Cooling Of Microelectronic and Nanoelectronic Equipment: Advances and Emerging Research PDF
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Cooling Microelectronic of Nanoelectronic Equipment and Advances and Emerging Research 9067_9789814579780_tp.indd 1 7/8/14 5:19 pm WSPC Series in Advanced Integration and Packaging Series Editors: Avram Bar-Cohen (University of Maryland, USA) Shi-Wei Ricky Lee (Hong Kong University of Science and Technology, ROC) Published Vol. 1: Cost Analysis of Electronic Systems by Peter Sandborn Vol. 2: Design and Modeling for 3D ICs and Interposers by Madhavan Swaminathan and Ki Jin Han Vol. 3: Cooling of Microelectronic and Nanoelectronic Equipment: Advances and Emerging Research edited by Madhusudan Iyengar, Karl J. L. Geisler and Bahgat Sammakia Steven - Cooling of microelectronic and.indd 1 7/8/2014 11:03:37 AM WSPC Series in Advanced Integration and Packaging Vol. 3 Cooling Microelectronic of Nanoelectronic Equipment and Advances and Emerging Research Editors Madhusudan Iyengar Facebook, USA Karl J L Geisler 3M, USA Bahgat Sammakia Binghamton University, State University of New York, USA World Scientific NEW JERSEY • LONDON • SINGAPORE • BEIJING • SHANGHAI • HONG KONG • TAIPEI • CHENNAI 9067_9789814579780_tp.indd 2 7/8/14 5:19 pm Published by World Scientific Publishing Co. Pte. Ltd. 5 Toh Tuck Link, Singapore 596224 USA office: 27 Warren Street, Suite 401-402, Hackensack, NJ 07601 UK office: 57 Shelton Street, Covent Garden, London WC2H 9HE Library of Congress Cataloging-in-Publication Data Iyengar, Madhusudan. Cooling of microelectronic and nanoelectronic equipment : advances and emerging research / Madhusudan Iyengar (Facebook, USA), Karl J.L. Geisler (3M, USA), & Bahgat Sammakia (Binghamton University, USA). pages cm. -- (WSPC series in advanced integration and packaging ; vol. 3) Includes bibliographical references and index. ISBN 978-9814579780 (hardcover : alk. paper) 1. Electric machinery--Cooling. 2. Microelectronics. 3. Nanoelectronics. I. Geisler, Karl J. L. II. Sammakia, Bahgat, 1952– III. Title. TK2189.I94 2014 621.38--dc23 2014026665 British Library Cataloguing-in-Publication Data A catalogue record for this book is available from the British Library. Copyright © 2015 by World Scientific Publishing Co. Pte. Ltd. All rights reserved. This book, or parts thereof, may not be reproduced in any form or by any means, electronic or mechanical, including photocopying, recording or any information storage and retrieval system now known or to be invented, without written permission from the publisher. For photocopying of material in this volume, please pay a copying fee through the Copyright Clearance Center, Inc., 222 Rosewood Drive, Danvers, MA 01923, USA. In this case permission to photocopy is not required from the publisher. Printed in Singapore Steven - Cooling of microelectronic and.indd 2 7/8/2014 11:03:37 AM DEDICATION TO DR. AVI BAR-COHEN IN CELEBRATION OF HIS 65TH BIRTHDAY We are delighted to dedicate this book to celebrate the 65th birthday of Professor Avi Bar-Cohen. Dr. Avram Bar-Cohen is an internationally recognized leader in thermal science and technology, an Honorary Member of ASME, and Fellow of IEEE, and Distinguished University Professor in the Department of Mechanical Engineering at the University of Maryland. His publications, lectures, short courses, and research outcomes, in conjunction with professional service in ASME and IEEE, have helped to create a scientific foundation for the thermal management of electronic components and systems, while pioneering techniques for energy-efficient sustainable design of manufactured products. His current research focuses on two-phase microgap and microchannel coolers for high heat flux electronic components, on-chip thermoelectrics for hot spot remediation, thermal control of power amplifiers and photonics, and polymer-fiber composite heat exchangers. Bar-Cohen was the general chair for the 2010 International Heat Transfer Conference in Washington DC and is the President of the Assembly of International Heat Transfer Conferences. He is currently on assignment as a Program Manager in the Microsystem Technology Office at the U.S. Department of Defense’s Defense Advanced Projects Agency (DARPA) in Virginia. v vi Dedication In addition to Honorary membership in ASME, Bar-Cohen’s honors include the Luikov Medal from the International Center for Heat and Mass Transfer in Turkey (2008), ASME’s Heat Transfer Memorial Award (1999), Curriculum Innovation Award (1999), Edwin F. Church Medal (1994) and Worcester Reed Warner Medal (2000), and the Electronic and Electrical Packaging Division’s Outstanding Contribution Award (1994) as well as the InterPack Achievement Award (2007). Bar- Cohen was the founding