UUnniivveerrssiittyy ooff SSoouutthh CCaarroolliinnaa SScchhoollaarr CCoommmmoonnss Theses and Dissertations 12-15-2014 CChhaarraacctteerriizzaattiioonn ooff EElleeccttrrooddeeppoossiitteedd CCooppppeerr FFooiill SSuurrffaaccee RRoouugghhnneessss ffoorr AAccccuurraattee CCoonndduuccttoorr PPoowweerr LLoossss MMooddeelliinngg Michael B. Griesi University of South Carolina - Columbia Follow this and additional works at: https://scholarcommons.sc.edu/etd Part of the Electrical and Computer Engineering Commons RReeccoommmmeennddeedd CCiittaattiioonn Griesi, M. B.(2014). Characterization of Electrodeposited Copper Foil Surface Roughness for Accurate Conductor Power Loss Modeling. (Master's thesis). Retrieved from https://scholarcommons.sc.edu/etd/ 2958 This Open Access Thesis is brought to you by Scholar Commons. It has been accepted for inclusion in Theses and Dissertations by an authorized administrator of Scholar Commons. For more information, please contact [email protected]. CHARACTERIZATION OF ELECTRODEPOSITED COPPER FOIL SURFACE ROUGHNESS FOR ACCURATE CONDUCTOR POWER LOSS MODELING by Michael B. Griesi Bachelor of Science University of South Carolina, 2013 Submitted in Partial Fulfillment of the Requirements For the Degree of Master of Science in Electrical Engineering College of Engineering and Computing University of South Carolina 2014 Accepted by: Paul G. Huray, Director of Thesis Olufemi B. Oluwafemi, Reader Lacy Ford, Vice Provost and Dean of Graduate Studies © Copyright by Michael Griesi, 2014 All Rights Reserved. ii DEDICATION I dedicate this thesis to my wife Jessica. It was her love, support, understanding and patience that made this pursuit possible. I will be forever grateful. iii ACKNOWLEDGEMENTS My deepest gratitude goes to my professor, advisor and committee chair Dr. Paul Huray. His passion for understanding the curious and nuanced intricacies of electromagnetic phenomenon is both inspiring and enlightening. It was through this passion I found a trusted mentor, leader and friend in our shared pursuit of understanding. Of particular importance to the completion of this thesis were Dr. Huray’s integral research and development of the Huray surface roughness model accompanied by his detailed instruction provided throughout his lectures and publications. A special thanks to my committee member Dr. Olufemi (Femi) Oluwafemi whose contributions to developing the snowball model provided practical relevance and legitimacy to the conclusions and impact of this thesis. Furthermore, his feedback was both motivating and constructive. I especially want to thank John Fatcheric and Lee Lesher of Oak-Mitsui who contributed a significant amount of time explaining the process of manufacturing electrodeposited copper foil and providing a plant tour. Furthermore, they supplied most of the material and measurement tools for this research. The conclusions of this thesis are thanks to John and Lee’s willingness to share their knowledge and resources. I also want to thank Stephen Hall, who generously contributed constructive feedback for focused and practical content. As well, I would like to thank Christine Jones for graciously sharing additional VNA measurements and test board specifications that were critical for these conclusions. Thank you all. iv ABSTRACT As computer data rates have increased, designers observed that the standard models for estimating the impact of copper foil surface roughness on conductor loss are limited to a few GHz. The more recent snowball model (a “snowball” estimation of the Huray Model) has demonstrated improved conductor loss predictions up to 50 GHz by estimating the necessary parameters using reasonable assumptions about the geometric surface features of electrodeposited copper foil. Since then, the Huray Model has been incorporated into commercial electromagnetic field simulators. However, a standard method of characterizing the electrodeposited copper foil used in high-speed circuits to directly implement the snowball model has not yet been fully established. Therefore, the primary objective of this thesis was to develop a method of more accurately characterizing the geometric parameters of electrodeposited copper foil surfaces for accurate conductor loss modeling as defined by the snowball model. This thesis demonstrates the first methods of directly characterizing electrodeposited copper foil surface roughness to obtain snowball model parameters. Additionally, this research further legitimizes the analytic form of the snowball model as it pertains to scattered power, demonstrates the practical impact of its parameters, and reveals a source of existing irregularities between the estimated model parameters and actual performance measurements. v PREFACE This work is divided into six chapters. Chapter one introduces the motivation and reasons for this research. Chapter two reviews the history of conductor loss modeling, introduces electrodeposited copper foil and recent developments in conductor loss modeling. Chapter three meets the primary