Electronic Design - January 2016

54 Pages·2015·9.98 MB·English

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January 2016 electronicdesign.com
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January 2016 VOLUME 64, ISSUE 1
InThisIssue
FEATURES
14 PERFORMANCE, POWER, AND SECURITY TOP DIGITAL
HARDWARE TRENDS
We take a look at the hardware trends for 2016—and, no surprise,
the Internet of Things is making its presence known.
18 IoT FRAMEWORKS/DEVELOPMENT TO DOMINATE
SOFTWARE INDUSTRY IN 2016
Wi-Fi, Bluetooth, 802.15.4, Z-Wave, and DECT technologies,
among others, can meet specifc needs for developers across
the IoT spectrum.
22 WIRELESS-CHARGING TECHNOLOGIES:
TRANSFORMING THE MOBILE WORLD 14-26
Manufacturers and developers are scrambling to fnd a global wireless-
charging standard for interoperability between devices.
26 IN COMMUNICATIONS, “MORE” AND “FASTER”
ARE THE WATCHWORDS
Key wireless technologies continue to evolve to meet changing needs and
opportunities. Eight software-programmable output +V +V
ranges: 0 V to 5 V, 0 V to 10 V,
30 NEW DAC ARCHITECTURES ADDRESS DIVERSE SYSTEM 0 V ±to1 01 6V V, a, n0d V − t2o. 52 0V Vto, ±+37 .V5, V±;5 V, VDDDVCCALERT
DESIGN CHALLENGES 5% overrange VREF SDI
Gain SCLK
The latest bipolar digital-to-analog converter topologies take on diffcult control 30 +aVdjustment VOUT 1AD5761R_1SSYDNOC
and measurement tasks across a variety of industrial applications. –IN DGND CRLEESAERT
34 USB TYPE-C IS REVOLUTIONIZING THE MARKET RG IA AGNDVSSLDAC
The USB type-C connector is expected to grow fast in the mobile, consumer +N –V SW +IN +V –V VREF+V
Precision SDI
electronics, and computer markets. Excitation trabnrsiddugcee r RG IA ADCSSYCNLCK
signal –IN SDO
+V SW –V +V +V
+IN –V
NEWS & ANALYSIS COLUMNS &
DEPARTMENTS RG IA VDDDVCCALERT
1101 SMNPIRALOOISCDTAOUO NLLTOEY SLAPA WNEBSSSI T T HHBOUU TUZMEZNLAEIINGNVEGEOSR II SDFSIO TRBIROUE SYZB OIOGUTB T EE 9 EMNDeeIweTt O AElRneacIAltorogLn/iPc oDweesrig n ’s –N –aVdjOusfftmseetnt VOUT 2DAVGDNRED5F761R_2CRSSLESYECSDNSALEDOCKRTI
Editor AGNDVSSLDAC
12 LOW-POWER WIDE-AREA NETWORKS –V *Can all be tied together
GAIN IoT FOOTHOLDS 42 NEW PRODUCTS
34
48 LAB BENCH
IDEAS FOR DESIGN Displa yPort USB Micro-B
High-End Dev Kits
37 COMPARING THE NE555 TIMER AND Deliver Advanced
4.7 mm
LM386 AMPLIFIER AS INDUCTORLESS Features 1.8 mm
DC-DC CONVERTERS
4.0 mm 2.4 mm
Power USB Type-C co mbine sall in one
EDITORIAL MISSION:
2008 S20I0L8 VWinEneRr To provide the most current, accurate, and in-depth
EDITORIAL technical coverage of the key emerging technologies that
AWARD OF engineers need to design tomorrow’s products today.
EXCELLENCE
ELECTRONIC DESIGN (ISSN 0013-4872) is published monthly by Penton Media Inc., 9800 Metcalf Ave., Overland Permission is granted to users registered with the Copyright Clearance Center Inc. (CCC) to
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GO TO ELECTRONICDESIGN.COM
on
11 MYTHS ABOUT THE
INTERNET OF THINGS
RESEARCH LOOKS TO
http://electronicdesign.com/iot/11-myths-about-internet-things
BOLSTER QUANTUM
In the frst installment of our new online feature, “11 Myths,”
Technology Editor Bill Wong takes a look at many of the
COMPUTING
things we’ve all been hearing about the Internet of Things—
and just how true they are.
http://electronicdesign.com/microprocessors/new-research-
injects-optimism-question-quantum-computers PANELIZATION GUIDELINES
FOR PCB DESIGNERS
Researchers at the Technical University of Munich (TUM)
have taken the latest step toward incorporating quantum
devices into computer technology, inventing semiconductor http://electronicdesign.com/boards/pcb-
nanostructures that process information using quantum bits.  designers-need-know-these-panelization-guidelines
Unplanned delays and
redesigns can be avoided by
following common-sense
PCB processing edge and
array guidelines, as well as
understanding the basics of
the assembly methods.
join us online
Follow us on Facebook: http://tinyurl.com/odzo6hc
and Twitter: http://tinyurl.com/k5pum39
CURBING THE blogs
COST OF WIRELESS
PRODUCTION TEST
LOU FRENZEL • 3 New Versions of Ethernet
COMMUNICATIONS You Should Know About
http://electronicdesign.com/test-measurement/curb-rising-cost- BILL WONG • Getting at the Core of
wireless-production-test
EMBEDDED/SYSTEMS/ Windows 10
Tomorrow’s wireless test challenges will require a combination SOFTWARE
of lightning-fast instrumentation, a new approach to wire-
less test, and the engineering expertise required to put it all PATRICK MANNION • Turning Debug into
together. TEST AND MEASUREMENT Hardware-Based IoT Security
4 JANUARY 2016 ELECTRONIC DESIGN
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6 JANUARY 2016 ELECTRONIC DESIGN
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