Surface Mount Technology: Principles and Practice

791 Pages·1997·24.05 MB·English

by  Ray P. Prasad (auth.)

Ray Prasad Consultancy Group, Portland, Oregon
SPRINGER-SCIENCE+BUSINESS MEDIA, B.V.
Library of Congress Cataloging-in-Publication Data
Prasad, Ray P.
Surface mount technology 1 Ray Prasad. --2nd ed.
p. cm.
Includes bibliographical references and index.
ISBN 978-0-412-12921-6 ISBN 978-1-4615-4084-7 (eBook)
DOI 10.1007/978-1-4615-4084-7
1. Surface mount technology. I. Title.
TK7868.P7P7 1997
621.3815'31--dc21 96.40513
CIP
British Library Cataloging in Publication Data Available
Copyright © 1997 by Springer Science+Business Media Dordrecht
Originally published by Chapman & Hall in 1997
Softcover reprint ofthe hardcover 2nd edition 1997
Ali rights reserved. No part of this publication may be reproduced, stored in a retrieval
system or transmitted in any form or by any means, mechanical, photo-copying, recording,
or otherwise, without the prior written permission of the publisher, Springer-Science +
Business Media, B.V.
"Surface Mount Technology" is intended to present technically accurate and authoritative
information from highly regarded sources. The publisher, editors, authors, advisors, and
contributors have made every reasonable effort to ensure the accuracy ofthe information,
but cannot assume responsibility for the accuracy of ali information, or for the consequences
ofits use.
Printed on acid-free paper.
To my wife Peggy
and my children Geeta, Joe, and Kevin
the ones who really made it possible
Brief Contents
PART ONE
INTRODUCTION TO SURFACE MOUNTING
Chapter 1 Introduction to Surface Mount Technology 3
Chapter 2 Implementing SMT In-House and at Subcontractors 51
PART TWO
DESIGNING WITH SURFACE MOUNTING
Chapter 3 Surface Mount Components 85
Chapter 4 Substrates for Surface Mounting 149
Chapter 5 Surface Mount Design Considerations 204
Chapter 6 Surface Mount Land Pattern Design 264
Chapter 7 Design for Manufacturability 296
PART THREE
MANUFACTURING WITH SURFACE MOUNTING
Chapter 8 Adhesive and Its Application 339
Chapter 9 Solder Paste and Its Application 383
Chapter 10 Metallurgy of Soldering and Solderability 444
Chapter 11 Component Placement 493
Chapter 12 Soldering of Surface Mounted Components 533
Chapter 13 Flux and Cleaning 598
Chapter 14 Quality Control, Inspection, Repair, and Testing 651
APPENDIX A
SURFACE MOUNT STANDARDS 725
APPENDIXB
DETAILED QUESTIONNAIRE FOR EVALUATING SMT EQUIPMENT:
PICK-AND-PLACE (APPENDIX Bl), SCREEN PRINTER (APPENDIX B2),
AND REFLOW OVEN (APPENDIX B3) 735
viii Brief Contents
APPENDIX C
GLOSSARY 747
INDEX 759
Table of Contents
Dedication v
Foreword xx
Preface xxiii
Acknowledgments xxvi
About the Author xxviii
Part One
Introduction to Surface Mounting
Chapter 1 Introduction to Surface Mount Technology 3
1.0 Introduction 3
1.1 Types of Surface Mounting 7
1.2 Benefits of Surface Mounting 14
1.3 SMT Equipment Requiring Major Capital Investment 20
1.3.1 Pick-and-Place Equipment 22
1.3.2 Solder Paste Screen Printer 23
1.3.3 Curing/Baking Oven 23
1.3.4 Reflow Soldering Equipment 24
1.3.5 Cleaning 25
1.3.6 Wave Soldering Equipment 25
1.3.7 Repair and Inspection Equipment 26
1.4 When to Use Surface Mounting 27
1.5 Technical Issues in. Surface Mounting 28
1.6 Trends in Surface Mounting 31
1.7 The Future 33
1.7.1 Chip-and-Wire Technology 36
1.7.2 Tape-Automated Bonding (TAB) 38
1.7.3 Flip Chip or Controlled Collapse Bonding 41
1.7.4 Multichip Module 47
1.8 Summary 49
References 50
x Table of Contents
Chapter 2 Implementing SMT In-House and at Subcontractors 51
2.0 Introduction 51
2.1 Setting the Implementation Strategy 52
2.2 Building the SMT Infrastructure 55
2.2.1 Developing the Internal SMT Infrastructure 56
2.2.1.1 Writing the Plan 56
2.2.1.2 Management Review 56
2.2.1.3 Hands-On Experience 57
2.2.1.4 Process Selection 58
2.2.1.5 Training 59
2.2.2 Influencing External SMT Infrastructure 60
2.3 Setting In-House Manufacturing Strategy 63
2.4 Selection of an Outside Assembly House 64
2.4.1 Reasons for Not Using Suppliers 64
2.4.2 Reasons for Using Suppliers 65
2.4.3 Evaluation and Qualification of Suppliers 67
2.4.4 Stages of Supplier Qualification 67
