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PFC Abatement in the Semiconductor Industry 2009 PDF

44 Pages·2009·0.33 MB·English
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PFC Abatement in the  Semiconductor Industry 2009 Joe Van Gompel Glade Consulting, LLC SESHA 31st International Symposium, Scottsdale AZ May 19 – 22, 2009 Overview PFCs are stable and difficult to abate (cid:122) Reactions and thermodynamics (cid:122) Approaches to abatement of PFCs (cid:122) Burn‐wet (cid:122) Plasma (cid:122) Catalytic (cid:122) The HF Question (cid:122) Commercial Solutions (cid:122) Applied Materials / Metron “Marathon” (cid:122) Centrotherm CT‐BW  (cid:122) DAS Escape (cid:122) Edwards Atlas, TPU, Sirius, ERIX (cid:122) Guild Trinity (cid:122) Glade Consulting, LLC Founded 2008, Austin TX (cid:122) Joe Van Gompel, President (cid:122) PhD, physical organic chemistry, University of Illinois (cid:122) 12 years as POU abatement specialist at (BOC) Edwards (cid:122) 5 Years, FTIR Specialist at (Thermo) Mattson/Nicolet (cid:122) Subfab operability consulting (cid:122) Fabwide abatement strategies (cid:122) PFC emissions reduction strategies (cid:122) POU abatement – recommendations, uptime (cid:122) Vacuum pumps (cid:122) Emissions testing (cid:122) PFC emissions audits (cid:122) Training seminars (cid:122) PFC Gases in the Semiconductor Industry The semiconductor industry phased in PFCs to replace  (cid:122) chlorinated ODSs in the 1980s PFCs were nontoxic and didn’t deplete ozone (cid:122) PFCs were heavily used in chamber cleans since the  (cid:122) early 1990s Primarily C F and CF mostly phased out in favor of NF (cid:122) 2 6 4, 3 Still a global warmer, but well‐utilized in chamber, so effect  (cid:122) is minimized Significant PFC consumption in etch, especially CF and CHF (cid:122) 4 3 Etch is major emission component in most modern fabs (cid:122) Difficult to optimize – need proper ratio of C, H, O, and F for  (cid:122) anisotropic etch Why PFCs are Such Potent Global Warming Gases Infrared spectrum of the atmosphere NF 3 SF 6 C F 3 8 C F 2 6 CF , C F , C F 4 2 6 3 8 CO H O CO H O 2 2 2 2 10 µ, 10,000 nm 5 µ, 5,000 nm 3.3 µ, 3,333 nm 5 Visible light ‐ red 0.7 u, violet 0.36 u Relative Stabilities of PFCs Lifetimes and Stabilities Fluorinated Gas Lifetime (years) CF 50,000 4 C F 10,000 2 6 SF 3200 6 C F 2600 3 8 c‐C F 3200 4 8 NF 740 3 CHF 270 3 CH F 4.9 2 2 This is closely related to ease of abatement PFC Gases are Very Stable Compounds Carbon‐fluorine bond is strongest single bond in all of  (cid:122) chemistry Multiple C‐F bonds on the same carbon enhance stability (cid:122) C‐C or C‐H bonds are weaker and decrease stability (cid:122) S‐F bond is strong too (cid:122) Stability is reflected in atmospheric lifetimes (cid:122) Stability is closely related to ease of abatement (cid:122) CF (cid:122) 4 C F , SF (cid:122) 2 6 6 C F , c‐C F , NF (cid:122) 3 8 4 8 3 CHF , CH F , CHF , C F , C F (cid:122) 3 2 2 3 5 8 4 6 Thermodynamics in Chemistry Chemical reactions proceed (cid:122) preferentially “downhill” to lower energy products These are exothermic reactions – they liberate (cid:122) heat Products Chemical reactions can be forced to (cid:122) H < 0  proceed “up hill”, where the products Starting  (Endothermic) have more energy than the reactants Materials y – energy or heat have to be put into g r them e n These are endothermic reactions – they E H > 0  (cid:122) absorb heat (get cold) (Exothermic) Thermodynamics simply tell if a (cid:122) Products reaction is favored or not. Thermodynamics are not always indicative of how fast a reaction will proceed (kinetics) Bond Strengths BOND kcal/mol kJ/mol F C – F  130 543 (CF , Freon 14) 3 4 F C‐CF – F  127 531 (C F , Freon116) 3 2  2 6 H C – F  3 108 452 F C – H  (Freon 23) 3 106 444 H C – H (methane) 3 105

Description:
○Approaches to abatement of PFCs. ○ Burn-wet. ○ Plasma. ○ Catalytic. ○ The HF Question Guild Trinity .. Total exhaust gas flow. ○ N. 2.
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