objective of this research by demonstrating methods for characterizing the surface of electrodeposited copper foil for accurate conductor loss modeling with results. Chapter four demonstrates a method for implementing the characterized parameters in commercially available simulation tools. Chapter five considers some limitations and concerns for the characterization methods described and alternatives measurements. Chapter six concludes with significant takeaways and recommendations for future work. vi TABLE OF CONTENTS DEDICATION ....................................................................................................................... iii ACKNOWLEDGEMENTS ........................................................................................................ iv ABSTRACT ............................................................................................................................v PREFACE ............................................................................................................................. vi LIST OF TABLES .................................................................................................................. ix LIST OF FIGURES ...................................................................................................................x LIST OF SYMBOLS ............................................................................................................. xiii LIST OF ABBREVIATIONS .....................................................................................................xv CHAPTER 1: INTRODUCTION ..................................................................................................1 CHAPTER 2: BACKGROUND ...................................................................................................3 2.1 ELECTRICAL CONDUCTOR LOSSES IN HIGH-SPEED TRANSMISSION LINES .............3 2.2 THE MORGAN-HAMMERSTAD EMPIRICAL FIT .......................................................4 2.3 PROBLEMS WITH THE MORGAN-HAMMERSTAD EMPIRICAL FIT ............................6 2.4 ELECTRODEPOSITED COPPER FOIL.......................................................................11 2.5 THE SNOWBALL MODEL ......................................................................................15 2.6 OBJECTIONS TO AND PROBLEMS WITH THE SNOWBALL MODEL ..........................17 CHAPTER 3: COPPER FOIL SURFACE CHARACTERIZATION ..................................................24 3.1 IMPACT OF SNOWBALL MODEL PARAMETERS ON CONDUCTOR LOSS ..................24 3.2 CHARACTERIZING TREATED COPPER FOIL: 𝑎 AND 𝑁⁄𝐴 ..............................27 𝑖 𝑖 𝑓𝑙𝑎𝑡 3.3 CHARACTERIZING UNTREATED COPPER FOIL: 𝐴 ⁄𝐴 ..............................34 𝑚𝑎𝑡𝑡𝑒 𝑓𝑙𝑎𝑡 vii CHAPTER 4: USING CHARACTERIZED PARAMETERS IN SIMULATION TOOLS .......................42 4.1 AN EFFECTIVE SNOWBALL RADIUS .....................................................................43 4.2 PERFORMANCE EXPERIMENTS .............................................................................45 CHAPTER 5: DISCUSSION .....................................................................................................52 5.1 CONCERNS AND ALTERNATIVES ..........................................................................52 5.2 KNOWN LIMITATIONS OF THIS RESEARCH ...........................................................53 CHAPTER 6: CONCLUSION AND FUTURE WORK ..................................................................56 6.1 CONCLUSION .......................................................................................................56 6.2 FUTURE WORK ....................................................................................................57 REFERENCES .......................................................................................................................58 APPENDIX A – PERIODIC INTERPOLATION PSEUDOCODE ....................................................60 APPENDIX B – MATLAB CODE FOR OAK-MITSUI IMAGE ANALYSIS .................................61 APPENDIX C – MATLAB CODE FOR GOULD IMAGE ANALYSIS .........................................64 APPENDIX D – MATLAB CODE FOR 3D MICROSCOPE DISTRIBUTION BINNING ................67 APPENDIX E – MATLAB CODE FOR AVERAGE DISTRIBUTION BINNING ............................69 APPENDIX F – PYTHON CODE FOR COMPOSITE SIMPSON’S RULE .......................................71 APPENDIX G – DERIVATION OF EDDY CURRENT EQUATION ...............................................73 viii LIST OF TABLES Table 2.1 Conductor Surface Parameters of the Snowball Model .....................................16 Table 3.1 Drum Side 𝐴 ⁄𝐴 ...................................................................................39 𝑚𝑎𝑡𝑡𝑒 𝑓𝑙𝑎𝑡 Table 3.2 Matte Side 𝐴 ⁄𝐴 ...................................................................................39 𝑚𝑎𝑡𝑡𝑒 𝑓𝑙𝑎𝑡 Table 4.1 Microstrip Model Dimensions ...........................................................................46 ix
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