Encyclopedia of Materials Characterization: Surfaces, Interfaces, Thin Films

782 Pages·1992·19.47 MB·English

by  Charles Evans, Richard Brundle, Wilson

ENCYCLOPEDIA OF MATERIALS CHARACTERIZATION
MATERIALS CHARACTERIZATION SERIES
Surfaces, Interfaces, Thin Films
Series Editors: C. Richard Brundle and Charles A. Evans, Jr.
Series Titles
Encyclopedia of Materiah Characterization, C. Richard Brundle,
Charles k Evans, Jr., and Shaun Wilson
Characterization of Mekth and Alloys, Paul.H . Holloway and P. N.
Vaidyanathan
Characterizationo f Ceramics, Ronald E. Loehman
Characterimtion of Pobmers, Ned J. Chou, Stephen P. Kowalczyk,
Ravi Sard, and Ho-Ming Tong
Characterization in Silicon Processing, Yale Strausser
Characterization in Compound Semiconductor Processing,
Yale Strausser
Characterization of Integraed Circuit Packaging Materiah,
Thomas M. Moore and Robert G. McKenna
Characterization of Cadytic Materiah, Israel E. Wachs
Characterizationo f Composite Materiah, Hatsuo Ishida
Characterization of Optical Materiah, Gregory J. Exarhos
Characterization of Tribological Materiah, William A. Glaeser
Characterization of Organic Thin Films,A braham Ulman
ENCYCLOPEDIA
OF MLATERIALS
CHARACTERIZATION
Surfaces, Interfaces, Thin Films
EDITORS
C Ricbard Brundle
Charles A. Evans,J r.
Sbaun Wihon
MANAGING EDITOR
Lee E. Fitzpatrick
BUTTERWORTH-HEINEMANN
Boston London Oxford Singapore Sydney Toronto Wellington
MANNING
Greenwich
This book was acquired, developed, and produced by Manning PublicationsC o.
Copyright Q 1992 by Butxetworch-Heinemann, a division of Reed Publishing CUSA) Inc
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Recognizing the importance of preserving what has been written, it is the policy of
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Library of Congress Cataloging-in-Publication Data
Brundle, C. R.
Encyclopedia of materials characterization: surfaces, interfaces, thin films/C. Richard Brundle, Charles A. Evans,
Jr., Sham Wilson.
p. un.--(Materials characterization series)
Indudes bibliographical refrrenoa and index.
ISBN CL7506-9168-9
1. Surfaces (Tedmoology)-Tes~ I. Evans, Charlak 11. Wilson, Shaun. 111. Title. IV. Series.
TA418.7.B73 I992 92-14999
620’.4Pdc20 CIP
Butterworth-Heinemann
80 Montvale Avenue
Stoneham, MA02180
Manning Publications Co.
3 h i sS treet
Greenwich, CT 06830
1 0 9 8 7 6 5 4 3
Printed in the Unired States ofAmerica
Contents
Preface to Series ix
Preface x
Acronyms Glossary xi
Contributors xvi
INTRODUCTION AND SUMMARIES
1.0 Introduction I
Technique Summaries 7-56
IMAGING TECHNIQUES (MICROSCOPY)
2.0 Introduction 57
2.1 Light Microscopy 60
2.2 Scanning Electron Microscopy, SEM 70
2.3 Scanning Tunneling Microscopy and
Scanning Force Microscopy, STM and SFM 85
2.4 Transmission Electron Microscopy, TEM 99
ELECTRON BEAM INSTRUMENTS
3.0 Introduction 117
3.1 Energy-Dispersive X-Ray Spectroscopy, EDS 120
3.2 Electron Energy-Loss Spectroscopy in the
Transmission Electron Microscope, EELS 135
3.3 Cathodoluminescence, CL 149
3.4 Scanning Transmission Electron Microscopy, STEM 161
3.5 Electron Probe X-Ray Microanalysis, EPMA 175
V
STRUCTURE DETERMINATION BY DIFFRACTION AND SCATTERING
4.0 Introduction 193
4.1 X-Ray Diffraction, XRD 198
4.2 Extended X-Ray Absorption Fine Structure, EXAFS 214
4.3 Su&ce Extended X-Ray Absorption Fine Structure and
Near Edge X-Ray Absorption Fine Structure, SEXAFS/NEXAFS 227
4.4 X-Ray Photoelectron and
Auger Electron Difiction, XPD and AED 240
4.5 Low-Energy Electron Diffraction, LEED 252
4.6 Reflection High-Energy Electron Diffraction, WEED 264
ELECTRON EMISSION SPECTROSCOPIES
5.0 Introduction 279
5.1 X-Ray Photoelectron Spectroscopy, XPS 282
5.2 Ultraviolet Photoelectron Spectroscopy, UPS 300
5.3 Auger Electron Spectroscopy, AES 310
5.4 Reflected Electron Energy-loss Spectroscopy,
REELS 324
X-RAY EMISION TECHNIQUES
6.0 Introduction 335
6.1 X-Ray Fluorescence, XRF 338
6.2 Total Reflection X-Ray Fluorescence Analysis, TXRF 349
6.3 Particle-Induced X-Ray Emission, PIXE 357
VISIBLE/W EMISSION, REFLECTION, AND ABSORPTION
7.0 Introduction 371
7.1 Photoluminescence, PL 373
7.2 Modulation Spectroscopy 385
7.3 Variable Angle Spectroscopic Ellipsometry, VASE 401
VIBRATIONAL SPECTROSCOPIES AND NMR
8.0 Introduction 413
8.1 Fourier Transform Infrared Spectroscopy, FTIR 416
8.2 RamanSpectroscopy 428
8.3 High-Resolution Electron Energy Loss Spectroscopy, HREELS 4-42
8.4 Solid State Nuclear Magnetic Resonance, NMR 460
vi Contents
ION SCATTERING TECHNIQUFS
9.0 Introduction 473
9.1 Rutherford Backscattering Spectrometry, RBS 476
9.2 Elastic Recoil Spectrometry, ERS 488
9.3 Medium-Energy Ion Scattering with
Channeling and Blocking, MEIS 502
9.4 Ion scattering Spectroscopy, Iss 514
MASS AND OPTICAL SPECTROSCOPIES
10.0 Introduction 527
10.1 Dynamic Secondary Ion Mass Spectrometry, Dynamic SIMS 532
10.2 Static Secondary Ion Mass Spectrometry, Static SIMS 549
10.3 Surfice Analysis by h e rI onization, SAL1 559
10.4 Sputtered Neutral Mass Spectrometry, SNMS 571
10.5 Laser Ionization Mass Spectrometry, LIMS 586
10.6 Spark Source Mass Spectrometry, SSMS 598
10.7 Glow-Discharge Mass Spectrometry, GDMS 609
10.8 Inductively Coupled Plasma Mass Spectrometry, ICPMS 624
10.9 Inductively Coupled Plasma-Optical
Emission Spectroscopy, ICP-OES 633
NEUTRONANDNUCLEARTECHNIQUES
1'1.0 Introduction 645
1 1. I Neutron Diffraction 648
11.2 Neutron Reflectivity 660
11.3 Neutron Activation Analysis, NAA 671
11.4 Nuclear Reaction Analysis, NRA 680
PHYSICAL AND MAGNETIC PROPERTIES
12.0 Introduction 695
12.1 Surface Roughness: Measurement, Formation by
Sputtering, Impact on Depth Profiling 698
12.2 Optical Scatterometry 711
12.3 Magneto-optic Kerr Rotation, MOJSE 723
12.4 Physical and Chemical Adsorption Measurement of
Solid Surface Areas 736
Contents vii