ANSYS Electronic Solutions for SI/PI/EMI ANSYS Electronic Solutions for SI/PI/EMI

49 Pages·2011·13.8 MB·English

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SI/PI/EMI Design Overview
Display Panel
EMI/EMC
Common mode radiation
-
Differential mode radiation
-
Driver IC
Control IC Memory
Pwr Noise
Signal
PCB
Signal Integrity
Power Integrity Power Supplies - Impedance
Crosstalk
Switching Noise -
-
Reflection
Impedance Profile -
-
Termination
Power/Gnd Plane Resonance -
-
Dielectric Losses
Return Path discontinuities -
-
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Typical SI Design Flow
Integration
Geometry
Electronic Design
Data Import
Simulate &
EEnnvviirroonnmmeenntt
((AAnnssooffttLLiinnkkss))
EExxttrraacctt
(Cadence, Mentor, Zuken ..)
Parasitics
(SIwave, HFSS, Q3D )
extracted parasitic data
Spice netlists /
S –parameter
Circuit Simulation Verilog-A netlists
(Ansoft Designer / Nexxim) / IBIS-AMI
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IC/Package/Board/EMI Simulation
, ,
HFSSTM SIwaveTM DesignerSITM
Tools overview
• HFSSTM : general purpose full-wave 3D extraction
•• SSIIwwaavveeTM :: ffuullll--wwaavvee eexxttrraaccttiioonn ooff mmeerrggeedd PPaacckkaaggee aanndd BBooaarrdd
model
• DesignerSITM
: schematic level design integration and
management, transient simulation.
• Q3D Extractor®:
Quasi-static electromagnetic-field solver
• AnsoftLinksTM :
ECAD Translator
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HFSS
• HFSS – High Frequency Structure Simulator
– 3D Volumetric Field Solver
• Type: Full-Wave
• Method: 3D Finite Element Method (FEM)
• Mesh Element: Tetrahedron
– Excitations - Port Solver
•• MMeetthhoodd:: 22DD FFiinniittee EElleemmeenntt MMeetthhoodd
• Mesh Process: Adaptive
– Advanced Boundary Types
• Radiation and Perfectly Matched Layers
• Symmetry, Finite Conductivity, Infinite
Planes, RLC, and Layered Impedance
– Advanced Material Types
• Frequency dependent materials
• Anisotropic and non-linear material
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HFSS
• HFSS – High Frequency Structure Simulator
– Frequency Sweeps
• Matrix Data and Fields at every frequency in
sweep
• Discrete, Fast and Interpolating sweep.
– Post Processing and Report Type
•• SSYYZZ ppaarraammeetteerrss
– Magnitude and phase for user defined ports
• Field display
– SPICE export
• Full-Wave Spice – Broadband Mode
• Lumped RLC – Low Frequency Model
• HSPICE, PSPICE, Cadence Spectre
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HFSS Design Automation
– Parametrization, Optimization Ansoft Corporation S11 for Element 1 Parametric Sweep isolation
0
-5
-10
– CAD interface thru AnsoftLinks P1))-15 CdBu(rSve( PIn1fo,P1))
1, Setup1 : Sweep1
P extra_element_lengt
S(-20 dB(S(P1,P1))
• Cadence: Allegro/APD/Virtuoso B( Sexettruap_1e l:e Smweenet_pl1engt
d-25 Setupd1B :( SS(wPe1e,Pp11))
extra_element_lengt
• Zuken CR500 dB(S(P1,P1))
-30 Setup1 : Sweep1
extra_element_lengt
dB(S(P1,P1))
--3355
•• SSyynnooppssiiss:: EEnnccoorree 22..00 22..11 22..22 22..33 22..44 22..55 22..66 22..77 22..88 22..99 33..00
Freq [GHz]
• Mentor Graphics: Board Station/Expedition
Design/PowerPCB
– Solving Capabilities
• Multi-Processing (MP)
• Distributed Solve (DSO)
• High Performance Computing (HPC)
• Windows/Linux 32 and 64
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HFSS- THE accepted standard in
Electromagnetic Simulations
• The mesh is automatically
created and adapted for
Create Initial
Mesh
accuracy.
Solve fields using the Generate
FFiinniittee EElleemmeenntt MMeetthhoodd NNeeww MMeesshh
no
Calculate local
Max(|∆S|)<goal?
Solution error
yes
Calculate broad band
s-parameters (if desired)
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