Direct-Write Technologies for Rapid Prototyping. Sensors, Electronics, and Integrated Power Sources

726 Pages·2002·14.018 MB·English

by  Alberto Piqué (Auth.)

ECAFERP
Direct-write technologies are the most recent and novel approaches to the
fabrication of electronic and sensor devices, as well as integrated power
sources, whose sizes range from the meso- to the nanoscales. The term
direct write refers to any technique or process capable of depositing, dispen-
sing, or processing different types of materials over various surfaces following a
preset pattern or layout. The ability to accomplish both pattern and material
transfer processes simultaneously represents a paradigm shift away from the
traditional approach for device manufacturing based on lithographic techni-
ques. However, the fundamental concept of direct writing is not new. Every
piece of handwriting, for instance, is the result of a direct-write process
whereby ink or lead is transferred from a pen, or pencil onto paper in a
pattern directed by our hands. The immense power and potential of direct
writing lies in its ability to transfer and/or process any type of material over
any surface with extreme precision resulting in a functional structure or
working device.
Direct-write technologies are a subset of the larger area of rapid prototyping
and deal with coatings or structures considered to be two-dimensional in
nature. With the tremendous breakthroughs in materials and the methods used
to apply them, many of which are discussed in this book, direct-write
technologies are poised to be far-reaching and influential well into the
future. The industry's push toward these technologies and the pull from
applicationsmrapidly changing circuits, designs, and commercial marketsm
are documented for the first time here. Although direct-write technologies are
serial in nature, they are capable of generating patterns, of high-quality
electronic, sensor, and biological materialsmamong others--at unparalleled
xix
XX Preface
speeds, rendering these technologies capable of satisfying growing commercial
demands.
The value of commercialization in promoting new technologies and direct
write's potential in commercial markets both deserve further attention. For
instance, the extent to which the use of integrated circuit processes continues
to grow amazes even those active in the electronics field. Indeed, as with all
things, the physical aspects of such processes can make their use restrictive,
thus designers are looking elsewhere to fulfill customer demand for their
overall miniaturization. One area, conformal passives, has already been
recognized as having great potential in this regard. Meanwhile, the design,
testing, and commercial production of miniaturized electronics are rapidly
changing.
Many of the direct-write techniques covered in this book can be used to
provide a working prototype in a mere matter of minutes. This is remarkable
when compared to conventional approaches whose mask design and pattern-
ing can take days or weeks. While most direct-write techniques are in the
mesoscale regime in size (from millimeters to 10 gm)--in other words, not as
small as photolithography--they are agile in the sense that one prototype can
be totally different from the next with almost no effort. Furthermore, the speed
of these direct-write techniques makes them viable for the final production,
especially if it is a small lot.
With such powerful technologies on the brink of widespread commercia-
lization, the appearance of this text is very timely. etirW-tceriD seigolonhceT for
dipaR gnipytotorP Applications is the first and only book on this topic that
discusses the wide range of existing direct-write technologies, including both
those that are already poised for commercialization and others still in the
development stage that are creating physical structures pushing the limits of
nanoscale fabrication. This book is the result of the vision of Dr. Bill Warren
and the Mesoscopic Integrated Conformal Electronics (MICE) program, which
Dr. Warren lead while at DARPA. It was his interest and motivation that
resulted in various teams forming across the U.S. to further the development of
new materials and deposition techniques, and this text is a natural conse-
quence of their work. But this book goes far beyond the scope of the MICE
program's work to include issues and approaches that one program alone could
not. The goal of this text is to cover a representative cross-section of these
topics, thereby providing a foundation for further work and commercial
development. It can be used as a tool as well as a reference by both commercial
production engineers and bench-level research scientists.
This book is organized into four parts: Applications, Materials, Direct-Write
Techniques, and Overview of Technologies for Pattern and Material Transfer.
We felt it was best to begin our discussion of direct-write technologies with the
area driving their developmental research. This first part consists of four
ecaferP xxi
chapters covering applications in passive and active electronic devices, micro-
electronic manufacturing, electrical power sources, and sensor systems.
The second part of the book focuses on the key to making most of those
applications become a realitymthe starting materials.
The third part of the book is dedicated to an examination of the numerous
direct-write techniques either currently available or in development. The cross-
section of different techniques addressed by these eleven chapters is unique
because the scale with which each process works varies from centimeters to
nanometers. The cross-section is thus meant to represent the incredibly broad
impact direct-write technologies can have in research and industry.
