Green Electronics Design and Manufacturing: Implementing Lead-Free and RoHS Compliant Global Products

409 Pages·2008·2.694 MB·English

by  Sammy Shina

Green Electronics
Design and
Manufacturing
Implementing Lead-Free and
RoHS-Compliant Global Products
Sammy G. Shina
New York Chicago San Francisco
Lisbon London Madrid Mexico City
Milan New Delhi San Juan
Seoul Singapore Sydney Toronto
Copyright © 2008 by The McGraw-Hill Companies, Inc. All rights reserved. Manufactured in the United
States of America. Except as permitted under the United States Copyright Act of 1976, no part of this pub-
lication may be reproduced or distributed in any form or by any means, or stored in a database or retrieval
system, without the prior written permission of the publisher.
0-07-164267-6
The material in this eBook also appears in the print version of this title: 0-07-149594-0.
All trademarks are trademarks of their respective owners. Rather than put a trademark symbol after every
occurrence of a trademarked name, we use names in an editorial fashion only, and to the benefit of the
trademark owner, with no intention of infringement of the trademark. Where such designations appear in
this book, they have been printed with initial caps.
McGraw-Hill eBooks are available at special quantity discounts to use as premiums and sales promotions,
or for use in corporate training programs. For more information, please contact George Hoare, Special
Sales, at [email protected] or [phone].
TERMS OF USE
This is a copyrighted work and The McGraw-Hill Companies, Inc. (“McGraw-Hill”) and its licensors
reserve all rights in and to the work. Use of this work is subject to these terms. Except as permitted under
the Copyright Act of 1976 and the right to store and retrieve one copy of the work, you may not
decompile, disassemble, reverse engineer, reproduce, modify, create derivative works based upon, trans-
mit, distribute, disseminate, sell, publish or sublicense the work or any part of it without McGraw-Hill’s
prior consent. You may use the work for your own noncommercial and personal use; any other use of the
work is strictly prohibited. Your right to use the work may be terminated if you fail to comply with these
terms.
THE WORK IS PROVIDED “AS IS.” McGRAW-HILL AND ITS LICENSORS MAKE NO
GUARANTEES OR WARRANTIES AS TO THE ACCURACY, ADEQUACY OR COMPLETENESS OF
OR RESULTS TO BE OBTAINED FROM USING THE WORK, INCLUDING ANY INFORMATION
THAT CAN BE ACCESSED THROUGH THE WORK VIA HYPERLINK OR OTHERWISE, AND
EXPRESSLY DISCLAIM ANY WARRANTY, EXPRESS OR IMPLIED, INCLUDING BUT NOT LIM-
ITED TO IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR
PURPOSE. McGraw-Hill and its licensors do not warrant or guarantee that the functions contained in the
work will meet your requirements or that its operation will be uninterrupted or error free. Neither McGraw-
Hill nor its licensors shall be liable to you or anyone else for any inaccuracy, error or omission, regardless
of cause, in the work or for any damages resulting therefrom. McGraw-Hill has no responsibility for the
content of any information accessed through the work. Under no circumstances shall McGraw-Hill and/or
its licensors be liable for any indirect, incidental, special, punitive, consequential or similar damages that
result from the use of or inability to use the work, even if any of them has been advised of the possibility
of such damages. This limitation of liability shall apply to any claim or cause whatsoever whether such
claim or cause arises in contract, tort or otherwise.
DOI: 10.1036/0071495940
Professional
Want to learn more?
We hope you enjoy this
McGraw-Hill eBook! If
you’d like more information about this book,
its author, or related books and websites,
please click here.
To my wife, Jackie,
and our children and grandchildren.
About the Author
Sammy G. Shina, P.E., is a professor of mechanical
engineering at the University of Massachusetts Lowell,
and has previously lectured at the University of
Pennsylvania’s EXMSE Program and at the University
of California, Irvine. He is a past chairman of the
Society of Manufacturing Engineers (SME) Robotics/
FMS and a founding member of the Massachusetts
Quality Award. He is the founder of the New England
Lead-Free Consortium, with over 30 contributing
companies which are engaged in electronics products
and their supply chain since its inception in 1999. The
consortium is actively researching, testing, and evaluat-
ing materials and processes for lead-free and RoHS
compliance, and it is funded by TURI, EPA, and the
member companies. The consortium has published
over 40 papers; some were translated into Asian lan-
guages and won a regional EPA Environmental Merit
Award for the business category in May 2006. Dr. Shina
is the author of two best-selling books on concurrent
engineering, and a Six Sigma book, and he authored
twochapters and over 100 technical publications in his
fields of research.
