Characterization and Metrology for ULSI Technology 2000: International Conference (AIP Conference Proceedings) PDF
205 Pages·2001·5.67 MB·English
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The worldwide semiconductor community faces increasingly difficult challenges as it moves into the manufacturing of chips with feature sizes approaching 100 nm. Some of the challenges are materials-related, such as transistors with high-k dielectrics and on-chip interconnects made from copper and lo
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