Table Of Content

MT6186M RF System Datasheet Version: 0.2 Release date: 2019-01-18 Specifications are subject to change without notice. © 2019 MediaTek Inc. This document contains information that is proprietary to MediaTek Inc. . Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited MT6186M RF System Datasheet Confidential A Document Revision History Revision Date Author Description 0.1 2019-01-11 Ee Sze Khoo Initial draft 1. Updated Chapter 5, TX specifications. 0.2 2019-01-18 Johoo Lin 2. Updated supported band table in 1.2. MediaTekConfidentialA MediaTek Confidential © 2019 MediaTek Inc. Page 2 of 48 This document contains information that is proprietary to MediaTek Inc. Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited. MT6186M RF System Datasheet Confidential A Table of Contents Document Revision History .............................................................................................................................. 2 Table of Contents............................................................................................................................................. 3 1 Introduction .......................................................................................................................................... 5 1.1 Overview ........................................................................................................................................... 5 1.2 Key Features ...................................................................................................................................... 5 2 Block Diagram and Application Diagram ................................................................................................ 7 3 General Specifications ........................................................................................................................... 9 3.1 Packaging .......................................................................................................................................... 9 3.2 IC Marking ....................................................................................................................................... 10 3.3 RF I/O List ........................................................................................................................................ 11 3.4 Ball Assignment ............................................................................................................................... 13 3.5 Absolute Maximum Ratings ............................................................................................................ 14 3.6 Operating Conditions ...................................................................................................................... 15 3.7 BSI Speed ......................................................................................................................................... 16 4 Supply Specification ............................................................................................................................ 17 4.1 External Power Supplies and Interfaces .......................................................................................... 17 5 Transmitter ......................................................................................................................................... 18 5.1 TX Block Diagram............................................................................................................................. 18 5.2 4G FDD/TDD Transmitter Chain Performance Specification ........................................................... 21 5.3 4G FDD/TDD CCA Transmitter Chain Performance Specification.................................................... 24 5.4 3G FDD Transmitter Chain Performance Specification ................................................................... 25 5.5 3G TDD Transmitter Chain Performance Specification ................................................................... 26 5.6 3G C2K Transmitter Chain Performance Specification .................................................................... 27 5.7 2G Transmitter Chain Performance Specification ........................................................................... 28 5.8 Transmitter Power Control Specification ........................................................................................ 29 6 Receiver............................................................................................................................................... 30 6.1 TD-SCDMA Specification ................................................................................................................. 32 6.1.1 TD-SCDMA RX Specification .......................................................................................... 32 6.1.2 TD-SCDMA RX Specification (For eLNA Application) ..................................................... 32 6.2 GGE (2G GSM/GPRS/EDGE) Specification ....................................................................................... 33 6.2.1 GGE RX Specification ..................................................................................................... 33 6.2.2 GGE RX Specification (For eLNA Application) ................................................................ 33 6.3 CDMA Specification ......................................................................................................................... 34 6.3.1 CDMA RX Specification .................................................................................................. 34 6.3.2 CDMA RX Specification (For eLNA Application) ............................................................. 34 6.4 WCDMA Specification ..................................................................................................................... 36 6.4.1 WCDMA RX Specification .............................................................................................. 36 6.4.2 WCDMA RX Specification (For eLNA Application) ......................................................... 37 6.5 LTE Specification ............................................................................................................................. 