartmentinOxford,UK:phone(+44)(0)1865843830;fax(+44)(0)1865853333; email:permissions@elsevier.com.Alternativelyyoucansubmityourrequestonlineby visitingtheElsevierwebsiteathttp://elsevier.com/locate/permissions,andselecting ObtainingpermissiontouseElseviermaterial. Notice Noresponsibilityisassumedbythepublisherforanyinjuryand/ordamagetopersons orpropertyasamatterofproductsliability,negligenceorotherwise,orfromanyuseor operationofanymethods,products,instructionsorideascontainedinthematerialherein. Becauseofrapidadvancesinthemedicalsciences,inparticular,independentverification ofdiagnosesanddrugdosagesshouldbemade. BritishLibraryCataloguinginPublicationData AcataloguerecordforthisbookisavailablefromtheBritishLibrary LibraryofCongressControlNumber:2014957597 ISBN978-1-78242-118-4(print) ISBN978-1-78242-123-8(online) ForinformationonallWoodheadPublishingpublications visitourwebsiteathttp://store.elsevier.com/ TypesetbyTNQBooksandJournals www.tnq.co.in PrintedandboundintheUnitedKingdom List of contributors N.AliOthman UniversitiKebangsaanMalaysia,Bangi,Selangor,Malaysia;Chiba University, Inage, Chiba, Japan R.G.Aykroyd University of Leeds, Leeds, UK B. Cafarelli University ofFoggia, Foggia,Italy Z. Cao Beihang University, Beijing, China K. Daun University ofWaterloo,Waterloo,Ontario, Canada M.A. Del Nobile University ofFoggia, Foggia, Italy F. Dong Tianjin University, Tianjin, China L.-S.Fan The Ohio State University, Columbus, OH, USA U. Hampel Helmholtz-Zentrum Dresden-Rossendorf, Dresden, Germany; Technische Universit€atDresden, Dresden, Germany D.J. Holland University of Canterbury,Christchurch, NewZealand B.S. Hoyle University of Leeds, Leeds, UK G.A.Johansen Faculty of Engineeringand BusinessAdministration, Bergen University College, Bergen, Norway J.P.Kaipio The University ofAuckland, Auckland, New Zealand; University of Eastern Finland,Kuopio,Finland;Rocsole Ltd, Kuopio,Finland G. Kamath GeorgiaState University, Atlanta, GA, USA A. Kantzas University of Calgary, Calgary,AB, Canada A.K.Khambampati Institutefor NuclearScience and Technology, Jeju National University, Jeju, South Korea S. Kim Schoolof Energy Systems Engineering,Chung-Ang University, Seoul, South Korea V. Lampignano University of Foggia, Foggia, Italy J. Laverse University of Foggia, Foggia, Italy A. Lehikoinen University of Eastern Finland, Kuopio, Finland;Rocsole Ltd, Kuopio,Finland A. Lipponen University of Eastern Finland, Kuopio,Finland xiv Listofcontributors Q. Marashdeh Tech4Imaging LLC, Columbus,OH, USA H. McCann University ofEdinburgh, Edinburgh,Scotland, UK V. Mosorov Institute ofAppliedComputer Science, Lodz University of Technology,Lodz, Poland D. Parker University of Birmingham, Birmingham, UK A.J. Peyton University of Manchester, Manchester, UK K. Primrose IndustrialTomography Systems plc, Manchester, UK V. Rimpil€ainen The University ofAuckland, Auckland, NewZealand A.J. Sederman Department of Chemical Engineering and Biotechnology, University ofCambridge, Cambridge,UK A. Sepp€anen University ofEastern Finland;Kuopio,Finland W.-Z.Song Georgia State University, Atlanta, GA,USA A. Spada University of Foggia, Foggia, Italy M. Takei Chiba University, Inage, Chiba, Japan C. Tan TianjinUniversity, Tianjin, China F.L. Teixeira The Ohio State University, Columbus, OH, USA M. Vauhkonen University ofEastern Finland,Kuopio, Finland; Rocsole Ltd, Kuopio, Finland A. Voutilainen Rocsole Ltd, Kuopio,Finland A. Wang The Ohio State University, Columbus, OH, USA M. Wang University of Leeds,Leeds,West Yorkshire,UK N.J. Watson University ofNottingham, Nottingham, UK R.A.Williams University ofBirmingham,Birmingham, UK M. Wilt Schlumberger Gould Research Centre, Cambridge, UK; Schlumberger OilfieldPetroTechnical Services, Richmond, CA,USA P. Wright University of Manchester, Manchester UK C.