chair of the IEEE Intersociety Conference on Thermal Management in Electronic Equipment (ITHERM) in 1988 and was recognized with the IEEE CPMT Society’s Outstanding Sustained Technical Contributions Award (2002), the ASME/IEEE ITHERM Achievement Award (1998), and the THERMI Award from the IEEE/Semi-Therm Conference (1997). Most recently, Professor Bar- Cohen received the 2014 IEEE Components, Packaging and Manufacturing Technology Field Award. This annual CPMT award is the highest honor given in the area of electronics packaging, and considered by many to be the “Nobel Prize” in the field. Professor Bar-Cohen has co-authored Design and Analysis of Heat Sinks (Wiley, 1995) and Thermal Analysis and Control of Electronic Equipment (McGraw-Hill, 1983). As editor of The Encyclopedia of Thermal Packaging (World Scientific, 2013), he also contributed as co- author of Volume 3: Dielectric Liquid Cooling of Immersed Components. He has co-edited 16 books in this field and authored/co- authored over 400 journal papers, refereed proceedings papers, and book chapters. He has delivered 70 keynote, plenary and invited lectures at major technical conferences and institutions, and he holds 8 US and 3 Japanese patents. He has advised to completion 64 PhD and master’s students at the University of Maryland, the University of Minnesota and the Ben Gurion University (Beer Sheva, Israel), where he began his academic career in 1972. He was on the faculty in the Mechanical Engineering department at the University of Minnesota from 1989 to 2001, serving as Director of the Thermodynamics and Heat Transfer Division from 1992 to 1997. Starting in 1997, he directed the University of Minnesota Center for the Development of Technological Leadership and beginning in 2000 held the Sweatt Chair in Technological Dedication vii Leadership. From 2001 to 2010, he served as the Chair of the Mechanical Engineering department at the University Maryland. Avram Bar-Cohen began his professional career at the Raytheon Company in Massachusetts in 1968 and for the past 44 years has been involved in the design, analysis, and optimization of thermal systems, with an emphasis on the thermal packaging of electronic equipment. He has lectured widely, published extensively in the archival heat transfer and packaging literature, and taught many short courses on this subject, at both universities and major conferences in the US and abroad. He served as General Manager and Executive Consultant for packaging and physical modeling at Control Data Corporation, 1984-1989, held a succession of academic appointments, from Lecturer to Professor, in the Department of Mechanical Engineering at the Ben Gurion University of the Negev (Israel), 1973-1988, and was on the faculty at the Massachusetts Institute of Technology, 1977-1978, and the Naval Postgraduate School, 1982. Many of Prof. Bar Cohen’s students are currently in leadership positions around the nation and around the globe. Some of who contributed to chapters in this book covering a wide range of topics related to thermal management and thermal packaging of micro- and nanoelectronics, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting. This broad range of topics as well as the outstanding nature of the research and publications is a direct measure of the impact that Prof. Bar-Cohen has had and continues to have on research and development in the field of electronic systems integration and packaging. We are truly delighted to dedicate this work to Avi, on behalf of the electronics packaging community, as a thank you for his continuing scientific and engineering contributions but even more so his visionary leadership, thoughtful mentoring, and heartfelt friendship. Madhu Iyengar, Bahgat Sammakia, and Karl Geisler May2,2013 14:6 BC:8831-ProbabilityandStatisticalTheory PST˙ws TThhiiss ppaaggee iinntteennttiioonnaallllyy lleefftt bbllaannkk Contents Dedication v 1. A Review of Cooling Road Maps for 3D Chip Packages 1 Dereje Agonafer 2. Thermal Performance Mapping of Direct Liquid Cooled 3D Chip Stacks 19 Karl J.L. Geisler and Avram Bar-Cohen 3. Dynamic Thermal Management Considering Accurate Temperature-Leakage Interdependency 43 Bing Shi and Ankur Srivastava 4. Energy Reduction and Performance Maximization Through Improved Cooling 69 David Copeland 5. Optimal Choice of Heat Sinks from an Industrial Point of View 83 Clemens J.M. Lasance 6. Synthetic Jets for Heat Transfer Augmentation in Microelectronics Systems 125 Mehmet Arik and Enes Tamdogan 7. Recent Advance in Thermoelectric Devices for Electronics Cooling 167 Peng Wang 8. Energy Efficient Solid-State Cooling for Hot Spot Removal 195 Kazuaki Yazawa, Andrei Fedorov, Yogendra Joshi and Ali Shakouri ix
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