39 6.5.1 LTE RX Specification....................................................................................................... 39 MediaTek Confidential © 2019 MediaTek Inc. Page 3 of 48 This document contains information that is proprietary to MediaTek Inc. Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited. MT6186M RF System Datasheet Confidential A 6.5.2 LTE RX Specification (For eLNA Application) ................................................................. 41 7 Digital Control Interfaces ..................................................................................................................... 45 7.1 Introduction .................................................................................................................................... 45 7.2 Power-on Reset ............................................................................................................................... 46 7.3 BSI Interface .................................................................................................................................... 47 8 Reference Clock Specification .............................................................................................................. 48 8.1 Reference Input Buffer Specification (CLK26M) .............................................................................. 48 8.2 26MHz Clock Specification .............................................................................................................. 48 Lists of Figures Figure 2-1. RFSYS block diagram ............................................................................................................................. 7 Figure 3-1. Ball map .............................................................................................................................................. 13 Figure 5-1. TX block diagram (TX0) ....................................................................................................................... 19 Figure 6-1. RX block diagram ................................................................................................................................ 30 MediaTek Confidential © 2019 MediaTek Inc. Page 4 of 48 This document contains information that is proprietary to MediaTek Inc. Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited. MediaTek Confidential A MT6186M RF System Datasheet Confidential A 1 Introduction 1.1 Overview MT6186M is a multi-mode multi-band highly integrated transceiver in 28nm CMOS. This document describes the performance targets for the RF stand-alone chip to be embedded in the overall platform. 1.2 Key Features  Full multi-mode RF solution (C2K/GGE/WCDMA/TDSCDMA/LTE/LTE-CA) o Multi-band LTE/WCDMA/TD-SCDMA/GGE/C2K 64QAM UL/256QAM DL (HSPA+/LTE) o o C2K/2G/3G/4G co-banding o Supports RxD (15 RxD ports) o Supports SRLTE  Direct conversion transmitter (LTE/3G/8-PSK) and DFM for GMSK MediaTek Confidential © 2019 MediaTek Inc. Page 5 of 48 This document contains information that is proprietary to MediaTek Inc. Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited. MT6186M RF System Datasheet Confidential A o Dedicated power detection circuits for power control over specific power range o 2LB+2MB+1HB/UHB TX0 output port  Hybrid Direct-Conversion (4G/3G/C2K)/Low-IF (GGE, DC-HSDPA) receiver o 15+15 Rx input ports o 2+2 sets single ended RXIF IQ outputs.  Supports external LNA at RxP and RxD  Low supply current and operation directly from dual DC-DC converters  Supports RF Calibration features for key RX and TX specifications (image rejection, LO feed-through, IIP2, DC offset, RC corner)  Temperature measurement sub-system  LTE carrier aggregation (CA) o Supports 1UL+2DL CA.  Supports RX 4*4 MIMO for MHB case  Supports LTE Power Class 2 high-power UE (HPUE) in band 41 up to 40MHz MediaTek Confidential © 2019 MediaTek Inc. Page 6 of 48 This document contains information that is proprietary to MediaTek Inc. Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited. MT6186M RF System Datasheet Confidential A 2 Block Diagram and Application Diagram LAA/UHB(x2) MHB(x8) LB(x5) HB/UHB MB (x2) LB (x2) DET input XRPXRD FroI-mI TTG detroppus MSG iXT0 (w) PDXXR0/R0 XRS0 XT0 revirD MB revirD LB U/HB revirD DPXXR1/R1 XRS1 AIT AIT DET PATH LO 2 2 From SRX0 AGP AGP Controller DCO STX-dig STX0 2 2 4 2 Figure 2-1. RFSYS block diagram  RXIF IQ output loading model MT6186M D die R =150ohm R =1ohm lay EVB OUT R Clay+pkg=2pF CEVB,Max=15pF Clay+pkg=2pF adc For the applications with bandwidth beyond LTE 30MHz, for example NC-CA, we highly recommend that the ding should be small enough (<15pF) to avoid extra drooping in band-edge and pPeCrBfo lromaance degradation. Inevitably, in some special cases, the PCB IQ traces may be longer and make PCB loading larger, and the value will be up to several tens of pF. In these cases, limited performance can only be achieved. For example, the maximal throughput will be degraded. MediaTek Confidential © 2019 MediaTek Inc. Page 7 of 48 This document contains information that is proprietary to MediaTek Inc. Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited. MT6186M RF System Datasheet Confidential A PCB trace requirements of RX IF interface: 1. Capacitance loading < 15pF 2. Mismatch between capacitance of I path and Q path < 10% 3. The trace to trace isolation has been defined in system application note. Pay attention to the isolation between traces for required performance. MediaTek Confidential © 2019 MediaTek Inc. Page 8 of 48 This document contains information that is proprietary to MediaTek Inc. Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited. MT6186M RF System Datasheet Confidential A 3 General Specifications 3.1 Packaging FCCSP is currently considered for this product. Parameter Single die Body size (width/length/height) 4.8*5.3*0.82mm Ball spacing 0.35mm Ball array 17*19 MediaTek Confidential © 2019 MediaTek Inc. Page 9 of 48 This document contains information that is proprietary to MediaTek Inc. Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited. MT6186M RF System Datasheet Confidential A 3.2 IC Marking MediaTek Confidential © 2019 MediaTek Inc. Page 10 of 48 This document contains information that is proprietary to MediaTek Inc. Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited.