Design of Terahertz CMOS Integrated Circuits for High-Speed Wireless Communication

199 Pages·2019·26.076 MB·English

by  Minoru Fujishima, Shuhei Amakawa

IETMATERIALS,CIRCUITSANDDEVICESSERIES35
Design of Terahertz CMOS
Integrated Circuits for
High-Speed Wireless
Communication
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Design of Terahertz CMOS
Integrated Circuits for
High-Speed Wireless
Communication
Minoru Fujishima and Shuhei Amakawa
TheInstitutionofEngineeringandTechnology
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Contents
Preface vii
1 Introduction 1
1.1 Terahertzcommunication 1
1.2 300-GHz-bandwirelessthatrealizes100Gbit/s 8
1.3 Recentprogressofterahertzintegratedcircuitsfor
communications 16
1.3.1 Reviewof300-GHzbandwirelesscommunication 16
1.3.2 300-GHztransmittersandreceivers 16
1.4 RecentprogressofterahertzCMOScircuits 19
1.4.1 TechnicalbackgroundofterahertzCMOScircuitdesign 19
1.4.2 Devicecharacterizationandmodeling 20
1.4.3 TerahertzCMOSbuilding-blockdesign 22
1.4.4 Outlook 23
References 23
2 Amplifierdesign 27
2.1 Amplifiertheory 27
2.1.1 Introduction 27
2.1.2 Maximumconditionallystablegain 29
2.1.3 Possibleapplicationtoamplifierdesign 35
2.1.4 Summaryanddiscussion 39
2.2 Gainandnoiseoptimizationofsmall-signalamplifier 41
2.3 Gain-boostingbyfeedback 43
2.3.1 Introduction 43
2.3.2 Gainandstabilityoffeedbackamplifier 44
2.3.3 Gainboostingbylosslessreciprocalfeedback 49
2.3.4 Graphicaldesignoffeedbacknetwork 51
2.3.5 Gainboostingusingleakytappedtransformer 57
2.4 Compactlayouttechniques 60
2.4.1 “Fishbone”layoutforsingle-endedamplifiers 60
2.4.2 Extensionof“fishbone”fordifferentialamplifiers 61
2.4.3 Design 62
2.4.4 Resultsanddiscussion 66
2.4.5 Conclusion 69
References 70
vi DesignofterahertzCMOSintegratedcircuits
3 PhysicaldesigntechniquesforRFCMOS 75
3.1 Physicaldesign 75
3.1.1 Bond-baseddesign 75
3.1.2 Power-linedecoupling 75
3.2 Measurementandde-embedding 80
3.2.1 Probinginon-wafermeasurement 80
3.2.2 De-embedding 81
3.2.3 ParameterextractionforEMfieldsimulation 94
3.3 Devicemodeling 97
3.3.1 Small-signalequivalent-circuitmodeling 97
3.3.2 MOSFETparasiticresistancesatmillimeterwave 102
References 105
4 Transceiverdesign 109
4.1 Transmitter 109
4.1.1 Architecturalconsideration 110
4.1.2 Circuitdesign 112
4.1.3 Analysisofcubicmixer 121
4.1.4 Transmitterperformance 124
4.1.5 Doubler-basedtransmitter 129
4.1.6 Transmittermodule 136
4.2 Receiver 141
4.2.1 Doubler-lastLOdriver 141
4.2.2 Tripler-lastLOdriver 145
4.2.3 Summary 151
4.2.4 Receivermodule 151
4.3 One-chiptransceiver 158
4.3.1 Architecture 159
4.3.2 Transmittermode 160
4.3.3 Receivermode 161
4.3.4 Schematic 162
4.3.5 Measurement 163
4.4 Wireless-linkevaluation 165
4.4.1 Introduction 165
4.4.2 Wirelessperformanceof300-GHzCMOStransmitter 166
4.4.3 Comparisonoftransmit-receivesystems 167
4.4.4 Conclusion 169
References 170
5 Futureprospects 175
5.1 Channelallocationplanningfor300-GHzband 175
5.2 Thefutureofterahertzcommunicationspreadinginspace 178
5.3 Summary 180
5.4 Concludingremarks 181
References 182
Index 185
Preface
Thisbookcoversmostofourcurrentknowledge,fromthebackgroundtothedesign
of a terahertz complementary metal oxide semiconductor (CMOS) transceiver for
realizingultrahigh-speedwirelesscommunication.Thecontentofthebookismainly
theresultofthe5-yearprojectoftheJapaneseMinistryofInternalAffairsonthe300-
GHz-bandtransceiverwiththesiliconCMOS-integratedcircuitsfrom2014to2019,
withitsrelatedtechnology. ExpectedreadersarenotonlyCMOS-integratedcircuit
designersbutalsoallthosewhoareinterestedinultrahighfrequencycircuits.Many
hintsfordevelopingultrahighfrequencycircuitsonintegratedcircuitsaredescribedin
thisbook.Althoughthecontentofthisbookistechnical,readersareabletounderstand
thecontentswithgeneralknowledgeofmicrowavetextbooks.Thetargetofthereader
isgraduate-studentlevelspecializedinelectronics.
Main area of this book is wireless communication. Radio waves need to be
coherenttorealizeefficientwirelesscommunication.Radiowavesarenotnecessarily
coherent,ontheotherhand,inasensorcomprisingalightsourceandalightreceiver.
