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High-Speed Clock Network Design PDF

190 Pages·2003·7.566 MB·English
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HIGH-SPEED CLOCK NETWORK DESIGN High-Speed Clock Network Design by QingK.Zhu Intel Corporation, T-RAM Inc., U.S.A. SPRINGER-SCIENCE+BUSINESS MEDIA, B.V. A C.I.P. Catalogue record for this book is available from the Library of Congress. ISBN 978-1-4419-5336-0 ISBN 978-1-4757-3705-9 (eBook) DOI 10.1007/978-1-4757-3705-9 Printed on acid-free paper All Rights Reserved © 2003 Springer Science+Business Media Dordrecht Originally published by Kluwer Academic Publishers in 2003 Softcover reprint ofthe hardcover 1st edition 2003 No part of this work may be reproduced, stored in a retrieval system, or transmitted in any form or by any means, electronic, mechanical, photocopying, microfilming, recording or otherwise, without written permission from the Publisher, with the exception of any material supplied specifically for the purpose of being entered and executed on a computer system, for exclusive use by the purchaser of the work. Table of Contents PREFACE ......................................................................................................... VI"I CHAPTER 1 INTRODUCTION ................................................................. 1 1.1 CLOCK FREQUENCY AND POWER CONSUMPTION ....................................... 1 1.2 SOURCES OF CLOCK SKEW AND CLOCK JITTER .......................................... 2 1.3 ON-DIE VARIATIONS AND CLOCK SKEW IMPACTS ..................................... 6 1.4 CLOCK BUFFER CIRCUIT DESIGN ............................................................. 11 1.5 POWER SUPPLY AND RELIABILITY ISSUES ................................................ 17 1.6 DESIGN COMPLEXITY OF CLOCK DISTRffiUTION ....................................... 18 1.7 SUMMARY ............................................................................................... 22 CHAPTER 2 OVERVIEW TO TIMING CONSTRAINTS •••••••••••••••••••• 23 2.1 PROPAGATION DELAY ANDTRANSmoNTIME ......................................... 23 2.2 SETUP TIME CONSTRAINT ........................................................................ 24 2.3 HOlD TIME CONSTRAINT ......................................................................... 25 2.4 RECOVERY TIME AND PuLsE WIDTH ....................................................... 26 2.5 TIME BORROWING ................................................................................... 27 2.6 ONE EXAMPLE: FIxING HOlD TIME VIOLATIONS ..................................... 31 2. 7 DELAY SLACK GRAPH FOR TIMING CONSTRAINTS ................................... 37 2.8 SUMMARY ............................................................................................... 38 CHAPTER 3 SEQUENTIAL CLOCKED ELEMENTS ......................... 41 3.1 LATCH CLOCKING .................................................................................... 41 3.2 FLIP-FLop CLOCKING ............................................................................... 48 3.3 POWER REDUCTION ................................................................................. 53 3.4 SUMMARY ............................................................................................... 55 CHAPTER 4 DESIGN METHODOLOGY FOR DOMINO CIRCUITS• •• 57 4.1 DOMINO CIRCUIT TYPES .......................................................................... 57 4.2 CLOCK DISTRffiUTION FOR DOMINO CIRCUITS ......................................... 63 4.3 DESIGN OPTIMIZATION IN DOMINO CIRCUITS ........................................... 66 4.4 Low-VT DEVICES FOR DoMINO CIRCUITS ............................................... 68 4.5 SUMMARY ............................................................................................... 73 CHAPTERS CLOCK GENERATION AND DE-SKEWING• ••••••••••••••• 75 5.1 ON-CHIP CLOCK GENERATION ................................................................. 75 5.2 CHARACTERIZATION OF CLOCK GENERATOR ........................................... 78 5.3 LAYOUT GUIDELINES ............................................................................... 79 5.4 DE-SKEWING CIRCUITS ............................................................................ 81 5.5 CLOCK SHRINKING TECHNIQUE FOR SILICON DEBUG. .............................. 86 5.6 SUMMARY ............................................................................................... 88 v CHAPTER 6 MICROPROCESSOR CLOCK DISTRIBUTION EXAMPLES ....................................................................................................... 89 6.1 INTELIA-64 ............................................................................................. 89 6.2 INTEL PENTIuM IV ................................................................................... 93 6.3 INTEL PENTIuM ill .................................................................................. 99 6.4 DEC ALPHA ........................................................................................... 100 6.5 IBM POWERPC ...................................................................................... 103 6.6 SUMMARy ............................................................................................. 105 CHAPTER 7 CLOCK NETWORK SIMULATION MEmODS •••••••• I09 7.1 RCExlRACTION .................................................................................... 109 7.2 FuLL-CHIP CLOCK TREE TRACING ......................................................... 114 7.3 CLOCK TREE SIMULATION AND REPoRT FILEs ....................................... 114 7.4 IRDROpEFFECTS .................................................................................. 