Additive Manufacturing of Mechatronic Integrated Devices

230 Pages·2022·13.078 MB·English

by  Friedrich Wilhelm Proes

Light Engineering für die Praxis
Friedrich Wilhelm Proes
Additive Manufacturing of
Mechatronic Integrated Devices
Edited by Claus Emmelmann
123
Additive Manufacturing of
Mechatronic Integrated Devices

Vom Promotionsausschuss der
Technischen Universität Hamburg

zur Erlangung des akademischen Grades
Doktor-Ingenieur (Dr.-Ing.)

genehmigte Dissertation

von
Friedrich Wilhelm Proes

aus
Hamburg

2022
1. Gutachter: Prof. Dr.-Ing. Claus Emmelmann
2. Gutachter: Prof. Dr.-Ing. Wolfgang Krautschneider
Tag der mündlichen Prüfung: 03. März 2022
Light Engineering für die Praxis
Reiheherausgegebenvon
ClausEmmelmann,Hamburg,Deutschland
Technologie- und Wissenstransfer für die photonische Industrie ist der Inhalt dieser
Buchreihe. Der Herausgeber leitet das Institut für Laser- und Anlagensystemtechnik an
derTechnischenUniversitätHamburgsowiedieFraunhofer-EinrichtungfürAdditivePro-
duktionstechnologien IAPT. Die Inhalte eröffnen den Lesern in der Forschung und in
UnternehmendieMöglichkeit,innovativeProdukteundProzessezuerkennenundsoihre
Wettbewerbsfähigkeit nachhaltig zu stärken. Die Kenntnisse dienen der Weiterbildung
von Ingenieuren und Multiplikatoren für die Produktentwicklung sowie die Produktions-
und Lasertechnik, sie beinhalten die Entwicklung lasergestützter Produktionstechnolo-
gien und der Qualitätssicherung von Laserprozessen und Anlagen sowie Anleitungen für
Beratungs- und Ausbildungsdienstleistungen für die Industrie.
Friedrich Wilhelm Proes
Additive Manufacturing
of Mechatronic Integrated
Devices
FriedrichWilhelmProes
Fraunhofer-EinrichtungfürAdditive
ProduktionstechnologienIAPT
Hamburg,Germany
ISSN2522-8447 ISSN2522-8455 (electronic)
LightEngineeringfürdiePraxis
ISBN978-3-031-16220-6 ISBN978-3-031-16221-3 (eBook)
https://doi.org/10.1007/978-3-031-16221-3
©TheEditor(s)(ifapplicable)andTheAuthor(s),underexclusivelicensetoSpringerNatureSwitzerlandAG
2022
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Abstract
In this dissertation a new process chain for the Additive Manufacturing of Mechatronic
Integrated Devices (AMMID) is described, which provides a new way to manufacture 3-
dimensional electronic devices based on the selective laser sintering (SLS) process using
laser direct structuring (LDS) and metallization. The AMMID meets the rising demand
for highly functionalized parts, increasing individualization and shortening development
cycles for electronic products.
The development for this process chain is based on a comprehensive literature review that
indicates that an SLS-based process chain has great potential to produce 3-dimensional
electronic devices with properties and with the future perspective of being suitable for an
individualized mass production. The biggest, initial, technical hurdle is an unstable SLS
process using a conventional LDS additive. The compound of SLS material and LDS ad-
ditive was analyzed with DSC, which shows that the additive changes the melting behavior
of the polymer by reducing the sintering window. A fine metal powder as an alternative
additive that does not affect the melting behavior as much, enables a stable process. To
choose a suitable particle size and content for the metal powder an analytical material
model is provided, that predicts the additive particle distribution within the material. This
material model deepens the understanding of the activation mechanism during laser acti-
vation, provides hands-on information for powder preparation and it is applied for the
design of the experiment for the development of the process chain with the new material.
Preliminary experiments are conducted along with the insights of the material model,
which prove that redeposition is the main activation mechanism during laser activation.
Based on this, the process chain is developed, starting with a determination of a suitable
additive content. The material composition of a PA12 powder containing 2 wt.% of a cop-
per powder with a mean particle diameter of 3.5 μm. With regard to the laser activation,
working laser parameters are developed (working parameter set feasible for all used post-
process treatments: PRF = 1 kHz, d = 25 μm, v = 25 mm/s, t = 20 ns and P = 1.07 W).
h s l
In this parameter development it is shown, that only closely located laser spots, enabling
interaction of the laser pulses, are capable of activating the surface, while single laser
pulses under applied conditions are not. By adding a post-process treatment as additional
process step into the process chain, the quality of metallization and the size of design
features could be improved. Chemical smoothing resulted in a complete reduction of un-
wanted metallization on non-activated surfaces. Conductor tracks with the minimal width
of 300 μm could be realized. The process chain could be applied to demonstrator parts
such as a drone housing and a PSU panel of an aircraft. Thus, this dissertation has raised
the technology readiness level (TRL) from TRL2 to TRL6.
VI Abstract
Finally, an economic consideration provides insights on the cost structure of parts pro-
duced with the AMMID process. A comparison of AMMID and injection molding shows
economic viability for small lot sizes, 400 parts in case of the drone housing and 150 parts
in case of the PSU panel. Finally, the analysis of the cost structure gives advice which
future developments in the process chain have the greatest effect on costs and provides
prioritization.
Table of contents
Abstract V
Table of contents VII
List of figures X
List of tables XIV
List of acronyms XV
List of formula symbols XVIII
1 Introduction 1
1.1 Motivation and goal 2
1.2 History 4
1.3 Structure of this work 5
2 State of the art 7
2.1 Additive manufacturing technologies 7
2.2 Selective laser sintering 12
2.2.1 Data preparation 13
2.2.2 System components 15
2.2.3 Machine and powder preparation 16
2.2.4 Process 17
2.2.5 Post process 19
2.2.6 Part properties 22
2.2.7 Cost 23
2.3 3D Electronics 24
2.4 LDS process 25
2.4.1 Injection molding 26
2.4.2 Laser activation 27
2.4.3 Electroless plating with copper 32
2.4.4 Placement and interconnection 35
2.4.5 Market & Applications 35
2.4.6 ADDIMID 38
2.4.7 Cost 41
2.5 Additively manufactured electronics (AME) 42
2.5.1 SLS-based approaches for AME 43
2.5.2 Stereolithography (SLA) 48
2.5.3 Fused Filament Fabrication (FFF) 48
2.5.4 Inkjet 51