2.4.4.1 Preliminary Survey 68
2.4.4.2 Evaluation Status 68
2.4.4.3 Conditional Qualification Status 68
2.4.4.4 Approved Qualification Status 69
2.4.5 Supplier Rating 69
2.4.6 Questionnaires for Rating of Suppliers 70
2.4.6.1 Business Questions 71
2.4.6.2 Technology Questions 72
2.4.6.3 Manufacturing Questions 74
2.4.6.4 Quality Assurance Questions 75
2.4.7 Supplier Management or Partnership 76
2.5 Managing the Risk: Pilot to Production 78
2.6 Summary 80
Part Two
Designing with Surface Mounting
Chapter 3 Surface Mount Components 85
3.0 Introduction 85
3.1 Surface Mount Component Characteristics 86
3.2 Passive Surface Mount Components 87
3.2.1 Surface Mount Discrete Resistors 88
3.2.2 Surface Mount Resistor Networks 91
3.2.3 Ceramic Capacitors 92
3.2.4 Tantalum Capacitors 97
3.2.5 Tubular Passive Components 101
3.3 Active Components: Ceramic Packages 103
Table of Contents xi
3.3.1 Leadless Ceramic Chip Carriers 104
3.3.2 Ceramic Leaded Chip Carriers (Preleaded and Postleaded) 108
3.4 Active Components: Plastic Packages 109
3.4.1 Small Outline Transistors 112
3.4.2 Small Outline Integrated Circuits (SOlCs and SOPs) 114
3.4.3 Plastic Leaded Chip Carriers 121
3.4.4 Small Outline J Packages 124
3.4.5 Fine Pitch Packages 126
3.5 Ball Grid Arrays (BGAs) 129
3.5.1 Ceramic Ball Grid Array (CBGA) 131
3.5.2 Ceramic Column Grid Array (CCGA) 132
3.5.3 Plastic Ball Grid Array (PBGA) 133
3.5.4 Tape Ball Grid Array (TBGA) 135
3.6 Chip Scale Packaging 136
3.7 Major Issues in Components 138
3.7.1 Lead Coplanarity 138
3.7.2 Lead Configuration 140
3.7.2.1 Gull Wing 140
3.7.2.2 Balls (in BGA) 141
3.7.2.3 J Lead 142
3.7.2.4 Butt or I Lead 142
3.7.3 Standardization 144
3.8 Component Procurement Guidelines 144
3.9 Summary 146
References 147
Chapter 4 Substrates for Surface Mounting 149
4.0 Introduction 149
4.1 Glass Transition Temperature (Tg) 150
4.2 X, Y, and Z Coefficients of Thermal Expansion 152
4.3 Selection of Substrate Material 155
4.3.1 CTE Compatibility Considerations in Substrate Selection 163
4.3.2 Process Considerations in Substrate Selection 165
4.4 Ceramic Substrates 167
4.4.1 Porcelainized Steel Substrates 168
4.5 Constraining Core Substrates 169
4.5.1 Low CTE Metal Core Substrate 169
4.5.2 Graphite Epoxy Constraining Core Substrates 172
4.6 Compliant Layer Substrates 173
4.7 Glass Epoxy Substrates 174
4.7.1 Types of Glass Epoxy Substrate 176
4.7.2 Operating Temperatures for Glass Epoxy Boards 178
4.7.3 Fabrication of Glass Epoxy Substrates 178
4.8 Plating Processes 184
4.8.1 Copper Plating 186
4.8.2 Gold Plating 189
xii Table of Contents
4.8.3 Nickel Plating 189
4.8.4 Lead-Tin Solder Plating 189
4.9 Alternative Coatings for Board Surfaces 191
4.10 Solder Mask Selection 194
4.10.1 Wet versus Dry Film Solder Masks 195
4.10.2 Photoimageable Solder Masks 197
4.11 Via Hole Cracking Problems in Substrates 198
4.12 Summary 201
References 202
Chapter 5 Surface Mount Design Considerations 204
5.0 Introduction 204
5.1 System Design Considerations 205
5.2 Package Drivers 207
5.2.1 PGA Drivers 209
5.2.2 Fine Pitch Drivers 211
5.2.3 Ball Grid Array (BGA) Drivers 211
5.2.4 Issues in Component Packaging 211
5.3 Real Estate Considerations 212
5.4 Manufacturing Considerations 214
5.5 Cost Considerations 218
5.5.1 Printed Circuit Board Cost 218
5.5.2 Component Cost 224
5.5.3 Assembly Cost 225
5.6 Thermal Considerations 226
5.7 Package Reliability Considerations 232
5.7.1 Package Cracking Mechanism 234
5.7.2 Solutions to Package Cracking 244
5.7.3 Moisture Sensitivity Classification for Package Cracking 248
5.8 Solder Joint Reliability Considerations 250
5.8.1 Solder Joint Reliability Tests 253
5.9 Interconnect Considerations 257
5.10 CAD Layout Considerations 260
5.11 Summary 261
References 261
Chapter 6 Surface Mount Land Pattern Design 264
6.0 Introduction 264
6.1 General Considerations for Land Pattern Design 266
6.2 Land Patterns for Passive Components 266
6.2.1 Land Pattern Design for Rectangular Passive Components 269
6.2.2 Land Pattern Design for Tantalum Capacitors 270
6.3 Land Patterns for Cylindrical Passive (MELF) Devices 272
6.4 Land Patterns for Transistors 275