DAMAGE PREDICTION OF LEAD FREE BALL GRID ARRAY PACKAGES UNDER SHOCK AND ... PDF
208 Pages·2007·5.3 MB·English
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Except where reference is made to the work of others, the work described in this thesis is my own or was done . Style manual or journal used: Guide to Preparation and Submission of Theses and. Dissertations component types, including flip-chips, chip scale packages (CSPs), and ball grid arrays.
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