12-Bit, 8-Channel, ADC Sys Monitor w/Temp - Texas Instruments

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ADC128D818
SNAS483F–FEBRUARY2010–REVISEDAUGUST2015
ADC128D818 12-Bit, 8-Channel, ADC System Monitor With Temperature Sensor,
2
Internal – External Reference, and I C Interface
1 Features – TemperatureAccuracy(–25°Cto100°C) ±2°C
• 12-Bit ResolutionDelta-SigmaADC
1 2 Applications
• LocalTemperatureSensing
• CommunicationsInfrastructure
• ConfigurableSingle-Endedand/orPseudo-Diff.
Inputs • ThermalandHardwareServerMonitors
• 2.56-VInternalVREForVariableExternalVREF • SystemMonitors
• WATCHDOGWindowComparatorswithStatus • IndustrialandMedicalSystems
andMaskRegistersofAllMeasuredValues • ElectronicTestEquipment andInstrumentation
• IndependentRegistersforStoringMeasured • PowerSupplyMonitoringandSupervision
Values
3 Description
• INT Output NotifiesMicroprocessorofErrorEvent
• I2CSerialBusInterfaceCompatibility The ADC128D818 I2C system monitor is designed for
maximum flexibility. The system monitor can be
• 9SelectableAddresses
configured for single-ended and/or pseudo-differential
• TIME-OUTResetFunctiontoPreventI2CBus inputs. An onboard temperature sensor, combined
Lock-Up with WATCHDOG window comparators, and an
• IndividualChannelShutdowntoLimitPower interrupt output pin, INT, allow easy monitoring and
out-of-range alarms for every channel. A high
Consumption
performance internal reference is also available to
• DeepShutdownModetoMinimizePower
provide for a complete solution in the most difficult
Consumption operatingconditions.
• TSSOP16-LeadPackage
The ADC128D818’s 12-bit delta-sigma ADC supports
• KeySpecifications Standard Mode (Sm, 100 kbps) and Fast Mode (Fm,
– ADCResolution12-Bit 400 kbps) I2C interfaces. The ADC128D818 includes
a sequencer to control channel conversions and
– SupplyVoltageRange3Vto5.5V
stores all converted results in independent registers
– TotalUnadjustedError –0.45%/+0.2%
for easy microprocessor retrieval. Unused channels
– IntegralNon-Linearity ±1LSb canbeshutdownindependentlytoconservepower.
– DifferentialNon-Linearity ±1LSb
DeviceInformation(1)
– OperatingCurrent0.56mA
PARTNUMBER PACKAGE BODYSIZE(NOM)
– DeepShutdownCurrent10µA
ADC128D818 TSSOP(16) 5.00mm×4.40mm
– TemperatureResolution °C/LSb
(1) For all available packages, see the orderable addendum at
– TemperatureAccuracy(–40°Cto125°C) ±3°C theendofthedatasheet.
Typical ApplicationDiagram
V+ VREF
LM94022 ADC128D818
Single-Ended
Positive Voltage Internal
VREF = +2.56V
IN0 Interrupt
Pseudo-Differential IN1 Interrupt Masking
Positive Voltage IINN23 12-bit RSegtaistutesr s Intaenrrdu pt INT
10VIN VOUT IINN54 ((-+)) DeltAa-DSCigma Control
Shutdown DC-DC IINN76 ((+-))
Margining
Voltage SDA
TemSepnesraotrure I2C Interface and Control SAC0L
A1
RTRACE GND
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.
ADC128D818
SNAS483F–FEBRUARY2010–REVISEDAUGUST2015 www.ti.com
Table of Contents
1 Features.................................................................. 1 8.4 DeviceFunctionalModes........................................16
2 Applications........................................................... 1 8.5 Programming...........................................................16
3 Description............................................................. 1 8.6 RegisterMaps.........................................................19
4 RevisionHistory..................................................... 2 9 ApplicationandImplementation........................ 28
9.1 ApplicationInformation............................................28
5 Description(continued)......................................... 3
9.2 TypicalApplication .................................................31
6 PinConfigurationandFunctions......................... 4
9.3 SystemExamples...................................................35
7 Specifications......................................................... 5
10 PowerSupplyRecommendations..................... 38
7.1 AbsoluteMaximumRatings......................................5
11 Layout................................................................... 39
7.2 ESDRatings..............................................................5
11.1 LayoutGuidelines.................................................39
7.3 RecommendedOperatingConditions.......................6
11.2 LayoutExample....................................................39
7.4 ThermalInformation..................................................6
12 DeviceandDocumentationSupport................. 40
7.5 DCElectricalCharacteristics....................................6
7.6 ACElectricalCharacteristics.....................................9 12.1 DocumentationSupport........................................40
7.7 TypicalCharacteristics............................................10 12.2 CommunityResources..........................................40
12.3 Trademarks...........................................................40
8 DetailedDescription............................................ 14
12.4 ElectrostaticDischargeCaution............................40
8.1 Overview.................................................................14
12.5 Glossary................................................................40
8.2 FunctionalBlockDiagram.......................................14
13 Mechanical,Packaging,andOrderable
8.3 FeatureDescription.................................................15
Information........................................................... 40
4 Revision History
NOTE:Pagenumbersforpreviousrevisionsmaydifferfrompagenumbersinthecurrentversion.