-G.Xie Singapore Well Testing Centre (SWTC), Schlumberger Oilfield (S) Pte Ltd, Singapore; Schlumberger Gould Research Centre, Cambridge, UK; Schlumberger OilfieldPetroTechnical Services,Richmond, CA, USA L. Xu Beihang University, Beijing,China Woodhead Publishing Series in Electronic and Optical Materials 1 Circuitanalysis J.E.Whitehouse 2 Signalprocessinginelectroniccommunications:Forengineersandmathematicians M.J.Chapman,D.P.GoodallandN.C.Steele 3 Patternrecognitionandimageprocessing D.Luo 4 Digitalfiltersandsignalprocessinginelectronicengineering:Theory,applications, architecture,code S.M.BozicandR.J.Chance 5 Cableengineeringforlocalareanetworks B.J.Elliott 6 DesigningastructuredcablingsystemtoISO11801:Cross-referencedtoEuropean CENELECandAmericanStandards Secondedition B.J.Elliott 7 Microscopytechniquesformaterialsscience A.ClarkeandC.Eberhardt 8 Materialsforenergyconversiondevices EditedbyC.C.Sorrell,J.NowotnyandS.Sugihara 9 Digitalimageprocessing:Mathematicalandcomputationalmethods Secondedition J.M.Blackledge 10 Nanolithographyandpatterningtechniquesinmicroelectronics EditedbyD.Bucknall 11 Digitalsignalprocessing:Mathematicalandcomputationalmethods,softwaredevel- opmentandapplications Secondedition J.M.Blackledge 12 Handbookofadvanceddielectric,piezoelectricandferroelectricmaterials:Synthesis, propertiesandapplications EditedbyZ.-G.Ye 13 Materialsforfuelcells EditedbyM.Gasik 14 Solid-statehydrogenstorage:Materialsandchemistry EditedbyG.Walker 15 Lasercoolingofsolids S.V.PetrushkinandV.V.Samartsev xvi WoodheadPublishingSeriesinElectronicandOpticalMaterials 16 Polymerelectrolytes:Fundamentalsandapplications EditedbyC.A.C.SequeiraandD.A.F.Santos 17 Advancedpiezoelectricmaterials:Scienceandtechnology EditedbyK.Uchino 18 Opticalswitches:Materialsanddesign EditedbyS.J.ChuaandB.Li 19 Advancedadhesivesinelectronics:Materials,propertiesandapplications EditedbyM.O.AlamandC.Bailey 20 Thinfilmgrowth:Physics,materialsscienceandapplications EditedbyZ.Cao 21 Electromigrationinthinfilmsandelectronicdevices:Materialsandreliability EditedbyC.-U.Kim 22 Insitucharacterizationofthinfilmgrowth EditedbyG.KosterandG.Rijnders 23 Silicon-germanium (SiGe) nanostructures: 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35 Handbookofsolid-statelasers:Materials,systemsandapplications EditedbyB.DenkerandE.Shklovsky 36 Organiclight-emittingdiodes(OLEDs):Materials,devicesandapplications EditedbyA.Buckley 37 Lasersformedicalapplications:Diagnostics,therapyandsurgery EditedbyH.Jelínkov(cid:1)a 38 Semiconductorgassensors EditedbyR.JaanisoandO.K.Tan WoodheadPublishingSeriesinElectronicandOpticalMaterials xvii 39 Handbook of organic materials for optical and (opto)electronic devices: Properties andapplications EditedbyO.Ostroverkhova 40 Metallicfilmsforelectronic,opticalandmagneticapplications:Structure,processing andproperties EditedbyK.BarmakandK.Coffey 41 Handbookoflaserweldingtechnologies EditedbyS.Katayama 42 Nanolithography: The art of fabricating nanoelectronic and nanophotonic devices andsystems EditedbyM.Feldman 43 Laserspectroscopyforsensing:Fundamentals,techniquesandapplications EditedbyM.Baudelet 44 Chalcogenideglasses:Preparation,propertiesandapplications EditedbyJ.