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Electrochemical Methods of Nanostructure Preparation PDF

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Monographs in Electrochemistry Series Editor: Fritz Scholz László Péter Electrochemical Methods of Nanostructure Preparation Monographs in Electrochemistry SeriesEditor FritzScholz,UniversityofGreifswald,Greifswald,Germany Surprisingly,alargenumberofimportanttopicsinelectrochemistryarenotcovered byup-to-datemonographsandseriesonthemarket,sometopicsareevennotcovered at all. The series “Monographs in Electrochemistry” fills this gap by publishing in-depth monographs written by experienced and distinguished electrochemists, covering both theory and applications. The focus is set on existing as well as emergingmethodsforresearchers,engineers,andpractitionersactiveinthemanyand ofteninterdisciplinaryfields,whereelectrochemistryplaysakeyrole.Thesefields range – among others – from analytical and environmental sciences to sensors, materialssciencesandbiochemicalresearch. Moreinformationaboutthisseriesathttp://www.springer.com/series/7386 László Péter Electrochemical Methods of Nanostructure Preparation LászlóPéter WignerResearchCentreforPhysics Budapest,Hungary ISSN1865-1836 ISSN1865-1844 (electronic) MonographsinElectrochemistry ISBN978-3-030-69116-5 ISBN978-3-030-69117-2 (eBook) https://doi.org/10.1007/978-3-030-69117-2 ©SpringerNatureSwitzerlandAG2021 Thisworkissubjecttocopyright.AllrightsarereservedbythePublisher,whetherthewholeorpartof thematerialisconcerned,specificallytherightsoftranslation,reprinting,reuseofillustrations,recitation, broadcasting,reproductiononmicrofilmsorinanyotherphysicalway,andtransmissionorinformation storageandretrieval,electronicadaptation,computersoftware,orbysimilarordissimilarmethodology nowknownorhereafterdeveloped. Theuseofgeneraldescriptivenames,registerednames,trademarks,servicemarks,etc.inthispublication doesnotimply,evenintheabsenceofaspecificstatement,thatsuchnamesareexemptfromtherelevant protectivelawsandregulationsandthereforefreeforgeneraluse. Thepublisher,theauthorsandtheeditorsaresafetoassumethattheadviceandinformationinthisbook arebelievedtobetrueandaccurateatthedateofpublication.Neitherthepublishernortheauthorsor theeditorsgiveawarranty,expressedorimplied,withrespecttothematerialcontainedhereinorforany errorsoromissionsthatmayhavebeenmade.Thepublisherremainsneutralwithregardtojurisdictional claimsinpublishedmapsandinstitutionalaffiliations. ThisSpringerimprintispublishedbytheregisteredcompanySpringerNatureSwitzerlandAG Theregisteredcompanyaddressis:Gewerbestrasse11,6330Cham,Switzerland Preface of Series Editor Currentchemicalandelectrochemicalliteratureaboundsintitlesreferringtonano, andsoonemayask,whyanotherbookdealingwithnanostructures?Ihopethatthe readersofthismonographwillagreewhenIclaimthatthisbookissomethingelse, thatitisreallywrittentosupportthescientificcommunityforalongtime.Although the innovation rate in the area of nanostructures is very high both with respect to synthesisandcharacterization,therewillremainasolidbodyofknowledge,which ispresentedinthismonograph.Itisabigadvantageofthismonographthatitis“from onemould”,andnotacollectionofreviewsfrommanydifferentauthors.Theauthor, LászlóPéterfromtheWignerResearchCentreforPhysicsinBudapest,Hungary,is adistinguishedelectrochemistwithlongexperienceinelectrochemicalplatingand nano-structuringofsurfaces.Heisalsoahighlygiftedlecturerandteacher,which allowedhimtogivethisbookaremarkablydidacticcharacter.Thismonographattests tohisencyclopaedicknowledgeoftheliterature,whichheisabletooverviewandto disseminateamongawidescientificaudience,notonlytospecialists,butalsotothe uninitiated,notonlytoelectrochemists,butalsotoanyscientistsinterestedinnano structures. Greifswald,Germany FritzScholz June2020 v Contents PartI Background 1 Introduction .................................................. 3 1.1 The“Nano”Era .......................................... 3 1.2 TheConceptofThisBook ................................. 5 References .................................................... 8 2 ElectrochemistryandElectrodeposition ......................... 11 2.1 TheGoalofThisOverview ................................ 11 2.2 Charge Transfer in Heterogeneous Electrochemical Systems ................................................. 11 2.3 ElectrodesandElectrochemicalCells ....................... 12 2.4 ElectrodeClassificationBasedontheElectrodeReaction(s) .... 14 2.5 TheNatureoftheElectronConductor/SolutionInterface ....... 16 2.6 ElectrodesinExperimentalCells ........................... 19 2.7 PolarizationandElectrochemicalDevices .................... 20 2.8 BasicElectrodeKinetics .................................. 22 2.8.1 ActivationControl ............................... 22 2.8.2 InfluenceofReactantTransportontheElectrode Processes ....................................... 24 2.8.3 Basic Voltammetric Experiments for Metal Deposition ...................................... 29 2.9 Towards the Electrodeposition of Metals: Crystals andTheirSurfaces ....................................... 31 2.9.1 BasicCrystallography ............................ 31 2.9.2 DefectsonCrystalSurfacesandWithinCrystals ..... 33 2.10 NucleationDuringElectrochemicalPhaseFormation .......... 35 2.10.1 NucleationandGrowthModes ..................... 36 2.11 MajorFactorsoftheGrainStructureofElectrodeposited Metals .................................................. 41 2.12 CompositionAspectsofAlloyElectrodeposition .............. 46 2.12.1 SelectionoftheVariables ......................... 46 2.12.2 BasicCodepositionModes ........................ 47 vii viii Contents 2.12.3 StructuralConsequencesofAlloyFormation ........ 50 2.13 BehaviourofMetalsDuringAnodicPolarization ............. 51 References .................................................... 53 3 ExperimentalMethodsinCharacterizationofNanosystems ....... 55 3.1 TheNatureofSuchMethodologicalOverviews ............... 55 3.2 Non-destructiveAnalysisMethodswithIrradiation ............ 56 3.2.1 ClassificationoftheIrradiation-BasedMethods ...... 56 3.2.2 DiffractionMethods .............................. 62 3.2.3 Methods Involving Ionization and Used forChemicalAnalysis ............................ 65 3.3 ThermalAnalysis ........................................ 67 3.4 MechanicalTests ......................................... 68 3.5 ScanningProbeMethods .................................. 71 3.6 CorrosionStudies ........................................ 73 References .................................................... 75 PartII Nanostructured Materials Obtained by Using Non-structuredSubstratesofLargeSurfaceArea 4 UltrathinLayers .............................................. 79 4.1 LayerPreparationMethodsBasedSolelyonUPDProcesses .... 79 4.1.1 AtomicLayerDepositionProcesses ................ 79 4.1.2 Layer-by-LayerElectrodepositionBasedonALD .... 81 4.1.3 OptimizationoftheEC-ALDProcesses ............. 83 4.1.4 CharacterizationoftheComposition,Structure andSemiconductorPropertiesofEC-ALDLayers .... 89 4.1.5 MulticomponentandSuperlatticeStructures ObtainedwithEC-ALD .......................... 93 4.1.6 VariousNanostructureDepositionProcesses BasedonUPDPrinciples ......................... 96 4.2 CombinationofUPDwithOtherSurface-Area-Limited Processes ............................................... 98 4.2.1 Surface-LimitedRedoxReplacementProcesses ...... 98 4.2.2 SubstratesandDisplacementPairsinSLRR Processes ....................................... 100 4.2.3 StructuralAspectsoftheSLRRProcesses ........... 104 4.2.4 ApplicationofSLRRDeposits ..................... 107 4.3 Non-UPDDepositionofUltrathinMetallicLayers ............ 109 4.3.1 Electrodeposition of Ultrathin Layers withSelf-limitingProcesses ....................... 109 4.3.2 Atomic-ScaleObservationoftheInitialPhase oftheLayerGrowth .............................. 112 4.3.3 MagnetizationofUltrathinElectrodeposited Layers ......................................... 119 References .................................................... 126 Contents ix 5 CompositionallyModulatedandMultilayeredDeposits ........... 133 5.1 OntheElectrodepositionofNanolaminatedMaterials ......... 133 5.2 Multiple-BathMethods ................................... 133 5.2.1 CommonFeaturesoftheMultiple-BathMethods ..... 133 5.2.2 TheSequentialImmersionMethod ................. 134 5.2.3 CellConfigurationswithaRotatingCathode ......... 138 5.2.4 BathChangebyUsingFlowCellsWithMultiple SolutionInlets ................................... 