ChangesfromRevisionE(March2013)toRevisionF Page
• AddedPinConfigurationandFunctionssection,ESDRatingstable,FeatureDescriptionsection,DeviceFunctional
Modes,ApplicationandImplementationsection,PowerSupplyRecommendationssection,Layoutsection,Device
andDocumentationSupportsection,andMechanical,Packaging,andOrderableInformationsection .............................. 1
• RemovedProductHighlights ................................................................................................................................................. 1
ChangesfromRevisionD(January2011)toRevisionE Page
• ChangedlayoutofNationalDataSheettoTIformat........................................................................................................... 27
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5 Description (continued)
The ADC can use either an internal 2.56-V reference or a variable external reference. An analog filter is included
on the I2C digital control lines to provide improved noise immunity. The device also includes a TIME-OUT reset
functiononSDAandSCLtopreventI2Cbuslock-up.
The ADC128D818 operates from 3-V to 5.5-V power supply voltage range, –40°C to 125°C temperature range,
andthedeviceisavailableina16-pinTSSOPpackage.
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6 Pin Configuration and Functions
PWPackage
16-PinTSSOP
TopView
VREF 1 16 IN0
SDA 2 15 IN1
SCL 3 14 IN2
GND 4 ADC128D818 13 IN3
V+ 5 16-pin TSSOP 12 IN4
INT 6 11 IN5
A0 7 10 IN6
A1 8 9 IN7
PinFunctions
PIN
TYPE DESCRIPTION
NO. NAME ESDSTRUCTURE
ADCexternalreference.
ADC128D818allowstwochoicesforsourcingVREF:
internalorexternal.Ifthe2.56-VinternalVREFisused,
leavethispinunconnected.IftheexternalVREFisused,
1 VREF AnalogInput sourcethispinwithavoltagebetween1.25VandV+.At
Power-On-Reset(POR),thedefaultsettingistheinternal
VREF.
Bypasswiththeparallelcombinationof1-μF(electrolyticor
tantalum)and0.1-μF(ceramic)capacitors.
SerialBusBidirectionalData.NMOSopen-drainoutput.
2 SDA DigitalI/O
Requiresexternalpullupresistortofunctionproperly.
SerialBusClock.Requiresexternalpullupresistorto
3 SCL DigitalInput
functionproperly.
4 GND GROUND Internallyconnectedtoallofthecircuitry.
3.0-Vto5.5-Vpower.Bypasswiththeparallelcombination
5 V+ POWER of1-μF(electrolyticortantalum)and0.1-μF(ceramic)
ESD
Clamp bypasscapacitors.
InterruptRequest.ActiveLow,NMOS,open-drain.
6 INT DigitalOutput
Requiresexternalpullupresistortofunctionproperly.
7 A0
Tri-LevelSerialAddresspinsthatallow9devicesona
8 A1 Tri-LevelInputs singleI2Cbus.
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PinFunctions (continued)
PIN
TYPE DESCRIPTION
NO. NAME ESDSTRUCTURE
9 IN7
10 IN6
11 IN5
12 IN4 Thefullscalerangewillbecontrolledbytheinternalor
AnalogInputs externalVREF.Theseinputscanbeassignedassingle-
13 IN3 endedand/orpseudo-differentialinputs.
14 IN2
15 IN1
16 IN0
7 Specifications
7.1 Absolute Maximum Ratings
overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1)(2)(3)Æ(4)
MIN MAX UNIT
SupplyVoltage(V+) 6.0 6 V
VoltageonSCL,SDA,A0,A1,INT –0.3 6 V
VoltageonIN0-IN7,VREF –0.3 (V++0.3) V
InputCurrentatAnyPin(5) ±5 mA
PackageInputCurrent(5) ±30 mA
MaximumJunctionTemperature (T )(6) 150 °C
JMAX
StorageTemperature,T –65 150 °C
stg
(1) AllvoltagesaremeasuredwithrespecttoGND,unlessotherwisespecified.