The first four chapters of this part describe dispensing-type approaches to
,MT
direct writing such as Ink Jet, Micropen thermal spraying, and dip-pen
nanolithography. The next two chapters cover direct-write techniques based on
electron and focused ion beams, while the last five chapters deal with laser-
based direct-write techniques.
The book concludes with a technology overview chapter. Putting direct-
write technologies in perspective for the electronics and sensor communities at
large was a daunting task. This chapter's contributor deserves special mention
for the monumental and timely effort he put forth to be comprehensive and
clear about the value of these new technologies against the backdrop of
decades of lithographic and other patterning processes.
As with all books covering a wide-ranging area, it is impossible to be fully
comprehensive addressing all techniques and issues. Given the space limita-
tion, we chose those topics that we thought were the most important
representations of this growing field. Still, we know there are novel and
exciting topics that we were not able to include or of which we were unaware.
In addition, as with any text in a rapidly changing field, by the time this book
goes to print, some new development will already have been made. But we feel
that this text will have a significant life as it is the first book on this topic as
well as the first to group comprehensive overviews of the numerous apects of
direct-write processes in a single volume.
Perhaps more importantly, we have asked each contributor to discuss the
potential of that chapter's technique in the growing field of direct-write
technologies.
While this book serves as the most current overview of direct writing,
conference proceedings on direct-write technologies and related topics are
other sources for the latest information in the field. For the reader desiring
more information on any given topic we would suggest a look at the extensive
references provided with each chapter as well as a literature search on that
particular contributor.
Lastly, the editors would like to thank all the contributors to this text for the
hard work, dedication, and timeliness that it takes to produce such a valuable
xxii ecaferP
contribution to the field. The chapters' authors are uniquely qualified to have
the best perspective on their respective areas and they have tried to convey that
in their work. Furthermore, the authors made a special effort to address their
area's shortcomings and potential for future work.
This book would not have been possible without the support of Graham
Hubler and Donald Gubser at then Naval Research Laboratory. We would like
to thank Bill Warren at DARPA for all his encouragement. Finally, we would
like to thank Gregory Franklin and Marsha Fillion at Academic Press for all
their help througout the preparation of this book.
otreblA ~uqiP
salguoD .B Chrisey
SROTUBIRTNOC
PAOLINA ATANASSOVA (55, 123), Superior MicroPowders, Albuquerque,
New Mexico 87019
PLAMEN ATANASSOV (55), Superior MicroPowders, Albuquerque, New
Mexico 87109
YAR AUYEUNG (517), Naval Research Laboratory, Materials Science and
Technology Division, Washington, D.C. 20375-5345
.R BASS (313), Naval Research Laboratory, Electronics Sciences and Technol-
ogy Division, Washington, D.C. 20375
NELSON .S BELL (229), Sandia National Laboratories, Albuquerque, New
Mexico 87185-1411
RIMPLE BHATIA (55), Superior MicroPowders, Albuquerque, New Mexico
87109
GEOFF L. BRENNECKA (229), Sandia National Laboratories, Albuquerque,
New Mexico 87185-1411
JAMES CARUSO (123), Superior MicroPowders, Albuquerque, New Mexico
87109
DOUGLAS .B CHRISEY (1, 385), Naval Research Laboratory, Materials
Science and Technology Division, Washington, D.C. 20375-5345
C. PAUL CHRISTENSEN (385), Potomac Photonics, Inc., Lanham, Maryland
20706
xxiii
xxiv srotubirtnoC
PAUL G. CLEM (229), Sandia National Laboratories, Albuquerque, New
Mexico 87185-1411
.W ROYALL COX (177), MicroFab Technologies, Inc., Plano, Texas 75074
LINETTE .M DEMERS (303), Institute for Nanotechnology and Center for
Nanofabrication and Molecular Self-Assembly, Nortwestern University, Evan-
ston, Illinois
HUGH DENHAM (123), Superior MicroPowders, Albuquerque, New Mexico
87109
DUANE .B DIMOS (229), Sandia National Laboratories, Albuquerque, New
Mexico 87185-1411
KLAUS EDINGER (347), Institute for Research in Electronics and Applied
Physics, University of Maryland, College Park, Maryland 20742
MARCELINO ESSIEN (475), Optomec, Inc., Albuquerque, New Mexico
87109