139 5.3 TheSingle-BathMethod .................................. 141 5.3.1 Impact of the Codeposition Mode of the Components on the Composition ModulationDuringTwo-PulsePlating .............. 141 5.3.2 MultilayerFormationwithSingle-PulsePlating andDisplacement ................................ 146 5.3.3 MultilayerFormationwithVariousElectrical Waveforms ..................................... 148 5.3.4 Multilayer Formation with Transport Rate Modulation ..................................... 150 5.4 PropertiesofElectrodepositedCMAs ....................... 152 5.4.1 Composition Variation in Ultrathin ElectrodepositedAlloyLayers ..................... 152 5.4.2 StructuralFeaturesofDepositsWithModulated Composition .................................... 156 5.4.3 Mechanical Properties of Compositionally ModulatedDeposits .............................. 161 5.4.4 Corrosion Properties of Compositionally ModulatedDeposits .............................. 164 5.4.5 Magnetic and Magnetoresistance Properties ofElectrodepositedMultilayers .................... 165 5.4.6 Magneto-ionics .................................. 173 5.4.7 Annealing Behaviour of Electrodeposited Multilayers ..................................... 174 References .................................................... 176 6 NanocrystallineDeposits ....................................... 183 6.1 General Considerations Concerning Nanocrystalline Deposits ................................................ 183 6.1.1 ScopeofThisChapter ............................ 183 6.1.2 About the History of the Research onNanocrystallineMaterials ...................... 184 6.1.3 ElectrochemicalTechniquesintheDeposition ofNanocrystallineMaterials ...................... 185 6.1.4 PropertiesofNanocrystallineMaterials ............. 187 6.2 NanocrystallineDepositsofMetallicElements ............... 192 6.2.1 NobleMetals:Au,AgandPd ..................... 192 x Contents 6.2.2 Copper ......................................... 195 6.2.3 Nickel ......................................... 197 6.2.4 MiscellaneousTransitionMetals ................... 200 6.3 ElectrodepositedNanocrystallineAlloys ..................... 202 6.3.1 Ni–CuAlloys ................................... 202 6.3.2 MutualAlloysoftheIronGroupMetals ............ 203 6.3.3 AlloysofIronGroupMetalswithMolybdenum orTungsten ..................................... 205 6.3.4 AlloysofIronGroupMetalswithPalladium andPlatinum .................................... 207 6.3.5 Alloysof4dTransitionMetalswithMetalloid Element(s) ...................................... 208 References .................................................... 210 7 Composites ................................................... 217 7.1 CompositePreparationbyCodepositionofMetals ............ 217 7.1.1 Principles of the Direct Codeposition ofCompositesandTheirPrecursorAlloys ........... 217 7.1.2 Cu(Co)Alloys .................................. 220 7.1.3 Ag(Co)Alloys .................................. 222 7.1.4 Cu(Ag)Alloys .................................. 224 7.1.5 MiscellaneousCompositesObtainedwithMetal Codeposition .................................... 225 7.2 CompositeDepositionfromParticleSuspensions ............. 227 7.2.1 Preliminary Remarks on the Importance ofCompositePlating ............................. 227 7.2.2 TheoriesofStabilityofSuspensionsandTheir Coagulation ..................................... 228 7.2.3 Theories of Particle Incorporation During Electroplating ................................... 230 7.2.4 ExperimentalObservationoftheMetalGrowth DuringParticleCodeposition ...................... 234 7.2.5 KeyExperimentalParametersinSuspension Plating ......................................... 235 7.2.6 ComparisonoftheCodepositionofMicrometric andNanometricParticles ......................... 240 7.2.7 GrainSizeandHardnessofGranularCoatings ....... 241 7.2.8 Influence of the Incorporated Particles ontheWearDamageandFrictionoftheCoatings .... 243 7.2.9 HydrophobicDispersionCoatings .................. 244 7.2.10 SuspensionPlatingwithMagneticParticles .......... 245 7.2.11 Role of the Incorporation of Inert Particles in the Corrosion and Oxidation Behaviour ofMetals ....................................... 246

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