(2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexasInstrumentsSalesOffice/Distributorsforavailabilityand
specifications.
(3) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings
only,whichdonotimplyfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommended
OperatingConditions.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability.
(4) Forsolderingspecifications,SNOA549
(5) Iftheinputvoltageatanypinexceedsthepowersupply(thatis,VIN<GNDorVIN>V+)butislessthantheabsolutemaximum
ratings,thenthecurrentatthatpinmustbelimitedto5mA.The30mAmaximumpackageinputcurrentratinglimitsthenumberofpins
thatcansafelyexceedthepowersupplywithaninputcurrentof5mAtosixpins.Parasiticcomponentsand/orESDprotectioncircuitry
areshowninthePinDescriptionstable.
(6) ThemaximumpowerdissipationmustbederatedatelevatedtemperaturesandisdictatedbyT ,R andtheambienttemperature,
JMAX θJA
T .ThemaximumallowablepowerdissipationatanytemperatureisP =(T −T )/R .
A D JMAX A θJA
7.2 ESD Ratings
VALUE UNIT
Humanbodymodel(HBM),perANSI/ESDA/JEDECJS-001(1) ±3000
Charged-devicemodel(CDM),perJEDECspecificationJESD22- ±1000
V(ESD) Electrostaticdischarge C101(2) V
Machinemodel ±300
(1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess.
(2) JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess.
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7.3 Recommended Operating Conditions
overoperatingfree-airtemperaturerange(unlessotherwisenoted(1)
MIN MAX UNIT
SupplyVoltage(V+) 3 5.5 V
VoltageonSCL,SDA,A0,A1,INT –0.05 5.5 V
VoltageonIN0-IN7,VREF –0.05 (V++0.05) V
TemperatureRangeforElectricalCharacteristics –40 125 °C
OperatingTemperature –40 125 °C
(1) AllvoltagesaremeasuredwithrespecttoGND,unlessotherwisespecified.
7.4 Thermal Information
ADC128D818
THERMALMETRIC(1) PW(TSSOP) UNIT
16PINS
R Junction-to-ambientthermalresistance 130 °C/W
θJA
(1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheSemiconductorandICPackageThermalMetricsapplication
report,SPRA953.
7.5 DC Electrical Characteristics
Thefollowingspecificationsapplyfor3V ≤V+≤5.5V ,ExternalVREF=2.56V,unlessotherwisespecified.AlllimitsT
DC DC A
=T =25°Cunlessotherwisespecified(1).
J
PARAMETER TESTCONDITIONS MIN(2) TYP(3) MAX(2) UNIT
POWERSUPPLYCHARACTERISTICS
3.3or5 V
V+ SupplyVoltage
T =T =T toT 3 5.5
A J MIN MAX
2.56 V
ExternalReferenceVoltage
T =T =T toT 1.25 V+
A J MIN MAX
VREF
2.56 V
InternalReferenceVoltage
23 ppm/°C
InterfaceInactive,V+=5.5 T =T =T toT 0.74 mA
A J MIN MAX
V,Mode2
InterfaceInactive,V+=3.6
T =T =T toT 0.56 mA
V,Mode2 A J MIN MAX
I+ SupplyCurrent(seePower ShutdownMode,V+=5.5
Management). T =T =T toT 0.65 mA
V A J MIN MAX
ShutdownMode,V+=3.6
T =T =T toT 0.48 mA
V A J MIN MAX
DeepShutdownMode(4). T =T =T toT 10 µA
A J MIN MAX
TEMPERATURE-to-DIGITALCONVERTERCHARACTERISTICS
–40°C≤T ≤+125°C T =T =T toT ±3 °C
A A J MIN MAX
TemperatureError
–25°C≤T ≤+100°C T =T =T toT ±2 °C
A A J MIN MAX
Resolution 0.5 °C
ANALOG-to-DIGITALCONVERTERCHARACTERISTICS
n Resolution 12-bitwithfull-scaleatVREF=2.56V. 0.625 mV
(1) EachinputandoutputisprotectedbyanESDstructuretoGND,asshowninthe.Inputvoltagemagnitudeupto0.3VaboveV+or0.3
VbelowGNDwillnotdamagetheADC128D818.Therearediodesthatexistbetweensomeinputsandthepowersupplyrails.Errorsin
theADCconversioncanoccurifthesediodesareforwardbiasedbymorethan50mV.Asanexample,ifV+is4.5V ,INx(where0≤
DC
x≤7)mustbe≤4.55V toensureaccurateconversions.