Asaresult, thetechnicaldifficultyofthecoherentcommunicationcircuitishigher
thanthatofthesensorcircuit.Sinceitisacademicallyattractivetosolvethisdifficult
problem,thecommunicationcircuitwaschosenasaresearchtarget.Note,however,
thatcircuittechniquesdiscussedinthisbookcanalsobeappliedtosensorcircuits.
Ontheotherhand,itisnecessarytodiscussnotonlytheacademicsignificance
butalsoengineeringsignificanceofterahertzcommunication.Chapter1outlinesthe
reasonsforusingterahertzforwirelesscommunicationandthecurrentresearchon
terahertztransceiver.Thelargestchallengeofrealizingterahertzcommunicationwith
aCMOS-integratedcircuitishowtorealizeacommunicationcircuitexceedingthe
maximumoscillationfrequency,f ,ofthetransistor.Chapter2discussesthetheory
max
and design of ultrahigh frequency amplifiers, and the layout for CMOS-integrated
circuits,whicharemostimportantforrealizingultrahigh-speedcircuits.Priortothis
project,theknowledgeobtainedbyothernationalprojectsonmillimeter-waveinte-
gratedcircuitswehavebeenworkingonhasgreatlyhelpeddesignterahertzCMOS
circuits. Chapter 3 describes individual technologies that are important in design-
ing ultrahigh-frequency CMOS-integrated circuits including terahertz. A terahertz
transceiver is realized while utilizing these techniques. Chapter 4 describes several
typesofcircuitsandmodulesofterahertzCMOStransceivers.Theevaluationmethod
isalsodiscussed.Finally,Chapter5discussesthefutureofterahertzcommunication.
Theauthorswouldliketothankanumberofpeoplewhosupportedthisproject.
In particular, Prof. Mizuki Motoyoshi (currently Tohoku University), Prof. Kyoya
Takano(currentlyTokyoUniversityofScience), Prof.KosukeKatayama(currently
viii DesignofterahertzCMOSintegratedcircuits
WasedaUniversity),Prof.Sang-yeopLee,Dr.RuibingDongofHiroshimaUniversity,
and Dr. Shinsuke Hara of National Institute of Information and Communications
Technology (NICT) are core members of research on terahertz circuit design and
evaluation.Inmoduledesign,Dr.KoichiMizuno(currentlyNagoyaUniversity)and
Mr.JunjiSatoofPanasonicgreatlyhelpedus.Inaddition,intheresearchplanning,
we made fruitful discussions with Dr. Kazuaki Takahashi of Panasonic, Dr. Iwao
HosakoandDr.AkifumiKasamatsuofNICT,andProf.TakeshiYoshidaofHiroshima
University. Besides, no research results described in this book could be obtained
withoutsupportfrommanypeopleincludingsecretariesandstudents.Wewouldlike
totakethisopportunitytoexpressourappreciationtoall.
Chapter 1
Introduction
1.1 Terahertzcommunication
Why do we need to study terahertz communication? Will something great hap-
pen if “terahertz” and “communication” are blended? Let us start discussions on
these two questions that an ordinary person probably wonders. This book covers a
complementary metal oxide semiconductor (CMOS) transceiver with a frequency
range of about 300GHz, which is promising for terahertz communication, and the
mostimportanttechnicalareafordesigningacircuitinthefrequencyrange.Although
this frequency band is terahertz, it is also partially included in millimeter waves.
Therefore, first, millimeter waves and terahertz are briefly introduced, and it will
be discussed why this frequency is promising for communication. Then possible
applicationswillbediscussedfromthenatureofterahertzcommunication.
Figure 1.1 shows the difference between commonly used microwave and mil-
limeter wave used in still limited application. For example, the wireless local area
network(LAN)uses2.4or5GHz.Thewavelengthsintheatmosphereare12.5and
6cm,respectively.Ontheotherhand,millimeterwavesareradiowaveswhosewave-
lengthsintheatmosphereare1–10mmasthenameimplies.Therefore,thewavelength
is1/10to1/100ascomparedwithgeneralmicrowave.Frequenciesare10–100times
Wave length in the air is about 10 cm.
Wi-Fi
2.4/5 GHz
Wavelength is less than
1/10, and frequency is
more than 10 times
compared to that in Wi-Fi
mm Wave
30–300 GHz
Wavelength in the air is 1–10 mm.
(Wavelength of visible light is 0.4 –0.8 μm.)
Figure1.1 Whatismillimeterwave?Consideringfromthedifferencefrom
microwave