Advances in Heat Transfer (Volume 53) PDF
Preview Advances in Heat Transfer (Volume 53)
VOLUMEFIFTYTHREE A DVANCES IN HEAT TRANSFER This page intentionally left blank VOLUMEFIFTYTHREE A DVANCES IN HEAT TRANSFER Edited by JOHN PATRICK ABRAHAM Professor, School of Engineering, University of St. Thomas, St. Paul, MN, United States JOHN M. GORMAN Research Associate, Department of Mechanical Engineering, University of Minnesota, Minneapolis, MN, United States WOLODMYR MINKOWYCZ Professor Emeritus, Department of Mechanical and Industrial Engineering, University of Illinois—Chicago, Chicago, IL, United States AcademicPressisanimprintofElsevier 50HampshireStreet,5thFloor,Cambridge,MA02139,UnitedStates 525BStreet,Suite1650,SanDiego,CA92101,UnitedStates TheBoulevard,LangfordLane,Kidlington,OxfordOX51GB,UnitedKingdom 125LondonWall,London,EC2Y5AS,UnitedKingdom Firstedition2021 Copyright©2021ElsevierInc.Allrightsreserved. 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ISBN:978-0-12-824596-5 ISSN:0065-2717 ForinformationonallAcademicPresspublications visitourwebsiteathttps://www.elsevier.com/books-and-journals Publisher:ZoeKruze AcquisitionsEditor:AshlieJackman DevelopmentalEditor:FedericoPauloMendoza ProductionProjectManager:AbdullaSait CoverDesigner:VictoriaPearson TypesetbySTRAIVE,India List of contributors GeorgeP.“Bud”Peterson WoodruffSchoolofMechanicalEngineering,GeorgiaInstituteofTechnology,Atlanta,GA, UnitedStates ZhenCao DepartmentofEnergySciences,LundUniversity,Lund,Sweden JaquelineD.daSilva LaboratoryofThermalSciences–LATERMO,DepartmentofMechanicalEngineering, UniversidadeFederalFluminense,Nitero´i,RJ,Brazil MohammadFaghri DepartmentofMechanical,IndustrialandSystemsEngineering,UniversityofRhodeIsland, Kingston,RI,UnitedStates LeighAnnS.Larkin ArmyResearchLaboratory,Adelphi,MD,UnitedStates NamQ.Le TheJohnsHopkinsUniversityAppliedPhysicsLaboratory,Laurel,MD,UnitedStates SylvieLorente DepartmentofMechanicalEngineering,VillanovaUniversity,Villanova,PA,UnitedStates StephenP.Lynch DepartmentofMechanicalEngineering,PennsylvaniaStateUniversity,UniversityPark,PA, UnitedStates HongbinMa DepartmentofMechanical&AerospaceEngineering,UniversityofMissouri,Columbia, MO,UnitedStates DeboraC.Moreira HeatTransferResearchGroup–HTRG,DepartmentofMechanicalEngineering,Sa˜o CarlosSchoolofEngineering(EESC),UniversityofSaoPaulo(USP),Sa˜oCarlos,SP,Brazil PamelaM.Norris GeorgeWashingtonUniversity,Washington,DC,UnitedStates CarlosA.Polanco SivananthanLaboratoriesInc.,590TerritorialDr.steh,Bolingbrook,IL,UnitedStates GherhardtRibatski HeatTransferResearchGroup–HTRG,DepartmentofMechanicalEngineering,Sa˜o CarlosSchoolofEngineering(EESC),UniversityofSaoPaulo(USP),Sa˜oCarlos,SP,Brazil JustinL.Smoyer DepartmentofPhysicalSciences,KutztownUniversity,Kutztown,PA,UnitedStates vii viii Listofcontributors BengtSund(cid:1)en DepartmentofEnergySciences,LundUniversity,Lund,Sweden KarenA.Thole DepartmentofMechanicalEngineering,PennsylvaniaStateUniversity,UniversityPark,PA, UnitedStates AlexanderJ.Wildgoose DepartmentofMechanicalEngineering,PennsylvaniaStateUniversity,UniversityPark,PA, UnitedStates ZanWu DepartmentofEnergySciences,LundUniversity,Lund,Sweden JingjieZhang GainwellTechnology,Irving,TX,UnitedStates CHAPTER ONE Advances in vapor chambers and phase change heat spreaders George P. “Bud” Petersona and Hongbin Mab aWoodruffSchoolofMechanicalEngineering,GeorgiaInstituteofTechnology,Atlanta,GA,UnitedStates bDepartmentofMechanical&AerospaceEngineering,UniversityofMissouri,Columbia,MO,UnitedStates Contents 1. Introduction 4 1.1 Vaporchamberconcept 4 1.2 Vaporchamberapplications 5 2. Fundamentals 7 2.1 Surfacetension 8 2.2 Laplace-Youngequation 11 2.3 Saturationpressure 14 2.4 Contactangle 17 2.5 Thinfilmevaporation 20 3. Heattransportlimitation 26 3.1 Capillarylimitation 27 3.2 Boilinglimit 49 3.3 Soniclimit 52 3.4 Thermalresistance 54 3.5 Effectivenessofavaporchamber 59 4. Advancedwickingstructures 63 4.1 Sinteredparticles 65 4.2 Sinteredmeshesandfoams 69 4.3 Microgrooves 73 4.4 Hybridwickswithmicro/nanostructures 78 4.5 Wickswithspacers 83 4.6 Others 86 Acknowledgment 92 References 92 Abstract Heatpipeshavebeenusedinawidevarietyofapplicationssincetheirinitialintroduc- tioninthemid-1960s.Thevastmajorityoftheseapplicationshaveinvolvedtheliner transferofheatorone-dimensionalheattransfer.Morerecently,thisconcepthasbeen extendedtodevices,whichareessentiallythree-dimensionalnature,thatisheattransfer AdvancesinHeatTransfer,Volume53 Copyright#2021ElsevierInc. 1 ISSN0065-2717 Allrightsreserved. https://doi.org/10.1016/bs.aiht.2021.06.001
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