DC
(2) LimitsareensuredtoAOQL(AverageOutgoingQualityLevel).
(3) TypicalsareatT =T =25°Candrepresentmostlikelyparametricnormal.
J A
(4) Limitisspecifiedbycharacterization.
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DC Electrical Characteristics (continued)
Thefollowingspecificationsapplyfor3V ≤V+≤5.5V ,ExternalVREF=2.56V,unlessotherwisespecified.AlllimitsT
DC DC A
=T =25°Cunlessotherwisespecified(1).
J
PARAMETER TESTCONDITIONS MIN(2) TYP(3) MAX(2) UNIT
ExternalVREF=1.25V, 0.36
Pseudo-Differential,V+=3 LSb
Vto3.3V.(4) TA=TJ=TMINtoTMAX –1 1
ExternalVREF=2.56V, 1.58
INL IntegralNon-Linearity
Pseudo-Differential
ExternalVREF=5V, LSb
T =T =T toT –2 4
Pseudo-Differential,V+=5 A J MIN MAX
Vto5.5V.
±0.25
DNL DifferentialNon-Linearity See (5) LSb
T =T =T toT –1 1
A J MIN MAX
InternalVREF,Single-
Ended,V+=3Vto3.6V.
InternalVREF,Single- TA=TJ=TMINtoTMAX –0.5 0.5 %ofFS
Ended,V+=4.5Vto5.5
V(7).
InternalVREF,Pseudo-
Differential,V+=3Vto3.6 T =T =T toT –0.3 0.5 %ofFS
A J MIN MAX
VorV+=4.5Vto5.5V(7).
ExternalVREF=1.25V,
TUE TotalUnadjustedError(6) Single-Ended,V+=3Vto TA=TJ=TMINtoTMAX
3.6V.
–0.6 0.1 %ofFS
ExternalVREF=2.56V,
Single-Ended,V+=3Vto T =T =T toT
A J MIN MAX
5.5V.
ExternalVREF=1.25V,
Pseudo-Differential,V+=3 T =T =T toT
A J MIN MAX
Vto3.6V.
–0.45 0.2 %ofFS
ExternalVREF=2.56V,
Pseudo-Differential,V+=3 T =T =T toT
A J MIN MAX
Vto5.5V.
InternalVREF,V+=3Vto
3.6V.
T =T =T toT –0.25 0.45 %ofFS
A J MIN MAX
InternalVREF,V+=4.5V
to5.5V(7)
GE GainError
ExternalVREF=1.25Vor
2.56V,V+=3Vto3.6V.
T =T =T toT –0.45 0.2 %ofFS
A J MIN MAX
ExternalVREF=2.56Vor
5V,V+=4.5Vto5.5V.
InternalVREF,Pseudo-
Differential,V+=4.5Vto T =T =T toT –0.15 0.2 %ofFS
A J MIN MAX
5.5V(7).
ExternalVREF=1.25Vor
2.56V,Single-Ended,V+=
3Vto3.6V.
T =T =T toT –0.5 0.1 %ofFS
A J MIN MAX
ExternalVREF=2.56Vor
OE OffsetError 5V,Single-Ended,V+=
4.5Vto5.5V
ExternalVREF=1.25Vor
2.56V,Pseudo-Differential,
V+=3Vto3.6V.
T =T =T toT –0.2 0.15 %ofFS
A J MIN MAX
ExternalVREF=2.56Vor
5V,Pseudo-Differential,
V+=4.5Vto5.5V
(5) Limitisspecifiedbydesign.
(6) TUE(TotalUnadjustedError)includesOffset,GainandLinearityerrorsoftheADC.
(7) Therangeisupto7/8offullscale.
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DC Electrical Characteristics (continued)
Thefollowingspecificationsapplyfor3V ≤V+≤5.5V ,ExternalVREF=2.56V,unlessotherwisespecified.AlllimitsT
DC DC A
=T =25°Cunlessotherwisespecified(1).
