ebook img

2D materials for nanoelectronics PDF

472 Pages·2016·23.468 MB·English
Save to my drive
Quick download
Download
Most books are stored in the elastic cloud where traffic is expensive. For this reason, we have a limit on daily download.

Preview 2D materials for nanoelectronics

2D Materials for Nanoelectronics Series in Materials Science and Engineering Other books in the series: Automotive Engineering: Lightweight, Functional, and Novel Materials B Cantor, P Grant, C Johnston Strained-Si Heterostructure Field Effect Devices C K Maiti, S Chattopadhyay, L K Bera Spintronic Materials and Technology Y B Xu, S M Thompson (Eds) Fundamentals of Fibre Reinforced Composite Materials A R Bunsell, J Renard Novel Nanocrystalline Alloys and Magnetic Nanomaterials B Cantor (Ed) 3-D Nanoelectronic Computer Architecture and Implementation D Crawley, K Nikolic, M Forshaw (Eds) Computer Modelling of Heat and Fluid Flow in Materials Processing C P Hong High-K Gate Dielectrics M Houssa (Ed) Metal and Ceramic Matrix Composites B Cantor, F P E Dunne, I C Stone (Eds) High Pressure Surface Science and Engineering Y Gogotsi, V Domnich (Eds) Physical Methods for Materials Characterisation, Second Edition P E J Flewitt, R K Wild Topics in the Theory of Solid Materials J M Vail Solidification and Casting B Cantor, K O’Reilly (Eds) Fundamentals of Ceramics M W Barsoum Aerospace Materials B Cantor, H Assender, P Grant (Eds) Series in Materials Science and Engineering 2D Materials for Nanoelectronics Edited by Michel Houssa IMEC, Leuven, Belgium Athanasios Dimoulas NCSR-Demokritos, Athens, Greece Alessandro Molle CNR IMM, Agrate Brianza, Italy Boca Raton London New York CRC Press is an imprint of the Taylor & Francis Group, an informa business Cover Image: Illustration of silicene transistor device. Courtesy of Jo Wozniak, UT-Austin. CRC Press Taylor & Francis Group 6000 Broken Sound Parkway NW, Suite 300 Boca Raton, FL 33487-2742 © 2016 by Taylor & Francis Group, LLC CRC Press is an imprint of Taylor & Francis Group, an Informa business No claim to original U.S. Government works Version Date: 20151123 International Standard Book Number-13: 978-1-4987-0418-2 (eBook - PDF) This book contains information obtained from authentic and highly regarded sources. Reasonable efforts have been made to publish reliable data and information, but the author and publisher cannot assume responsibility for the validity of all materials or the consequences of their use. The authors and publishers have attempted to trace the copyright holders of all material reproduced in this publication and apologize to copyright holders if permission to publish in this form has not been obtained. If any copyright material has not been acknowledged please write and let us know so we may rectify in any future reprint. Except as permitted under U.S. Copyright Law, no part of this book may be reprinted, reproduced, transmit- ted, or utilized in any form by any electronic, mechanical, or other means, now known or hereafter invented, including photocopying, microfilming, and recording, or in any information storage or retrieval system, without written permission from the publishers. For permission to photocopy or use material electronically from this work, please access www.copyright. com (http://www.copyright.com/) or contact the Copyright Clearance Center, Inc. (CCC), 222 Rosewood Drive, Danvers, MA 01923, 978-750-8400. CCC is a not-for-profit organization that provides licenses and registration for a variety of users. For organizations that have been granted a photocopy license by the CCC, a separate system of payment has been arranged. Trademark Notice: Product or corporate names may be trademarks or registered trademarks, and are used only for identification and explanation without intent to infringe. Visit the Taylor & Francis Web site at http://www.taylorandfrancis.com and the CRC Press Web site at http://www.crcpress.com Contents Preface ........................................................................................ix Editors .........................................................................................xi Contributors ...............................................................................xiii SECtion i Graphene ChaPtEr 1 theory of the Structural, Electronic and transport Properties of Graphene .............................3 Massoud Ramezani Masir, Ortwin Leenaerts, Bart Partoens and François M. Peeters ChaPtEr 2 Epitaxial Graphene: Progress on Synthesis and Device integration ...........................................37 Joshua Robinson, Matthew Hollander and Suman Datta ChaPtEr 3 Metal Contacts to Graphene ...................................53 Akira Toriumi and Kosuke Nagashio ChaPtEr 4 Graphene for rF analogue applications ..................79 Max C. Lemme and Frank Schwierz ChaPtEr 5 high-Field and thermal transport in Graphene ......107 Zuanyi Li, Vincent E. Dorgan, Andrey Y. Serov and Eric Pop v K24702_Book.indb 5 19-02-2016 14:23:45 Contents