-L.AdamandX.Zhang 45 HandbookofMEMSforwirelessandmobileapplications EditedbyD.Uttamchandani 46 Subseaopticsandimaging EditedbyJ.WatsonandO.Zielinski 47 Carbonnanotubesandgrapheneforphotonicapplications EditedbyS.Yamashita,Y.SaitoandJ.H.Choi 48 Opticalbiomimetics:Materialsandapplications EditedbyM.Large 49 Opticalthinfilmsandcoatings EditedbyA.PiegariandF.Flory 50 Computerdesignofdiffractiveoptics EditedbyV.A.Soifer 51 Smart sensors and MEMS: Intelligent devices and microsystems for industrial applications EditedbyS.NihtianovandA.Luque 52 Fundamentalsoffemtosecondoptics S.A.KozlovandV.V.Samartsev 53 Nanostructured semiconductor oxides for the next generation of electronics and functionaldevices:Propertiesandapplications S.Zhuiykov 54 Nitride semiconductor light-emitting diodes (LEDs): Materials, technologies and applications EditedbyJ.J.Huang,H.C.KuoandS.C.Shen 55 Sensortechnologiesforcivilinfrastructures Volume 1: Sensing hardware and data collection methods for performance assessment 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EditedbyV.TewaryandY.Zhang 74 Reliabilitycharacterisationofelectricalandelectronicsystems EditedbyJ.Swingler 75 Handbook of industrial wireless sensor networks: Monitoring, control and automation EditedbyR.BudampatiS.Kolavennu 76 Epitaxialgrowthofcomplexmetaloxides:Techniques,propertiesandapplications EditedbyG.Koster,G.RijndersandM.Huijben 77 Semiconductornanowires:Materials,synthesis,characterizationandapplications EditedbyJ.ArbiolandQ.Xiong – Introduction an overview of process applications of tomographic techniques 1. Historical development Since its inception the goal of process tomography has been to sense and interpret complex data in order to extract qualitative and quantitative information of the behaviour of fluids moving within processes. These processes may be reactors, pipelines or measurements focused on the properties of materials being manufac- tured. At one extreme, we have the classical physics of nondestructive testing (a parlance reserved for testing of static products undergoing routine characterisation) and at the other extreme are attempts to quantitate multiphase fluids under chaotic flow regimes. In all cases, there is trade-off between spatial and component resolu- tion and the dynamic (or temporal) resolution. The roots of the discipline lie in medical tomography in which a static (literal) body was investigated using now well-known medical tomographic sensors based on radiation and electromagnetic sensing. Process tomography sought to extend the principles applied to static and steady-state objects to industrial applications (Beck & Williams, 1995, p. 550; Chaouki, Larachi, & Dudukovi(cid:1)c, 1997; Williams, 2010). The journey of this book takes a sensor-perspective, introducing the capabilities of different sensors (often called modalities) and then examining their application for specific measure- ment tasks. The process engineer starts at the process. The physicist and instrument engineer may often start with the sensors. Process tomography requires integration at both ends, but invariably the practicalities of the purpose of the measurement should be used to drive the design of the overall process. Whilst there is a natural desire to want to know everything about the process, in reality this is beyond reach. The approach must focus not on the quality of an image but on the specification of measurements from which judgments can be made for specific purposes. We see this dilemma in the early works on Process Tomography in the World Congress conference series commencing in 1999 (see Bibliography [B10]). Here, sensors werenormallyevaluatedinstatictestsusingphantomobjectsagainstdifferentcondi- tions–farremovedfromrealprocesses.Thesewerenecessarytests,buttheywerenot sufficient for therealities ofprocess measurement. More sophisticated computational and modeling methods were needed to extract information of interest – and this information was often not an image. Nevertheless, preoccupation with images has persisted for obvious reasons. Figure 1 illustrates

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