JAMES M. FITZ-GERALD (517), Department of Materials Science and Engi-
neering, University of Virginia, Charlottesville, Virginia 22904-4745
C. FOTAKIS (493), Foundation for Research and Technology-Hellas
(FORTH), 17 110 Herklion, Crete, Greece
RICHARD GAMBINO (261), Center for Thermal Spray Research, State
University of New York, Stony Brook, New York 11794-2275
DANIEL GAMOTA (33), Motorola Advanced Technology Center, Schaum-
burg, Illinois 60196-1078
ROBERT GREENLAW (261), Integrated Coating Solutions, Inc., Huntington
Beach, California 92646
MARK HAMPDEN-SMITH (55, 123), Superior MicroPowders, Albuquerque,
New Mexico 87109
DONALD J. HAYES (177), MicroFab Technologies, Inc., Piano, Texas 75074
HENRY HELVAJIAN (415), Center for Microtechnology, The Aerospace
Corporation, Los Angeles, California 90009-295
HERBERT HERMAN (261), Center for Thermal Spray Research, State Univer-
sity of New York, Stony Brook, New York 11794-2275
SEUNGHUN HONG (303), Institute for Nanotechnology and Center for
Nanofabrication and Molecular Self-Assembly, Northwestern University, Evan-
ston, Illinois 60208
srotubirtnoC VXX
BRUCE .H KING (229,475), Optomec, Inc., Albuquerque, New Mexico 87109
TOIVO KODAS (55, 123), Superior MicroPowders, Albuquerque, New Mexico
87109
.G KOUNDOURAKIS (493), Foundation for Research and Technology-Hellas
(FORTH), 17 110 Herklion, Crete, Greece
KLAUS KUNZE (123), Superior MicroPowders, Albuquerque, New Mexico
87109
JON LONGTIN (261), Center for Thermal Spray Research, State University of
New York, Stony Brook, New York 11794-2275
GREG MARQUEZ (475), Optomec, Inc., Albuquerque, New Mexico 87109
C.R.K. MARRIAN (313), Defense Advanced Research Projects Agency, Elec-
tronics Technology Office, Arlington, Virginia 22203-171
.R ANDREW McGILL (93), Naval Research Laboratory, Materials Sciences and
Technology Division, Washington, D.C. 20375-5345
.W DOYLE MILLER (475), Optomec, Inc., Albuquerque, New Mexico 87109
CHAD .A MIRKIN (303), Institute for Nanotechnology and Center for
Nanofabrication and Molecular Self-Assembly, Northwestern University, Evan-
ston, Illinois 60208
ROHIT MODI (517), Department of Mechanical and Aerospace Engineering,
George Washington University, Washington, D.C. 20052
DAVID NAGEL (557), Department of Electrical and Chemical Engineering,
George Washington University, Washington, D.C. 20052
PAUL NAPOLITANO (55), Superior MicroPowders, Albuquerque, New
Mexico 87109
M.C. PECKERAR (313), Naval Research Laboratory, Electronics Sciences and
Technology Division, Washington, D.C. 20375-5345
ALBERTO PIQUI~ (1,385), Naval Research Laboratory, Materials Science and
Technology Division, Washington, D.C. 20375-5345
PHILIP .D RACK (517), Department of Materials Science and Engineering,
The University of Tennessee, Knoxville, Tennessee 37996-2200
MICHAEL J. RENN (475), Optomec, Inc., Albuquerque, New Mexico 87109
K.-W. RHEE (313), Naval Research Laboratory, Electronics Sciences and
Technology Division, Washington, D.C. 20375-5345
xxvi Contributors
BRADLEY RINGEISEN (93, 517), Naval Research Laboratory, Materials
Science and Technology Division, Washington, D.C. 20375-5345
YAJNAS SAMPATH (261), Center for Thermal Spray Research, State Univer-
sity of New York, Stony Brook, New York 11794-2275
ALEN SCHULT (123), Superior MicroPowders, Albuquerque, New Mexico
87109
JAMES SKINNER (33), Motorola Advanced Technology Center, Schaumburg,
Illinois 60196-1078
AARON STUMP (123), Superior MicroPowders, Albuquerque, New Mexico
87109
JOHN SZCZECH (33), Motorola Advanced Technology Center, Schaumburg,
Illinois 60196-1078
ELLEN TORMEY (261), Sarnoff Corporation, Princeton, New Jersey 08543
N.A. VAINOS (493), Foundation for Research and Technology-Hellas
(FORTH), 17 011 Herklion, Crete, Greece
KAREL VANHEUSDEN (123), Superior MicroPowders, Albuquerque, New
Mexico 87109
DAVID .B WALLACE (177), MicroFab Technologies, Inc., Plano, Texas 75074
WILLIAM .L WARREN (17), Defense Advanced Research Projects Agency,
Arlington, Virginia 22203-1714
WAD-YEUH WU (517), SFA, Inc., Largo, Maryland 20774
PETER .K WU (93), Southern Oregon University, Ashland, Oregon
DANIEL YOUNG (517), Naval Research Laboratory, Materials Science and
Technology Division, Washington, D.C. 20375-5320
IOANNA ZERGIOTI (493), Foundation for Research and Technology-Hellas
(FORTH), 17 011 Herklion, Crete, Greece
JIE ZHANG (33), Motorola Advanced Technology Center, Schaumburg,
Illinois 60196-1078
1
CHAPTER
Introduction to Direct-Write
Technologies for Rapid
Prototyping
SALGUOD B. YESIRHC DNA OTREBLA ~IUQIP
Naval Research Laboratory, Washington, D.C.