Dr. Shina is an international consultant, trainer,
and seminar provider on lead-free, quality, Six Sigma,
and DoE as well as project management, technology
supply chains, product design and development, and
electronics manufacturing and automation. He worked
for 22 years in high-technology companies developing
new products and state-of-the-art manufacturing
technologies. He was the speaker for the HP Executive
Seminars on Concurrent Product/Process Design,
Mechanical CAD Design and Test, and the Motorola
Six Sigma Institute. He received S.B. degrees in electrical
engineering and industrial management from MIT, a
S.M. degree in computer science from WPI, and a Sc.D.
degree in mechanical engineering from Tufts University.
He resides in Framingham, Massachusetts.
Copyright © 2008 by The McGraw-Hill Companies, Inc. Click here for terms of use.
For more information about this title, click here
Contents
Illustrations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xv
Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xix
Preface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xxi
Acknowledgments . . . . . . . . . . . . . . . . . . . . . . . . . . . . xxv
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xxvii
1 Environmental Progress in Electronics
Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Historical Perspective . . . . . . . . . . . . . . . . . . . . 1
1.2 The Development of Green Design and
Manufacturing Competency . . . . . . . . . . . . . . 4
1.3 Green Design and the New Product
Life Cycle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.3.1 Green Supply Chain Development . . 6
1.4 Adverse Design Consequences to
Improper Adoption of Green Materials
and Processes . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.5 Implementing a Successful Green Design and
Manufacturing of Products, Using Quality
Tools and Techniques . . . . . . . . . . . . . . . . . . . . 9
1.6 Organization of the Rest of the Chapters
forGreenElectronics Design and
Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Part I . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Part II . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Part III . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2 Statistical Analysis of Green Electronic
Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2.1 Process Average and Standard Deviation
Calculations for Samples and
Population . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
2.1.1 Other Statistical Tools: Error,
Sample Size, and Point and Interval
Estimation . . . . . . . . . . . . . . . . . . . . . . . 23
2.1.2 Confi dence Interval Estimation for the
Average . . . . . . . . . . . . . . . . . . . . . . . . . 24
2.1.3 Standard Deviation for Samples and
Populations . . . . . . . . . . . . . . . . . . . . . . 25
v
vi
Contents
2.2 Determining Process Capability . . . . . . . . . . . 27
2.2.1 Process Capability for Large-Volume
Production . . . . . . . . . . . . . . . . . . . . . . . 27
2.2.2 Determination of Standard Deviation
for Process Capability . . . . . . . . . . . . . 28
2.2.3 Example of Methods of Calculating σ . . . 29
2.2.4 Process Capability for Low-Volume
Production . . . . . . . . . . . . . . . . . . . . . . . 30
2.3 Process Capability for Prototype New
Green Parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
2.4 Statistical Methods Conclusions . . . . . . . . . . . 34
2.5 Design of Experiments . . . . . . . . . . . . . . . . . . . 34
2.5.1 DoE Defi nitions and Expectations . . . 35
2.5.2 DoE Techniques . . . . . . . . . . . . . . . . . . 36
2.5.3 DoE Analysis Tool Set . . . . . . . . . . . . . 46
2.5.4 Using DoE Methods for Various
Phases of Green Material and Process
Selection . . . . . . . . . . . . . . . . . . . . . . . . . 57
2.5.5 DoE Section Conclusions . . . . . . . . . . 64
References and Bibliography . . . . . . . . . . . . . . 64
3 Reliability of Green Electronic Systems . . . . . . . . . 67
3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
3.1.1 What Is Reliability? . . . . . . . . . . . . . . . 67
3.1.2 Measures of Reliability . . . . . . . . . . . . 68
3.1.3 Weibull Distribution Example . . . . . . 69
3.1.4 Reliability in the Context of Green
Electronics . . . . . . . . . . . . . . . . . . . . . . . 72
3.2 Lead-Free Solder Interconnections . . . . . . . . . 73
3.2.1 Lead-Free Solders and the Tin/Lead
Baseline . . . . . . . . . . . . . . . . . . . . . . . . . 73
3.2.2 Lead-Free Solders and Their Properties
That Affect Reliability . . . . . . . . . . . . . 75
3.2.3 Test Environments of Greatest
Interest . . . . . . . . . . . . . . . . . . . . . . . . . . 77
3.2.4 Thermal Cycling Fatigue Life Behavior
of Tin/Lead and SAC Alloys . . . . . . . 80
3.2.5 Effects of Thermal Dwell Time and
Maximum Temperature Stress
Relaxation or Creep . . . . . . . . . . . . . . . 84
3.2.6 Calculation of Thermal Cycling
Field Life Based on Thermal Cycling