J
PARAMETER TESTCONDITIONS MIN(2) TYP(3) MAX(2) UNIT
EachEnabledVoltageChannel 12 ms
ContinuousConversionMode
InternalTemperatureSensor 3.6 ms
t
C
EnabledVoltageChannel(s)andInternal
LowPowerConversionMode 728 ms
TemperatureSensor
MULTIPLEXER/ADCINPUTCHARACTERISTICS
2
R ON-Resistance kΩ
ON
T =T =T toT 10
A J MIN MAX
InputCurrent(OnChannel
I ±0.005 μA
ON LeakageCurrent)
I OffChannelLeakageCurrent ±0.005 μA
OFF
DIGITALOUTPUTS:INT
I =5.0mAatV+=4.5
OUT
V Logical0OutputVoltage V,I =+3mAatV+=+3 T =T =T toT 0.4 V
OUT(0) OUT A J MIN MAX
V
OPENDRAINSERIALBUSOUTPUT:SDA
I =3.0mAatV+=4.5
V Logical0OutputVoltage OUT T =T =T toT 0.4 V
OUT(0) V, A J MIN MAX
0.005
I HighLevelOutputCurrent V =V+ μA
OH OUT
T =T =T toT 1
A J MIN MAX
DIGITALINPUTS:A0andA1
V Logical1InputVoltage T =T =T toT 0.9×V+ 5.5 V
IN(1) A J MIN MAX
V LogicalMiddleInputVoltage T =T =T toT 0.43× 0.57×
IM A J MIN MAX
V+ V+
V Logical0InputVoltage T =T =T toT GND– 0.1×V+ V
IN(0) A J MIN MAX
0.05
SERIALBUSINPUTS:SCLandSDA
V Logical1InputVoltage T =T =T toT 0.7×V+ 5.5 v
IN(1) A J MIN MAX
V Logical0InputVoltage T =T =T toT GND– 0.3×V+ V
IN(0) A J MIN MAX 0.05
V+=3.3V 0.67 V
V HysteresisVoltage
HYST V+=5.5V 1.45 V
ALLDIGITALINPUTS:SCL,SDA,A0,A1
–0.005
I Logical1InputCurrent V =V+ µA
IN(1) IN
T =T =T toT −1
A J MIN MAX
0.005
I Logical0InputCurrent V =0V µA
IN(0) IN DC
T =T =T toT 1
A J MIN MAX
C DigitalInputCapacitance 20 pF
IN
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7.6 AC Electrical Characteristics
Thefollowingspecificationsapplyfor+3.0V ≤V+≤+5.5V ,unlessotherwisespecified.AlllimitsT =T =25°Cunless
DC DC A J
otherwisespecified.
PARAMETER TESTCONDITIONS MIN(1) TYP(2) MAX(1) UNIT
SERIALBUSTIMINGCHARACTERISTICS
t SCL(Clock)Period T =T =T toT 2.5 100 µs
1 A J MIN MAX
t DataInSet-upTimetoSCLHigh T =T =T toT 100 ns
2 A J MIN MAX
t DataOutStableAfterSCLLow T =T =T toT 0 ns
3 A J MIN MAX
t SDALowSet-upTimetoSCLLow T =T =T toT 100 ns
4 A J MIN MAX
(start)
t SDAHighHoldTimeAfterSCLHigh T =T =T toT 100 ns
5 A J MIN MAX
(stop)
SCLorSDAtimelowforI2Cbus T =T =T toT 25 35 ms
t A J MIN MAX
TIME-OUT reset
(1) LimitsareensuredtoAOQL(AverageOutgoingQualityLevel).
(2) TypicalsareatT =T =25°Candrepresentmostlikelyparametricnormal.
J A
Figure1. SerialBusTimingDiagram
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7.7 Typical Characteristics
ThefollowingtypicalperformanceplotsapplyfortheinternalVREF=2.56V,V+=3.3V,Pseudo-Differentialconnection,
unlessotherwisespecified.AlllimitsT =T =25°Cunlessotherwisespecified.
A J
0.023 -0.010
0.014 -0.074
0.004 -0.138
%) %)
E ( E (
U U
T-0.005 T-0.202
-0.015 -0.266
-0.024 -0.330
500.0 1.2k 1.9k 2.7k 3.4k 4.1k 500.0 1.2k 1.9k 2.7k 3.4k 4.1k
CODE CODE
Figure2.TUEvs.Code Figure3.TUEvs.Code(ExternalVREF=1.25V)
-0.020 -0.020
-0.060 -0.064
-0.100 -0.108
%) %)
E ( E (
U U
T-0.140 T-0.152
-0.180 -0.196
-0.220 -0.240
500.0 1.2k 1.9k 2.7k 3.4k 4.1k 500.0 1.2k 1.9k 2.7k 3.4k 4.1k
CODE CODE
Figure4.TUEvs.Code(ExternalVREF=2.56V) Figure5.TUEvs.Code(ExternalVREF=5V,V+=5V)
Figure6.INLvs.Code(ExternalVREF=1.25Vfor1Unit) Figure7.INLvs.Code(ExternalVREF=1.25Vfor28Units)
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