.1 Direct-Write Technologies
.2 Electronics
.3 Biomaterials
.4 Miscellaneous Application Areas
.5 Conclusions
1. DIRECT-WRITE TECHNOLOGIES
The ability to deposit and pattern different thin-film materials is inherent to the
fabrication of components and systems such as those found in electronic
devices, sensors, MEMS, etc. The trend toward miniaturization has been led by
developments in lithography techniques, equipment, and resists materials. But
with increased capabilities comes limited flexibility as well as increased
complexity, time, and cost. Today there remains, and will remain in the
future, applications for rapid prototyping thin film material patterns with
CAD/CAM capabilities. A wide range of different direct-write technologies is
being developed to satisfy this need. They differ in resolution, writing speed, 3-
D and multimaterial capabilities, operational environment (gas, pressure, and
temperature), and basically what kinds of final structures can be built. Direct-
write technologies do not compete with photolithography for size and scale,
but rather complement it for specific applications requiring rapid turnaround
and/or pattern iteration, for minimizing environmental impact, for conformal
patterning, or for prototyping and modeling difficult components, circuits,
subassemblies, etc. (1).
etirW-tceriD seigolonhceT for Rapid gnipytotorP snoitacilppA
Copyright (cid:14)9 2002 by Academic Press. All rights of reproduction in any form reserved.
noitcudortnI ot etirW-tceriD seigolonhceT rof dipaR gnipytotorP
The area of electronic components might be the greatest driver for the
development of new direct-write technologies and materials with special
emphasis on electronic material quality, writing speeds, and processing
temperatures. In particular, there is a strong need in industry for rapid
prototyping and "just in time methods" (JITM), materials, and tools to
direct write passive circuit elements on various substrates, especially in the
mesoscopic regime, that is, electronic devices that straddle the size range
between conventional microelectronics (sub-micron range) and traditional
surface-mount components (10-mm range). Integral passives and high-density
interconnects are important and listed on the National Electronics Manufac-
turing Initiative (NEMI) roadmap. The need is based, in part, on the desire to:
(1) rapidly fabricate prototype circuits without iterations in photolithographic
mask design, in an effort to iterate the performance on circuits too difficult to
accurately model; (2) reduce the size of PCBs and other structures (~ 30-50%
or more) by conformally incorporating passive circuit elements into the
structure; and (3) fabricate parts of electronic circuits by methods that
occupy a smaller production scale footprint, that are CAD/CAM compatible,
and that can be operated by unskilled personnel or totally controlled from the
designer's computer to the working prototype. The savings in time is especially
critical to the quick-changing electronics market of today. The novel direct-
write approaches described in this book will contribute to new capabilities
satisfying next-generation applications in the mesoscopic regime.
There is no single book that summarizes the different direct-write technol-
ogies available and emerging today. This is due, in part, to the advances made
only recently in the different approaches in this field, such as ink jet printing,
laser forward transfer techniques, laser chemical vapor deposition (LCVD),
matrix-assisted pulsed-laser evaporation direct write (MAPLE-DW), and
Micropen (2). As an example of the relevance of these technologies, it is
useful to consider the size of a few markets on which direct-write tools are
expected to have an impact. For example, the development of the next
generation of sensors for medical applications hinges on the ability to further
miniaturize their size as well as tailor their response to controllably varying
analytes. The market for biomedical sensors exceeds several billion dollars. In
the area of electronic devices and systems, direct-write technologies could play
a pivotal role in such markets as Smart Cards, with a global sales
exceeding a billion dollars. The development of new multilayer circuit board
assemblies, where current technologies are reaching global sales of 30 billion
dollars, will also be improved. These examples do not take into consideration
the potential for new opportunities and further growth that a new technology,
such as direct write, would offer, in which case the market size will grow faster.
The goal of this book is to provide a platform to introduce ideas and
approaches that are fundamental to direct-write technologies, to present in a