119 7.5 SUMMARy ............................................................................................. 123 CHAPTERS LOW-VOLTAGE SWING CLOCK DISTRIBUTION .. 125 8.1 1I2VDD SWING LocAL CLOCK DISTRffiunON ....................................... 125 8.2 Low VOLTAGE SWING GLOBAL CLOCK DISTRffiunON .......................... 128 8.3 SUMMARY ............................................................................................. 133 CHAPTER 9 ROUTING CLOCK ON PACKAGE ............................... 135 9.1 SCHEME OVERVIEW ............................................................................... 135 9.2 ESD DESIGN .......................................................................................... 137 9.3 TRANSMISSION LINE NOISE ON PACKAGE .............................................. 141 9.4 MICROPROCESSOR EXPERIMENTAL RESULTS ......................................... 142 9.5 SUMMARY ............................................................................................. 145 CHAPTER 10 BALANCED CLOCK ROUTING ALGORImMS .......... 147 10.1 PLANAR EQUAL PATH LENGTH CLOCK ROUTING ................................... 147 10.2 GEOMETRICALEMBEDDING ................................................................... 152 10.3 SKEW-BOUNDED REFINEMENT .............................................................. 153 10.4 WIRE SIZING OF CLOCK NETWORK ........................................................ 157 10.5 SUMMARY ............................................................................................. 161 CHAPTER 11 CLOCK TREE DESIGN FLOW IN ASIC ................... 163 11.1 FLow OVERVIEW ................................................................................... 163 11.2 GATED CLOCK TREE SYNTHESIS ............................................................ 166 11.3 CLOCK SKEW AND ToPOLOGY REPoRTS ................................................ 167 11.4 ROUTE THE CLOCK NET ......................................................................... 168 11.5 VERIFY THE CLOCK SKEW ..................................................................... 169 11.6 SUMMARY ............................................................................................. 170 GLOSSARY ...................................................................................................... 171 REFERENCE ................................................................................................... 177 IN'DEX ..•..............................•.......••..•....•.•..........................................•............... 186 vi Preface The author would like to thank: Mr. Mark D. Jongh at Kluwer Academic Publishers for giving the opportunity to publish this book. He also appreciates the help from Peter Chau and Huiling Song for their reviewing and encouragements during the book writing. This book is a collection of design concepts, techniques and research works from the author for clock distribution in microprocessors and high-performance chips. It is organized in 11 chapters as follows. Chapter 1 provides an overview to the design of clock networks. Chapter 2 specifies the timing requirements in digital design. Chapter 3 shows the circuits of sequential elements including latches and flip-flops. Chapter 4 describes the domino circuits, which need special clock signals. Chapter 5 discusses the phase-locked loop (PLL) and delay-locked loop (DLL), which provide the clock generation and de-skewing for the on-chip clock distribution. Chapter 6 summarizes the clock distribution techniques published in the state-of-the-art microprocessor chips. Chapter 7 describes the CAD flow on the clock network simulation. Chapter 8 gives the research work on low-voltage swing clock distribution. Chapter 9 explores the possibility of placing the global clock tree on the package layers. Chapter 10 shows the algorithms of balanced clock routing and wire sizing for the skew minimization. Chapter 11 shows a commercial CAD tool that deals with clock tree synthesis in the ASIC design flow. The glossary is attached at the end of this book. The clock network design is still a challenging task in most high-speed VLSI chips, since the clock frequency and power consumption requirements are increasingly difficult to meet for mUltiple clock networks on the chip. Many research works and industry examples will be shown in this area to continually improve the clock distribution networks for future high-performance chips. vii Chapter 1 Introduction Clock distribution is one of the limiting factors for the high frequency chip design. Device technology improvement, such as deep submicron with faster transistors, can only marginally solve the clock distribution problem because the interconnect delay becomes the significant factor in the clock cycle time. Section 1.1 provides the introduction to clock frequency and power issues. Section 1.2 explains the sources of the clock skew and clock jitter, which are two major design issues in the clock network design. Section 1.3 shows the PVT effects on the clock skew. Section 1.4 describes the clock buffer design. Section 1.5 discusses the power supply and reliability for clock distribution. Section 1.6 demonstrates the design complexity of the clock distribution network by using a microprocessor example. Section 1.7 provides the summary to this chapter. 