Test Data . . . . . . . . . . . . . . . . . . . . . . . . 87
3.2.7 Mechanical Shock and Vibration . . . . 88
3.2.8 Other Considerations: New Failure
Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
vii
Contents
3.3 The Challenge of Rework, Repair, and
Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
3.3.1 Rework-Induced Damage and
Associated Failure Modes for
Printed-Wiring Boards . . . . . . . . . . . . . 93
3.3.2 Rework-Induced Damage to
Components . . . . . . . . . . . . . . . . . . . . . 96
3.3.3 Special Considerations
for Repair . . . . . . . . . . . . . . . . . . . . . . . . 99
3.4 Lead-Free Solderable Finishes . . . . . . . . . . . . . 100
3.4.1 Pure Tin Finishes and
Tin Whiskers . . . . . . . . . . . . . . . . . . . . . 100
3.4.2 Tin/Bismuth Interaction with
Tin/Lead . . . . . . . . . . . . . . . . . . . . . . . . 118
3.4.3 Champagne Voids with Immersion
Silver . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
3.5 Printed-Circuit Board Reliability Issues . . . . . 120
3.5.1 Crater Cracks . . . . . . . . . . . . . . . . . . . . 120
3.6 Aerospace and High-Performance Electronics
Industry Standards . . . . . . . . . . . . . . . . . . . . . . 122
3.6.1 Released Documents for the
Aerospace and High-Performance
Electronics Industry . . . . . . . . . . . . . . . 123
3.6.2 Documents under
Development . . . . . . . . . . . . . . . . . . . . . 124
3.7 Connector Issues . . . . . . . . . . . . . . . . . . . . . . . . 125
3.7.1 Cadmium Usage in Connectors . . . . . 125
3.7.2 Tin Usage in Connectors . . . . . . . . . . . 126
3.8 Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
Industry Standards . . . . . . . . . . . . . . . . . . . . . . 129
Websites . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
4 Environmental Compliance Strategy and
Integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
4.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
4.2 Describing the Imperative . . . . . . . . . . . . . . . . 133
4.3 Constructing the Team . . . . . . . . . . . . . . . . . . . 134
4.3.1 Planning Process Outputs . . . . . . . . . . 136
4.4 Developing the Strategy . . . . . . . . . . . . . . . . . . 137
4.5 Gaining Approval of the Strategy . . . . . . . . . . 138
4.6 Launching the Initiative . . . . . . . . . . . . . . . . . . 138
4.6.1 Communicating Companywide . . . . 139
4.7 Driving the Project . . . . . . . . . . . . . . . . . . . . . . . 141
4.7.1 Manufacturing Technology Track . . . . . 141
4.7.2 Supply Chain Track . . . . . . . . . . . . . . . . . 145
viii
Contents
4.7.3 Product Design (Design for
Environment) Track . . . . . . . . . . . . . . . . . 147
4.7.4 Market and Environmental
Regulations Track . . . . . . . . . . . . . . . . . . . 147
4.8 Refl ecting on the Environmental Compliance
Strategy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148
4.9 Conclusions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149
5 Managing the Global Design Team in Compliance
with Green Design and Manufacturing . . . . . . . . . 151
5.1 Introduction to Implementing Green Design
for Electronic Products with Global Teams . . 151
5.2 Understanding the Scope of the European
Union Environmental Directives . . . . . . . . . . . 152
5.2.1 The Restriction of Hazardous Substances
(RoHS) Directive . . . . . . . . . . . . . . . . . 153
5.2.2 Understanding Affected Product
Categories . . . . . . . . . . . . . . . . . . . . . . . 153
5.2.3 Currently Exempted Product
Categories . . . . . . . . . . . . . . . . . . . . . . . 154
5.2.4 China RoHS . . . . . . . . . . . . . . . . . . . . . . 154
5.2.5 Electromagnetic Compatibility (EMC)
Directive . . . . . . . . . . . . . . . . . . . . . . . . 155
5.2.6 Waste from Electrical and Electronic
Equipment (WEEE) . . . . . . . . . . . . . . . 155
5.3 Global Legislation for Green Products . . . . . . 155
5.4 The Global RoHS Implementation
Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156
5.5 The Local RoHS Implementation Team . . . . . 159
5.6 The Product Industrialization Team . . . . . . . . 160
5.7 Communications among Global Teams . . . . . 162
5.8 Understand Which Products in Your Portfolio
to Redesign . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163
5.9 The Project Directory for Local Control . . . . . 164
5.10 Components Obsolescence Resulting from
Green Conversion . . . . . . . . . . . . . . . . . . . . . . . 167
5.11 Quality and Reliability . . . . . . . . . . . . . . . . . . . 167
5.12 Lead-Free Assembly Process . . . . . . . . . . . . . . 169
5.13 Communicating with and Qualifying Local
and Overseas Manufacturing Facilities . . . . . 170
5.14 Product Compliance Information
Decisions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171
5.15 Brand Label Management . . . . . . . . . . . . . . . . 172
5.16 Data and Documentation Requirements . . . . 173
5.17 Risk Management . . . . . . . . . . . . . . . . . . . . . . . 173