SECtion ii transition Metal Dichalcogenides ChaPtEr 6 theoretical Study of transition Metal Dichalcogenides ..................................................141 Emilio Scalise ChaPtEr 7 Physico-Chemical Characterisation of MoS / 2 Metal and MoS /oxide interfaces .........................163 2 Stephen McDonnell, Rafik Addou, Christopher L. Hinkle and Robert M. Wallace ChaPtEr 8 transition Metal Dichalcogenide Schottky Barrier transistors: a Device analysis and Material Comparison ...........................................207 Joerg Appenzeller, Feng Zhang, Saptarshi Das and Joachim Knoch ChaPtEr 9 tMD-Based Photodetectors, Light Emitters and Photovoltaics ......................................................241 Thomas Mueller ChaPtEr 10 optoelectronics, Mechanical Properties and Strain Engineering in MoS ..................................273 2 Andres Castellanos-Gomez, Michele Buscema, Herre S.J. van der Zant and Gary A. Steele ChaPtEr 11 Device Physics and Device Mechanics for Flexible tMD and Phosphorene thin-Film transistors ..........................................................301 Hsiao-Yu Chang, Weinan Zhu and Deji Akinwande SECtion iii novel 2D Materials ChaPtEr 12 Structural, Electronic and transport Properties of Silicene and Germanene ..................................331 Michel Houssa, Valery Afanas’ev and André Stesmans vi K24702_Book.indb 6 19-02-2016 14:23:45 Contents ChaPtEr 13 Group iV Semiconductor 2D Materials: the Case of Silicene and Germanene ..................................349 Alessandro Molle, Dimitra Tsoutsou and Athanasios Dimoulas ChaPtEr 14 Stannene: a Likely 2D topological insulator .........379 William Vandenberghe, Ana Suarez Negreira and Massimo Fischetti ChaPtEr 15 Phosphorene: a novel 2D Material for Future nanoelectronics and optoelectronics ...................409 Yexin Deng, Zhe Luo, Han Liu, Yuchen Du, Xianfan Xu and Peide D. Ye ChaPtEr 16 2D Crystal-Based heterostructures for nanoelectronics ..................................................433 Cinzia Casiraghi and Freddie Withers index........................................................................................455 vii K24702_Book.indb 7 19-02-2016 14:23:45 TThhiiss ppaaggee iinntteennttiioonnaallllyy lleefftt bbllaannkk Preface The success of the semiconductor industry relies on the con- tinuous improvement of the performance of integrated circuits, accompanied by the reduction of their production costs. This has been achieved so far by reducing the size of the basic building block of integrated circuits: the metal– oxide– semiconductor field effect transistor (MOSFET). During the past 10–15 years, new materials were introduced to enable the reduction of MOSFET dimensions, like high-k gate dielectrics, metal gates, low-k dielectrics and copper interconnects. More recently, new devices architectures, based on multiple gates (FinFETs), replaced the conventional planar transistors. To continue device scaling, alternative materials to silicon, like germanium and III–V compounds, with high carrier mobilities, could be used as the channel in future devices. However, further reduction in MOSFET dimensions will soon lead to a tremendous rise in power consumption as well as limited gain in the perfor- mances of integrated circuits. In this respect, two-dimensional (2D) materi- als such as graphene, transition metal dichalcogenides, and novel materials such as silicene, germanene, stannene and phosphorene, offer the possibility to downscale the channel thickness at the atomic level, which could lead to much improved electrostatic control of the device and suppression of the so- called short channel effects. The isolation of graphene by Andre Geim and Konstantin Novoselov in 2004 opened the door to research on 2D materials. This monolayer of carbon atoms, arranged in a hexagonal network, has triggered considerable interest in the scientific community, due to its unique structural, mechanical and elec- tronic properties. Graphene could be used in future nanoelectronic devices, taking advantage of its extremely high carrier mobilities and ambipolar behaviour. The absence of an energy gap in graphene, however, is problematic for logic applications, which require a sufficiently large ratio between the off and on-state current of the transistors. Such applications would thus require the use of other 2D materials, with complementary properties. Among these materials, semiconducting transition metal dichalcogenides are gaining a lot of interest, due to the possibility to tune their energy band gap through their thickness, composition and applied mechanical strain. Other 2D materials based on group-IV elements, such as silicene, germanene and stannene, were theoretically predicted, and silicene and germanene were recently successfully ix K24702_Book.indb 9 19-02-2016 14:23:45

See more

The list of books you might like

Most books are stored in the elastic cloud where traffic is expensive. For this reason, we have a limit on daily download.