1.1 Clock Frequency and Power Consumption Figure l-l(a) and Figure l-l(b) show the trends of interconnect delay versus gate intrinsic delay and microprocessor clock frequency. A clock frequency has been achieved at 2.5GHz in Intel Pentium-N chips. Chip technology improvement such as smaller feature size, larger chip area, and increased component density are increasing the difficulties of the clock distribution, since they usually result in higher series interconnect resistance and higher clock loads. Insertion of multiple intermediate levels of clock buffers helps in the transition time and power reduction for the clock tree. But it cannot resolve the clock skew problem, because the clock skew is caused by the process variations in the clock buffers. Extensive research has been performed on the RC delay balance by equating the delay along the branches of the clock tree. H-tree design is widely used in the industry for achieving the equal path lengths based on the recursive H tree structure [2,3]. mM's Power-PC and DEC's Alpha microprocessor chips both use the H-tree design for global clock distribution [4,5]. A limitation of the H-tree is that the clock sinks should be placed in symmetric or Q. K. Zhu, High-Speed Clock Network Design © Springer Science+Business Media Dordrecht 2003 Chapter 1 Introduction uniform locations. Clock grids or clock trunks are also used in the industry with the penalty of taking a large wiring area and causing much more load capacitances [6]. Balanced clock tree construction algorithms for the arbitrary locations of clock sinks (to eliminate the H-tree limitation) can be found in academic research works by Jackson and Kuh (Method of Means and Medians) [7], Kahng, Cong, and Robins (Recursive Geometric Matching Method) [8], Tsay (Elmore Delay Matching Method) [9], Chao, Hsu, Ho, Edahiro, Boese, and Kahng (Deferred-Merge Embedding Methods) [10,11,12], Chou and Cheng (Simulated Annealing Method) [13], Zhu, Dai, Kahng, and Tsao (Planar Equal Path Length Clock Tree Methods) [14,15,16]. Not only is skew an important consideration when designing a clock network, but other factors must be taken into account as well. For instance, clock rise and fall time is proportional to both line resistance and load capacitance, so it is desirable to reduce both of these characteristics. References [24-25] discussed the statistical models for IC chip circuit simulation. Reference [26] considered the delay matching of two clock buffers in pull-up and pull-down edges with process variations. References [27-29] considered the process variations in clock buffer sizing and wire sizing. Reference [30] showed the general principles behind the clock buffer delay and size optimization. Reference [31] showed an analytic way to determine the clock buffer size. In order to reduce the power consumption, it is useful to adopt the clock gating whenever possible in the clock distribution network. In addition, reducing gate and line capacitances of the clock network will help the power reduction. The clock network itself may take up to 50% of the chip total power consumption, as illustrated in Figure 1-2, based on the data from Intel. 1.2 Sources of Clock Skew and Clock Jitter With increasing clock frequency, clock inaccuracy has become a large percentage of the clock period. It is critical that one accounts for the clock inaccuracy in the minimum and maximum path delay calculations. The clock inaccuracy is basically a spatial and temporal phenomenon, causing one clock edge not to arrive at a sampling point at its nominal time, measured relative to another clock edge. The clock inaccuracy consists of two components: the clock skew and the clock jitter. Clock skew represents the spatial separation effect of the clock inaccuracy, whereas clock jitter represents the temporal separation effects of the clock 2 High-Speed Clock Network Design inaccuracy. Figure 1-3 illustrates the clock skew that is the path delay difference of clock signals from the common clock root (the output of the on-chip phase-locked loop) to two clocked elements. The clocked elements can be the latch, flip-flop, domino circuit, etc. There are systematic and random effects that contribute to the clock skew as follows [58]: • Variations in effective channel lengths of devices across the die. This is caused by global in-die variations resulting from lens distortions, wafer planarity, stepper accuracy etc. Also local effects like device proximity and some other random phenomena (e.g. dopant infiltration of the channel) result in channel length variations. • Threshold voltage Vt variation across the dieWider devices has smaller variations in Vt compared to narrower devices. Typical variation could be as high as 50mV for narrow devices. • Inter-layer dielectric (ILD) thickness variation. This causes the interconnect capacitance to vary, resulting in delay variation in interconnect dominated paths. • Design errors. These arise from human errors like mistakes in modelling the circuit, choice of simulation step size, etc., and from the tool related errors in RC parasitic extraction, simulator accuracy, etc. • Supply voltage variation across the die. This depends on power grid design, proximity to high activity and large devices, etc. • Temperature difference across the die. It is very likely to have 5- 100C across a microprocessor chip. • Signal coupling to neighbouring lines. One path may be highly coupled to neighbouring lines compared to another, causing the clock skew between two paths. 3 Chapter 1 Introduction (delay in ns) 2.5 \ I 2.0 c- long wire RC delay I / I 1.5 ~ / / / 1.0 "" .... "" .... .... gate intrinsic delay "" 0.5 "" -- - "" I I I I 0 0.5 1.0 1.5 2.0 2.5 3.0 (minimum feature size in ~m) (a) Source: 11 Corporation, Shin-Puu Jeng (do::k fre:'p£n::y M-IZ) 1200 1050 c;o) higheOOCPU 7:iJ (ffi 4:iJ 300 1:iJ 1995 1<})8 2001 2004 '}fJJJ 2010~) (b) Source: SIA Road Map Figure 1-1. Interconnect Delay and CPU Clock Frequency Trends. 4

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